Abstract: A semiconductor wafer forms on a mold containing a dopant. The dopant dopes a melt region adjacent the mold. There, dopant concentration is higher than in the melt bulk. A wafer starts solidifying. Dopant diffuses poorly in solid semiconductor. After a wafer starts solidifying, dopant can not enter the melt. Afterwards, the concentration of dopant in the melt adjacent the wafer surface is less than what was present where the wafer began to form. New wafer regions grow from a melt region whose dopant concentration lessens over time. This establishes a dopant gradient in the wafer, with higher concentration adjacent the mold. The gradient can be tailored. A gradient gives rise to a field that can function as a drift or back surface field. Solar collectors can have open grid conductors and better optical reflectors on the back surface, made possible by the intrinsic back surface field.

Abstract: A system for de-powdering one or more objects within a powder print bed comprises a build box configured to contain the powder print bed, and a de-powdering subsystem configured to engage the build box. The de-powdering subsystem comprises a vacuum device configured to withdraw loose powder agitated by the air jet device, and a robotic arm configured to convey the vacuum device to one or more locations on the powder print bed. The system may further comprise an air jet device disposed on the robotic arm, the air jet device configured to agitate, with a jet of air, unbound powder within the powder print bed. The system may further comprise a mechanical agitation instrument configured to facilitate agitation of the unbound powder within the powder print bed. The mechanical agitation instrument may be used in conjunction with one or both of the vacuum device and the air jet device.

Abstract: A semiconductor wafer forms on a mold containing a dopant. The dopant dopes a melt region adjacent the mold. There, dopant concentration is higher than in the melt bulk. A wafer starts solidifying. Dopant diffuses poorly in solid semiconductor. After a wafer starts solidifying, dopant cannot enter the melt. Afterwards, the concentration of dopant in the melt adjacent the wafer surface is less than what was present where the wafer began to form. New wafer regions grow from a melt region whose dopant concentration lessens over time. This establishes a dopant gradient in the wafer, with higher concentration adjacent the mold. The gradient can be tailored. A gradient gives rise to a field that can function as a drift or back surface field. Solar collectors can have open grid conductors and better optical reflectors on the back surface, made possible by the intrinsic back surface field.

Abstract: A system for separating objects within a stacked powder print bed of nested objects comprises a build box configured to contain the powder print bed. The build box has a build box top and a build box floor. The system further includes an elongated aperture formed in a side wall of the build box, and a de-powdering subsystem configured to mechanically and electrically engage the build box. A separating blade associated with the de-powdering subsystem is configured to be inserted through the elongated aperture and into the powder print bed between a top-most print bed layer of the nested objects and a second print bed layer directly below and contiguous with the top-most layer, thereby forming an isolated powder print bed between the separating blade and the build box top. The unbound powder may be agitated by various techniques and subsequently removed from the objects.

Abstract: Embodiments related to systems and methods of crack detection in wafers (e.g., silicon wafers for photovoltaics, photovoltaic devices including silicon wafers) are disclosed. In some embodiments, an apparatus may include a light source configured to illuminate a side of a wafer and a camera directed towards a first face of the wafer. In some embodiments, a long axis of a field of view of the camera may be angled relative to a propagation direction of the light source. In some embodiments, at least a portion of the field of view of the camera is offset from the path of propagation of light emitted from the light source through the wafer. In some embodiments, at least a portion of a light beam may be oriented at a positive non-zero angle relative to the first face of the wafer, and a dimension of the light beam normal to the first face of the wafer may be larger than a thickness of the wafer.

Abstract: A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.

Abstract: A system for de-powdering one or more objects within a powder print bed comprises a build box configured to contain the powder print bed, and a de-powdering subsystem configured to engage the build box. The de-powdering subsystem comprises a vacuum device configured to withdraw loose powder agitated by the air jet device, and a robotic arm configured to convey the vacuum device to one or more locations on the powder print bed. The system may further comprise an air jet device disposed on the robotic arm, the air jet device configured to agitate, with a jet of air, unbound powder within the powder print bed. The system may further comprise a mechanical agitation instrument configured to facilitate agitation of the unbound powder within the powder print bed.

