Patents by Inventor Eberhard HAISS

Eberhard HAISS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component having a molded component housing
    Patent number: 9408319
    Abstract: An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: August 2, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Eberhard Haiss, Martin Rojahn, Matthias Taglieber, Thomas Schrimpf, Matthias Ludwig, Andreas Blum
  • ELECTRONIC COMPONENT HAVING A MOLDED COMPONENT HOUSING
    Publication number: 20140158420
    Abstract: An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 12, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Eberhard HAISS, Martin ROJAHN, Matthias TAGLIEBER, Thomas SCHRIMPF, Matthias LUDWIG, Andreas BLUM