Patents by Inventor Edmund D. Blackshear
Edmund D. Blackshear has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10813215Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.Type: GrantFiled: March 14, 2016Date of Patent: October 20, 2020Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, KYOCERA CIRCUIT SOLUTIONS INC.Inventors: Jean Audet, Edmund D. Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada
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Patent number: 10806030Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.Type: GrantFiled: January 15, 2015Date of Patent: October 13, 2020Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, KYOCERA CIRCUIT SOLUTIONS INC.Inventors: Jean Audet, Edmund D. Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada
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Patent number: 10687420Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.Type: GrantFiled: March 14, 2016Date of Patent: June 16, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jean Audet, Edmund D. Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada
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Patent number: 10598860Abstract: A photonic integrated circuit (PIC) fan-out package and related methods of forming same are disclosed. The PIC fan-out package includes: an overmold body; a PIC die in the overmold body, the PIC die including electro-optic circuitry; a plurality of optical fiber stubs operatively coupled to the electro-optic circuitry; an edge fiber coupling interface in a lateral side of the overmold body for coupling the plurality of optical fiber stubs to external optical fibers using a connector; an ancillary device in the overmold body; a redistribution wiring layer (RDL) interposer adjacent the overmold body and electrically connected to the PIC die and the ancillary device; and a ball grid array (BGA) electrically coupled to the PIC die and the ancillary device by the RDL interposer, the BGA configured to electrically couple the PIC die and the ancillary device to a printed circuit board (PCB).Type: GrantFiled: March 14, 2018Date of Patent: March 24, 2020Assignee: GLOBALFOUNDRIES INC.Inventors: Koushik Ramachandran, Benjamin V. Fasano, Edmund D. Blackshear
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Publication number: 20190285804Abstract: A photonic integrated circuit (PIC) fan-out package and related methods of forming same are disclosed. The PIC fan-out package includes: an overmold body; a PIC die in the overmold body, the PIC die including electro-optic circuitry; a plurality of optical fiber stubs operatively coupled to the electro-optic circuitry; an edge fiber coupling interface in a lateral side of the overmold body for coupling the plurality of optical fiber stubs to external optical fibers using a connector; an ancillary device in the overmold body; a redistribution wiring layer (RDL) interposer adjacent the overmold body and electrically connected to the PIC die and the ancillary device; and a ball grid array (BGA) electrically coupled to the PIC die and the ancillary device by the RDL interposer, the BGA configured to electrically couple the PIC die and the ancillary device to a printed circuit board (PCB).Type: ApplicationFiled: March 14, 2018Publication date: September 19, 2019Inventors: Koushik Ramachandran, Benjamin V. Fasano, Edmund D. Blackshear
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Publication number: 20160210398Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.Type: ApplicationFiled: March 14, 2016Publication date: July 21, 2016Applicant: Kyocera Circuit Solutions Inc.Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
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Publication number: 20160211229Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.Type: ApplicationFiled: March 14, 2016Publication date: July 21, 2016Applicant: Kyocera Circuit Solutions Inc.Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
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Publication number: 20160211481Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.Type: ApplicationFiled: January 15, 2015Publication date: July 21, 2016Applicant: KYOCERA CIRCUIT SOLUTIONS INC.Inventors: Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA, Tomoyuki YAMADA
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Patent number: 9129942Abstract: A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics over a range of temperatures. The laminate substrate is placed into a shaping fixture with any necessary correction to obtain a flat laminate substrate chip site area at a chip join temperature. The laminate substrate is shaped at a temperature greater than or equal to a maximum laminate substrate fabrication temperature. The shape of the laminate substrate is retained when it is removed from the shaping fixture.Type: GrantFiled: June 5, 2012Date of Patent: September 8, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Edmund D. Blackshear
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Patent number: 9059240Abstract: A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.Type: GrantFiled: June 5, 2012Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: Edmund D. Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Publication number: 20130320578Abstract: A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics over a range of temperatures. The laminate substrate is placed into a shaping fixture with any necessary correction to obtain a flat laminate substrate chip site area at a chip join temperature. The laminate substrate is shaped at a temperature greater than or equal to a maximum laminate substrate fabrication temperature. The shape of the laminate substrate is retained when it is removed from the shaping fixture.Type: ApplicationFiled: June 5, 2012Publication date: December 5, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Edmund D. Blackshear