Abstract: Methods and systems for additive manufacturing of a three-dimensional (3D) object employ a unique metering system to precisely deposit metal injection molding (MIM) metal powder material into a uniformly distributed layer and compact the powder material by a roller for even distribution. An example embodiment meters the powder material at an opening of a powder supply storing the powder material to produce a flow of the powder material away from the powder supply and onto a moveable surface located beneath the opening. The opening and the moveable surface are spaced apart by a gap therebetween. The metering is based on the gap and a motion of the moveable surface relative to the powder supply. The motion enables the powder material to flow from the powder supply. Absent the motion, the powder material does not flow from the powder supply.

Abstract: A furnace system includes a heating chamber, a retort assembly, and a waveguide. The heating chamber includes a shell encompassing an insulation layer and a working volume, where the working volume is configured to receive at least one part for heat treatment. The retort assembly is supported within the insulation layer and includes an inner retort surface facing the working volume. The inner retort surface is formed of at least one carbon compound reflective of microwave radiation, and the retort assembly defines a retort aperture. The waveguide is configured to direct microwave radiation from a microwave source to the retort aperture.

Abstract: A metering apparatus and corresponding method meter a powder material in a three-dimensional (3D) printing system. The metering apparatus comprises a hopper with walls configured to contain a powder material, a metering roller, and a tool. The metering roller is located beneath an opening of the hopper. The metering roller and a given wall of the walls of the hopper are spaced apart by a gap therebetween at the opening; the gap in combination with rotation of the metering roller causes the powder material to flow from under the given wall of the hopper at a substantially predictable rate. The tool is positioned at the given wall where the flow emerges and is configured to force the powder material off of the metering roller to supply the 3D printing system with the powder material for printing a 3D object.

Abstract: A system for separating objects within a stacked powder print bed of nested objects comprises a build box configured to contain the powder print bed. The build box has a build box top and a build box floor. The system further includes an elongated aperture formed in a side wall of the build box, and a de-powdering subsystem configured to mechanically and electrically engage the build box. A separating blade associated with the de-powdering subsystem is configured to be inserted through the elongated aperture and into the powder print bed between a top-most print bed layer of the nested objects and a second print bed layer directly below and contiguous with the top-most layer, thereby forming an isolated powder print bed between the separating blade and the build box top. The unbound powder may be agitated by various techniques and subsequently removed from the objects.

Abstract: Semi-conductor wafers with thin and thicker regions at controlled locations may be for Photovoltaics. The interior may be less than 180 microns or thinner, to 50 microns, with a thicker portion, at 180-250 microns. Thin wafers have higher efficiency. A thicker perimeter provides handling strength. Thicker stripes, landings and islands are for metallization coupling. Wafers may be made directly from a melt upon a template with regions of different heat extraction propensity arranged to correspond to locations of relative thicknesses. Interstitial oxygen is less than 6×1017 atoms/cc, preferably less than 2×1017, total oxygen less than 8.75×1017 atoms/cc, preferably less than 5.25×1017. Thicker regions form adjacent template regions having relatively higher heat extraction propensity; thinner regions adjacent regions with lesser extraction propensity. Thicker template regions have higher extraction propensity. Functional materials upon the template also have differing extraction propensities.

Abstract: An original wafer, typically silicon, has the form of a desired end PV wafer. The original may be made by rapid solidification or CVD. It has small grains. It is encapsulated in a clean thin film, which contains and protects the silicon when recrystallized to create a larger grain structure. The capsule can be made by heating a wafer in the presence of oxygen, or steam, resulting in silicon dioxide on the outer surface, typically 1-2 microns. At least one support element supports the wafer at the time the capsule is provided and blocks only minimal surface area from contact with the film forming atmosphere. There may be a plurality of support elements, or a surface may provide such support. The capsule contains the molten material during recrystallization, and protects against impurities. Recrystallization may be in air. After recrystallization, the capsule is removed.

