Abstract: A thermal battery assembly may include a thermal battery that includes a housing and a plurality of internal pins extending therefrom. The thermal battery assembly may also include an enclosure surrounding the housing in spaced relation therefrom and maintaining a vacuum therebetween and a connection header. The connection header may include a flange coupled to said enclosure, at least one dielectric body coupled to the flange, and external pins extending through the at least one dielectric body. Each external pin may be coupled to a corresponding internal pin along a path having at least one bend therein to accommodate relative movement between the housing and the enclosure.

Abstract: A thermal battery assembly may include a thermal battery that includes a housing and a plurality of internal pins extending therefrom. The thermal battery assembly may also include an enclosure surrounding the housing in spaced relation therefrom and maintaining a vacuum therebetween and a connection header. The connection header may include a flange coupled to said enclosure, at least one dielectric body coupled to the flange, and external pins extending through the at least one dielectric body. Each external pin may be coupled to a corresponding internal pin along a path having at least one bend therein to accommodate relative movement between the housing and the enclosure.

Abstract: An electronic device may include electronic circuitry and a housing carrying the electronic circuitry. The housing may include first and second metallic housing members having opposing first and second mating surfaces respectively defining a projection and a corresponding recess. The projection may be spaced inwardly from a perimeter of the first housing member, and the recess may be spaced inwardly from a perimeter of the second housing member. The electronic device may further include a gasket between the opposing first and second mating surfaces and extending outwardly to perimeters of the first and second mating surfaces. The gasket may include indium.

Abstract: An electronic device may include electronic circuitry and a housing carrying the electronic circuitry. The housing may include first and second metallic housing members having opposing first and second mating surfaces respectively defining a projection and a corresponding recess. The projection may be spaced inwardly from a perimeter of the first housing member, and the recess may be spaced inwardly from a perimeter of the second housing member. The electronic device may further include a gasket between the opposing first and second mating surfaces and extending outwardly to perimeters of the first and second mating surfaces. The gasket may include indium.

Abstract: An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RF feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality of displaceable protrusions may define an enlarged upper portion thereof engaging adjacent upper portions of the housing. The RF feedthrough connector may also include a sealed joint between the housing and the RF feedthrough connector.

Abstract: An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE.

Abstract: An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE.

Abstract: A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.

Abstract: An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RE feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality of displaceable protrusions may define an enlarged upper portion thereof engaging adjacent upper portions of the housing. The RF feedthrough connector may also include a sealed joint between the housing and the RF feedthrough connector.

Abstract: An improved feed-through RF connector uses structural materials with coefficients of thermal expansion selected to enhance the reliability of a hermetic seal. The design of the connector and the selection of materials facilitate easy installation and help avoid cyclic fatigue and cracks that could result in a loss of hermetic seal.

Abstract: An RF feed-through connector has a single pin or multi-pins supported and hermetically sealed between a first portion of the connector facing the hermetically sealed interior portion of an electronics-containing housing and a second portion of the connector exposed to ambient conditions in which the electronics-containing housing is placed. The invention is particularly directed to a new hermetically sealed RF feed-through connector architecture in which the connector's outer shell contains a relatively low coefficient of thermal expansion (CTE) portion that enables it to be soldered to a low CTE insert that supports one or more hermetically sealed longitudinal signal pins. The connector's outer shell also includes a relatively high CTE portion that allows the shell to be readily joined as by welding to an adjacent support structure, such as a relatively high CTE aluminum housing and the like.

Abstract: A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.

Abstract: An RF feed-through connector has a single pin or multi-pins supported and hermetically sealed between a first portion of the connector facing the hermetically sealed interior portion of an electronics-containing housing and a second portion of the connector exposed to ambient conditions in which the electronics-containing housing is placed. The invention is particularly directed to a new hermetically sealed RF feed-through connector architecture in which the connector's outer shell contains a relatively low coefficient of thermal expansion (CTE) portion that enables it to be soldered to a low CTE insert that supports one or more hermetically sealed longitudinal signal pins. The connector's outer shell also includes a relatively high CTE portion that allows the shell to be readily joined as by welding to an adjacent support structure, such as a relatively high CTE aluminum housing and the like.

Abstract: An RF feed-through connector has a single pin or multi-pins supported and hermetically sealed between a first portion of the connector facing the hermetically sealed interior portion of an electronics-containing housing and a second portion of the connector exposed to ambient conditions in which the electronics-containing housing is placed. The invention is particularly directed to a new hermetically sealed RF feed-through connector architecture in which the connector's outer shell contains a relatively low coefficient of thermal expansion (CTE) portion that enables it to be soldered to a low CTE insert that supports one or more hermetically sealed longitudinal signal pins. The connector's outer shell also includes a relatively high CTE portion that allows the shell to be readily joined as by welding to an adjacent support structure, such as a relatively high CTE aluminum housing and the like.

Abstract: A hermetically sealed connector comprises an outer metallic shell having an aperture that receives a multipin-retaining, multi-metallic insert. The insert is a laminate of dissimilar metals, including a first metal extending to a first side of the insert and having a first coefficient of thermal expansion (CTE), and a second metal extending to a second side of the insert and having a second CTE different that the first CTE. A plurality of bores extend between first and second sides of the insert and contain connector pins that are hermetically sealed with the first metal of the insert by a dielectric material formed between the pins and sidewalls of the bores. A bond joint is formed between the second metal of the insert and the side of the outer metallic shell adjacent to the second side of the metallic insert.