Patents by Inventor Edward Fu

Edward Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6809626
    Abstract: An over-current protection device comprises a positive temperature coefficient material layer, an upper electrode foil, a lower electrode foil, a first metal terminal layer, a second metal terminal layer and at least one insulating layer. The upper electrode foil is disposed on the upper surface of the positive temperature coefficient material layer, and the lower electrode foil is disposed on the lower surface of the positive temperature coefficient material layer. The first metal terminal layer electrically connects the upper electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole, and the second metal terminal layer electrically connects the lower electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole. The insulating layer isolates the upper electrode foil from the second metal terminal layer and the lower electrode foil from the first metal terminal layer.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: October 26, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6806519
    Abstract: The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: October 19, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6794980
    Abstract: The present invention discloses an over-current protection apparatus, comprising a current-sensitive element, a first electrode and a second electrode. The over-current protection apparatus of the present invention is a three-dimensional multi-layer structure, and can be formed by heating, pressing, etching, cutting and multi-stage deformation to prevent it from breakage during the bending process. Therefore, the over-current protection apparatus with at least one bend is formed.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: September 21, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20040022001
    Abstract: An over-current protection device comprises a positive temperature coefficient material layer, an upper electrode foil, a lower electrode foil, a first metal terminal layer, a second metal terminal layer and at least one insulating layer. The upper electrode foil is disposed on the upper surface of the positive temperature coefficient material layer, and the lower electrode foil is disposed on the lower surface of the positive temperature coefficient material layer. The first metal terminal layer electrically connects the upper electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole, and the second metal terminal layer electrically connects the lower electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole. The insulating layer isolates the upper electrode foil from the second metal terminal layer and the lower electrode foil from the first metal terminal layer.
    Type: Application
    Filed: July 8, 2003
    Publication date: February 5, 2004
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20040008465
    Abstract: The over-current protection device of the present invention uses the unbalanced properties of the thermal expansion coefficients between the outer and inner sides for an upper metallic conductive sheet and a lower metallic conductive sheet to generate a torque to deform outwardly. The torque is used to pull a current-sensing element and present with at least a cracking face, so as to introduce an electrically open effect similar to a fuse. Thus, the present invention can achieve the object for preventing the danger of circuit system by the short circuit during the burning of over-current protection device.
    Type: Application
    Filed: July 8, 2003
    Publication date: January 15, 2004
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6665164
    Abstract: The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: December 16, 2003
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030121141
    Abstract: The present invention discloses a manufacturing method of an over-current protection device, characterized in that the PTC plaque is conducted by punching under frozen state to form the over-current protection devices so as to reduce the heating and temperature rising in the PTC plaque due to punching and temperature difference between the metal foil and the conductive composite material. Relatively, the deformation and stress of the over-current protection device caused by punching will also be reduced. Therefore, there is no need for additional process to increase the temperature sensitivity and electrical property stability of the over-current protection device.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 3, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Chih-Ming Yu
  • Publication number: 20030111648
    Abstract: The present invention discloses a conductive composition, comprising: (a) at least one polymer; (b) at least one conductive filler, dispersed in the polymer; and (c) a coupling agent, applied to improved the adhesion between the polymer and the conductive filler and having a structure as follows: 1
    Type: Application
    Filed: February 25, 2002
    Publication date: June 19, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030099077
    Abstract: The invention discloses a multi-layer structure of the battery protection device, which uses a plurality of over-current protection modules connected in parallel to reduce the normal resistance value. The polypropylene, glass fiber or other harder materials are appended among the plurality of over-current protection modules. Therefore, even if the over-current protection is burned out due to improper use, the short circuit of the metal conductive sheet connecting to the positive and negative poles of the battery can be avoided.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 29, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030090855
