Patents by Inventor Eiji HOSOKAWA

Eiji HOSOKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor device having adhesive between sensor portion and casing portion
    Patent number: 10928263
    Abstract: A sensor device including: a sensor portion; a casing portion housing the sensor portion; an elastic portion that is provided in contact with the casing portion between the sensor portion and the casing portion and has a material having smaller elastic modulus than elastic modulus of the casing portion; and an adhesive that is provided between the sensor portion and the casing portion is provided. The adhesive may have an interface between the elastic portion and the adhesive. The elastic portion may have the same material as the adhesive. The elastic portion may have smaller elastic modulus than the adhesive.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: February 23, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Eiji Hosokawa
  • SENSOR DEVICE
    Publication number: 20190285498
    Abstract: A sensor device including: a sensor portion; a casing portion housing the sensor portion; an elastic portion that is provided in contact with the casing portion between the sensor portion and the casing portion and has a material having smaller elastic modulus than elastic modulus of the casing portion; and an adhesive that is provided between the sensor portion and the casing portion is provided. The adhesive may have an interface between the elastic portion and the adhesive. The elastic portion may have the same material as the adhesive. The elastic portion may have smaller elastic modulus than the adhesive.
    Type: Application
    Filed: January 25, 2019
    Publication date: September 19, 2019
    Inventor: Eiji HOSOKAWA