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Publication number: 20130323345Abstract: A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.Type: ApplicationFiled: June 5, 2012Publication date: December 5, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Edmund D. Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Publication number: 20100164030Abstract: Embodiments of the present invention provide a system and method for manufacturing integrated circuit (IC) chip packages. In one embodiment, the integrated circuit (IC) chip package can include an IC chip and a substrate coupled to the IC chip. The substrate can include a glass fiber re-enforced epoxy core, a plurality copper circuitry containing particle re-enforced epoxy layers symmetrically-oriented to each surface of the glass fiber re-enforced epoxy core, and an outermost amorphous glass layer on each surface of the plurality of layers. The IC chip can be coupled to copper circuitry bonded to one of the outermost amorphous glass layers.Type: ApplicationFiled: December 31, 2008Publication date: July 1, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stefano S. Oggioni, Edmund D. Blackshear, Claudius Feger
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Publication number: 20090294971Abstract: A structure comprises: a substrate; at least one conductor on the substrate; at least one contact pad on the substrate; a mask over the conductor (wherein the mask comprises an opening over the contact pad and wherein the mask comprises a bottom surface contacting the substrate and a top surface opposite the bottom surface); and a contact pad plating layer on the contact pad and within the opening of the mask. The contact pad plating layer comprises a bottom surface contacting the contact pad and a top surface opposite the bottom surface, and the top surface of the contact pad plating layer is coplanar with the top surface of the mask.Type: ApplicationFiled: June 2, 2008Publication date: December 3, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Edmund D. BLACKSHEAR, David J. RUSSELL, Kevin A. DORE
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Patent number: 7095104Abstract: An approach to DRAM memory chip packaging leveraging the chip center position for wire bond pads to minimize time-of-flight and impedance effects resulting from stacking in a BGA application. A top layer of a dual device stack of center bus chips is stacked with an offset in a single direction with respect to a bottom layer of the dual device stack. The top layer of chips may be wire bonded to the opposite side of the module substrate. The center bus may be made to traverse to the substrate between two memory devices on the lower layer. To assemble the offset stacking devices into a high density module, devices are placed sequentially on a module substrate such that approximately one half of the protruding lower memory device is used as a support for the overhanging upper memory device chip of the next device stack.Type: GrantFiled: November 21, 2003Date of Patent: August 22, 2006Assignee: International Business Machines CorporationInventor: Edmund D Blackshear
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Patent number: 6774475Abstract: A method and structure for a memory structure that includes a plurality of substrates stacked one on another is disclosed. The invention includes a plurality of connectors connecting the substrates to one another and a plurality of memory chip packages mounted on the substrates. The connectors have a size sufficient to form a gap between the substrates. The gap is larger than a height of the memory chip packages.Type: GrantFiled: January 24, 2002Date of Patent: August 10, 2004Assignee: International Business Machines CorporationInventors: Edmund D. Blackshear, William F. Beausoleil, N. James Tomassetti
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Publication number: 20030137041Abstract: A method and structure for a memory structure that includes a plurality of substrates stacked one on another is disclosed. The invention includes a plurality of connectors connecting the substrates to one another and a plurality of memory chip packages mounted on the substrates. The connectors have a size sufficient to form a gap between the substrates. The gap is larger than a height of the memory chip packages.Type: ApplicationFiled: January 24, 2002Publication date: July 24, 2003Applicant: International Business Machines CorporationInventors: Edmund D. Blackshear, William F. Beausoleil, N. James Tomassetti
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Patent number: 6507122Abstract: An integrated circuit chip package wherein the chip is encapsulated prior to mechanical bonding to a packaging substrate. The package provides a continuous adhesive interface between the encapsulated chip and surrounding encapsulant, and the substrate. This structure eliminates discontinuities in flatness and their associated stress states resulting in more reliable package contacts.Type: GrantFiled: July 16, 2001Date of Patent: January 14, 2003Assignee: International Business Machines CorporationInventor: Edmund D. Blackshear
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Patent number: 6469375Abstract: A three-dimensional memory module in a repetitively used pedestal connector provides signal paths unique and common to the module at its level and signal paths from the level below unique to and common to modules at levels above. In order to provide a unique signal path from a substrate to each memory module, while using identical pedestal connectors at each level, signal lines are skewed from where they enter the bottom surface of the pedestal connector to where they exit the top surface. For example, each input in a line of inputs is connected to a matching line of outputs, but with a shift of one position between input and output.Type: GrantFiled: February 28, 2001Date of Patent: October 22, 2002Inventors: William F. Beausoleil, Edmund D. Blackshear, Michael J. Ellsworth, Jr., William F. Shutler, Norton J. Tomassetti
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Publication number: 20020117741Abstract: A three-dimensional memory module in a repetitively used pedestal connector provides signal paths unique and common to the module at its level and signal paths from the level below unique to and common to modules at levels above. In order to provide a unique signal path from a substrate to each memory module, while using identical pedestal connectors at each level, signal lines are skewed from where they enter the bottom surface of the pedestal connector to where they exit the top surface. For example, each input in a line of inputs is connected to a matching line of outputs, but with a shift of one position between input and output.Type: ApplicationFiled: February 28, 2001Publication date: August 29, 2002Inventors: William F. Beausoleil, Edmund D. Blackshear, Michael J. Ellsworth, William F. Shutler, Norton J. Tomassetti