Abstract: The present inventions relate to the formation of a thin polymer film on a substrate. Apparatus is described for transforming a solid polymer resist into an aerosol of small particles, electrostatically charging and depositing the particles onto a substrate, and flowing the particles into a continuous layer. Apparatus is further described for transforming solid resist into an aerosol of small particles by heating the resist to form a low viscosity liquid such as is compatible with nebulization and applying the techniques of jet or impact nebulization and aerosol particle sizing to form the aerosol. A method is further described of using ionized gas to confer charge onto the aerosol particles and using a progression of charging devices establish an electric field directing the flow of charged particles to the substrate. The progression of charging devices and associated apparatus results in high collection efficiency for the aerosol particles.

Abstract: A pressure differential can be applied across a mold sheet and a semiconductor (e.g. silicon) wafer (e.g. for solar cell) is formed thereon. Relaxation of the pressure differential can allow release of the wafer. The mold sheet may be cooler than the melt. Heat is extracted through the thickness of the forming wafer. The temperature of the solidifying body is substantially uniform across its width, resulting in low stresses and dislocation density and higher crystallographic quality. The mold sheet can allow flow of gas through it. The melt can be introduced to the sheet by: full area contact with the top of a melt; traversing a partial area contact of melt with the mold sheet, whether horizontal or vertical, or in between; and by dipping the mold into a melt. The grain size can be controlled by many means.

Abstract: Semi-conductor wafers with thin and thicker regions at controlled locations may be for Photovoltaics. The interior may be less than 180 microns or thinner, to 50 microns, with a thicker portion, at 180-250 microns. Thin wafers have higher efficiency. A thicker perimeter provides handling strength. Thicker stripes, landings and islands are for metallization coupling. Wafers may be made directly from a melt upon a template with regions of different heat extraction propensity arranged to correspond to locations of relative thicknesses. Interstitial oxygen is less than 6×1017 atoms/cc, preferably less than 2×1017, total oxygen less than 8.75×1017 atoms/cc, preferably less than 5.25×1017. Thicker regions form adjacent template regions having relatively higher heat extraction propensity; thinner regions adjacent regions with lesser extraction propensity. Thicker template regions have higher extraction propensity. Functional materials upon the template also have differing extraction propensities.

Abstract: Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired.

Abstract: An interposer sheet can be used for making semiconductor bodies, such as of silicon, such as for solar cell use. It is free-standing, very thin, flexible, porous and able to withstand the chemical and thermal environment of molten semiconductor without degradation. It is typically of a ceramic material, such as silica, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbide, silicon carbonitride, silicon oxycarbonitride and others. It is provided between a forming surface of a mold sheet, and the molten material from which a semiconductor body will be formed. It may be secured to the forming surface or deposited upon the melt. The interposer sheet suppresses grain nucleation, and limits heat flow from the melt. It promotes separation of the semiconductor body from the forming surface. It can be fabricated before its use. Because free-standing and not adhered to the forming surface, problems of mismatch of CTE are minimized.

Abstract: Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired.

Abstract: Processes increase light absorption into silicon wafers by selectively changing the reflective properties of the bottom portions of light trapping cavity features. Modification of light trapping features includes: deepening the bottom portion, increasing the curvature of the bottom portion, and roughening the bottom portion, all accomplished through etching. Modification may also be by the selective addition of material at the bottom of cavity features. Different types of features in the same wafers may be treated differently. Some may receive a treatment that improves light trapping while another is deliberately excluded from such treatment. Some may be deepened, some roughened, some both. No alignment is needed to achieve this selectively. The masking step achieves self-alignment to previously created light trapping features due to softening and deformation in place.