Abstract: Provided is a method for inspecting a heat sink that enables an accurate inspection of an insulating film formed on a surface of heat sink fins. The method including a metallic housing that includes a plurality of cooling fins arranged side by side on an outer surface thereof, and an insulating film formed on a surface of the cooling fins and between the cooling fins. The method includes disposing, in an electrolyte solution, an inspection electrode including a plurality of electrode fins insertable between the cooling fins to face the housing with a predetermined distance therebetween in such a way that the cooling fins and the electrode fins are alternately arranged; and applying a voltage between the housing and the inspection electrode, which are arranged to face each other, and inspecting a formation state of the insulating film based on a measured value of a current.

Abstract: Provided is a method for inspecting a heat sink that enables an accurate inspection of an insulating film formed on a surface of heat sink fins. The method including a metallic housing that includes a plurality of cooling fins arranged side by side on an outer surface thereof, and an insulating film formed on a surface of the cooling fins and between the cooling fins. The method includes disposing, in an electrolyte solution, an inspection electrode including a plurality of electrode fins insertable between the cooling fins to face the housing with a predetermined distance therebetween in such a way that the cooling fins and the electrode fins are alternately arranged; and applying a voltage between the housing and the inspection electrode, which are arranged to face each other, and inspecting a formation state of the insulating film based on a measured value of a current.

Abstract: A semiconductor device includes: a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion.

Abstract: A semiconductor device includes: a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion.

Abstract: In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions formed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Abstract: A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: A method of manufacturing a flat type heat pipe, having an inside of which partitioned into a plurality of cells, that is capable of flexibly setting a concentration of working fluid in each cell is provided. The method includes processes of preparing a flat container, pouring, and closing. In the preparing, the flat container having the inside of which two-dimensionally partitioned into the plurality of cells is prepared. The flat container has connecting holes through which adjacent cells communicate and an inlet hole for the working fluid to be poured from outside. In the pouring, the working fluid is poured into respective cells through the inlet hole and the connecting holes. In the closing, the inlet hole and the connecting holes are closed. In one method, after sealing a specified cell, following processes of heating, removing air, pouring, evaporating, and closing are repeated for other cells.

Abstract: In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions ormed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Abstract: A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Abstract: A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.

Abstract: A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements) are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: A heat exchanger having a fin member which can be easily formed by extrusion molding and warps (bends) less and configured such that an occurrence of voids at a weld portion between the fin member and a frame is suppressed. A method of manufacturing the heat exchanger is also provided. A heat exchanger has, mounted inside a frame forming an outer frame, a fin member having fins for forming flow channels for a refrigerant. The fin member is an integrally formed fin member formed by extrusion molding and is provided with a base formed in a rectangular flat plate-like shape, front side fins projecting from the front side of the base, and back side fins projecting from the back side of the base. In the fin member, the front side and the back side are not welded to the frame but the front ends of at least either the front side fins or the back side fins are welded to the frame.

Abstract: A flexible shaft structure comprises: a core wire having flexibility; holding portions provided on the core wire; a first wire wound around the core wire substantially at right angles with respect to an axial line of the core wire; and a second wire which is spirally wound around the first wire and of which both ends are respectively fixed to the holding portions. Accordingly, when an input-side holding portion rotates about a shaft, the rotational torque is transmitted to an output-side holding portion by the second wire. In this case, since the second wire is wound around the first wire wound around the core wire, the winding diameter of the second wire for transmitting rotational torque can be enlarged. As a result, tensile force acting on the second wire becomes smaller and stress acting on the core wire via the first wire or the holding portions accordingly becomes smaller.