Patents by Inventor Emmanuel Sang

Emmanuel Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5109177
    Abstract: A damped cradle for a pressure sensitive device is constructed in a unitary form. The cradle has a base that is attached to a substrate. Extending upward from the base are side arms with pairs of spring, or compliant, tips that contact the sides of the pressure sensitive device. Also extending upward from the base over the top of the pressure sensitive device are spring arms with compliant tips that contact the top surface of the pressure sensitive device in non-active areas. Vibrational forces in lateral (X-Y plane) directions are damped by friction between the bottom of the pressure sensitive device and the surface of the substrate, and vibration motion in the vertical, or Z, direction is stopped by enough spring force to overcome the maximum acceleration force the crystal mass encompasses for a given application. The spring forces of the spring tips and spring arms are balanced to produce a near zero pressure on the pressure sensitive device in both static and dynamic modes.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: April 28, 1992
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, Emmanuel Sang
  • Patent number: 4845397
    Abstract: Apparatus is provided for mounting an electronic component having a pressure sensitive active area, which apparatus permits the component to expand and contract with changes in temperature and which does not introduce stresses into the active area of the component. The apparatus includes a cradle which, when attached to a substrate, forms a partial enclosure of the component but which leaves the active area unobscured. A packaging system is also provided wherein the bottom of the cavity of the lower portion of a standard integrated circuit package forms the substrate to be used in conjunction with the cradle for containing the electronic component.
    Type: Grant
    Filed: March 24, 1986
    Date of Patent: July 4, 1989
    Assignee: Tektronix, Inc.
    Inventors: Geoffrey C. Herrick, Emmanuel Sang
  • Patent number: 4749942
    Abstract: A wafer probe head has a plate-form support member having a tip region and a mounting region. At least one electrically conductive probe tip is carried by the support member at the tip region. A connector is carried by the support member at a location spaced from the tip region, and the probe tip is electrically connected to the connector. The probe head also has a strain gauge for measuring physical distortion of the support member as a result of the probe tip being pressed against a device under test by virtue of relative movement between the mounting region of the support member and the device under test.
    Type: Grant
    Filed: June 2, 1987
    Date of Patent: June 7, 1988
    Assignee: Tektronix, Inc.
    Inventors: Emmanuel Sang, Gary L. Estabrook
  • Patent number: 4739286
    Abstract: Suppression of radiated harmonics in a single stage transistor oscillator and transmitter circuit is achieved by inserting a narrow band filter, such as a surface acoustic wave resonator (SAWR), in the oscillator signal feedback loop at the point of emissions of the harmonics.
    Type: Grant
    Filed: October 23, 1986
    Date of Patent: April 19, 1988
    Assignee: Tektronix, Inc.
    Inventors: Philip B. Snow, Emmanuel Sang