    Abstract: The present invention discloses an over-current protection device and the apparatus thereof. The over-current protection device includes a first electrode foil, a second electrode foil and a plurality of polymer current-sensing elements, wherein the plurality of polymer current-sensing elements are formed by stacking and electrical connection in series. The first and second electrode foils are disposed on the corresponding surface of the plurality of polymer current-sensing elements, and the difference in the transition temperature between adjacent polymer current-sensing elements is at least 5° C.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 15, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030086221
    Abstract: The present invention discloses an over-current protection apparatus for high voltage, which connects the ceramic current-sensing element and polymer current-sensing element in series to form a novel over-current protection apparatus. By the characteristic of the polymer current-sensing element having higher switching off speed, the invention first responds to the over-current by raising its temperature, and then the heat is thermally conducted through the adhesive layer to the ceramic current-sensing element, resulting in a voltage drop produced by the over-current partially or predominantly received by the ceramic current-sensing element. Thus, the over-current protection device of the invention not only can endure high voltage (>600V), but also will not exhibit a negative temperature coefficient phenomenon.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 8, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030076643
    Abstract: The present invention discloses an over-current protection device comprising at least one resistance component, outer conductive members and at least one insulation layer. The resistance component includes a current sensing element, a first conductive member and a second conductive member. The first conductive member is located on the surface of the current sensing element. The second conductive member is located on the other surface of the current sensing element. The resistance components that are adjacent use conductive buried holes to electrically connect their first conductive members and their second conductive member. The outer conductive member includes a first conductive end and a second conductive end.
    Type: Application
    Filed: October 22, 2002
    Publication date: April 24, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030067729
    Abstract: The present invention discloses an over-current protection apparatus, comprising a current-sensitive element, a first electrode and a second electrode. The over-current protection apparatus of the present invention is a three-dimensional multi-layer structure, and can be formed by heating, pressing, etching, cutting and multi-stage deformation to prevent it from breakage during the bending process. Therefore, the over-current protection apparatus with at least one bend is formed.
    Type: Application
    Filed: October 7, 2002
    Publication date: April 10, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20030067054
    Abstract: The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.
    Type: Application
    Filed: October 7, 2002
    Publication date: April 10, 2003
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6487084
    Abstract: A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: November 26, 2002
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, Yun-Ching Ma, David Shau-Chew Wang
  • Publication number: 20020170747
    Abstract: The present invention discloses a PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.
    Type: Application
    Filed: February 5, 2002
    Publication date: November 21, 2002
    Inventors: Edward Fu-Hua Chu, Yun-Ching Ma, David Shau-Chew Wang
  • Publication number: 20020135985
    Abstract: The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.
    Type: Application
    Filed: March 19, 2002
    Publication date: September 26, 2002
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 5817319
    Abstract: A free-flowing, non-dusting water dispersible granule of an active agricultural chemical having low friability and effective crush strength for delivery to a desired site as a stable suspension in water, without deleterious foaming, which granule includes about 1-25% by weight thereof of a binder which is a copolymer of (a) polyvinylpyrrolidone and (b) a comonomer selected from a C.sub.4 -C.sub.30 alkene and vinyl acetate, and mixtures thereof.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: October 6, 1998
    Assignee: ISP Investments Inc.
    Inventors: Edward Fu, Ratan K. Chaudhuri, Kolazi S. Narayanan
  • Patent number: 5629261
    Abstract: A free-flowing, non-dusting water dispersible granule (WDG) of a water-insoluble, hydrophobic agriculturally active chemical having low friability and superior crush strength for delivery to a desired site as a stable, rainfast suspension in water, without foaming.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: May 13, 1997
    Assignee: ISP Investments Inc.
    Inventors: Kolazi S. Narayanan, Edward Fu
  • Patent number: 5464627
    Abstract: An extrudible, wet paste composition of an agriculturally active chemical is provided herein which is used for forming water-dispersible or water-soluble granules thereof. These granules form stable suspensions or solutions in water which provide efficient delivery systems for such agricultural chemicals.
    Type: Grant
    Filed: November 10, 1993
    Date of Patent: November 7, 1995
    Assignee: ISP Investments Inc.
    Inventors: Edward Fu, Kolazi S. Narayanan