Abstract: Configuration, in which images output to a display unit are switched and displayed in accordance with the behavior of a driver, such as movements of the head of the driver, is achieved. Driver information indicating the behavior of the driver of a moving apparatus and images captured by a plurality of cameras that images a situation around the moving apparatus from different viewpoints are input. The images output to the display unit are switched in accordance with the driver information. The plurality of cameras is, for example, a plurality of rear cameras installed in the rear of the moving apparatus. For example, a direction of the face or line-of-sight of the driver is detected. An image in a direction corresponding to the detected direction of the face or line-of-sight of the driver is selected as an output image, and displayed on the display unit. Alternatively, an image in a direction indicated by a gesture of the driver is selected, and displayed on the display unit.

Abstract: In a method for producing hydrogen and carboxylic acid, a primary alcohol of 1 to 7 carbon atoms and water are reacted by being continuously introduced into a flow reactor packed with a solid catalyst consisting of an alloy of ruthenium and tin on a support and passed through the reactor under temperature and pressure conditions at which the water assumes a gaseous state. This method enables hydrogen and carboxylic acid to be produced in a high yield or at a high purity from a primary alcohol and water in a short time and by simple operations.

Abstract: An object of the present invention is to provide a virtual image display optical system that is capable of substantially simultaneously displaying virtual images at a plurality of distances even with a simple configuration, and an image display device using the virtual image display optical system. A virtual image display optical system (30) according to the present invention is provided with: a display element (11); a projection optical system (15) that enlarges an image formed on the display element (11); a diffusing screen (16) that has a diffusing function, and is positioned on the light emission side of the projection optical system (15); and a virtual image forming optical system (17) that converts an image on the diffusing screen (16) into a virtual image, wherein the virtual image display optical system (30) is further provided with a positioning changing device (62) that changes a position of the diffusing screen (16).

Abstract: A screen for a head-up display device includes a main body layer sandwiched between a first concave optical surface located at an observation side and a second convex optical surface located at a side opposite to the observation side. A thickness of the main body layer becomes thinner from a center toward a periphery with regard to a lateral direction which is perpendicular to a reference plane, and a variation of the thickness of the main body layer with regard to a vertical direction parallel to the reference plane is different between the central part center and the peripheral part periphery with regard to the lateral direction.

Abstract: An object of the present invention is to provide a virtual image display optical system that is capable of substantially simultaneously displaying virtual images at a plurality of distances even with a simple configuration, and an image display device using the virtual image display optical system. A virtual image display optical system (30) according to the present invention is provided with: a display element (11); a projection optical system (15) that enlarges an image formed on the display element (11); a diffusing screen (16) that has a diffusing function, and is positioned on the light emission side of the projection optical system (15); and a virtual image forming optical system (17) that converts an image on the diffusing screen (16) into a virtual image, wherein the virtual image display optical system (30) is further provided with a positioning changing device (62) that changes a position of the diffusing screen (16).

Abstract: A screen for a head-up display device includes a main body layer sandwiched between a first concave optical surface located at an observation side and a second convex optical surface located at a side opposite to the observation side. A thickness of the main body layer becomes thinner from a center toward a periphery with regard to a lateral direction which is perpendicular to a reference plane, and a variation of the thickness of the main body layer with regard to a vertical direction parallel to the reference plane is different between the central part center and the peripheral part periphery with regard to the lateral direction.

Abstract: A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.

Abstract: A battery pack temperature regulating apparatus includes an evaporator configured to cool air inside a battery casing receiving a battery used for driving a vehicle; an evaporator casing receiving the evaporator; and a heater attached to the evaporator casing and configured to heat the air inside the battery casing.

Abstract: A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.

Abstract: A pressing unit including a pressing pin is attached to a mold, a semiconductor chip, first and second heat sinks, and solders are disposed in a cavity of the mold, a mold closing state is made, and a reflow is carried out in a state where the first and second heat sinks are pressed against first and second wall surfaces by the pressing pin to form a laminated body. After the laminated body is formed, the pressing pin is pulled out from the cavity, and a resin molded body is formed by injecting a resin.

Abstract: An oral preparation for the prophylaxis or treatment of a disease with infection by a pathogen, containing a killed lactic acid bacterium expressing, on the surface, an antigen of the pathogen, or a microparticulated form thereof, which has an average particle size of 2.68-30 ?m. An oral preparation for inducing cellular immunity to a target antigen, containing a killed lactic acid bacterium expressing the target antigen on the surface or a microparticulated form thereof, which has a particle size of 2.68-30 ?m.

Abstract: A battery pack temperature regulating apparatus includes an evaporator configured to cool air inside a battery casing receiving a battery used for driving a vehicle; an evaporator casing receiving the evaporator; and a heater attached to the evaporator casing and configured to heat the air inside the battery casing.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: An air-conditioning system of an electric car has an air-conditioning unit which is configured to perform air-conditioning in a passenger compartment by heater/cooler operation, a setting panel configured to set a target temperature of the passenger compartment, and a control unit which is connected to the air-conditioning unit and setting panel, and has different control of heater operation of the air-conditioning unit, wherein the control unit is configured to select controls of heater operation based on a vehicle speed v.