Patents by Inventor Emmanuelle C. Yvon

Emmanuelle C. Yvon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120325403
    Abstract: A process for laminating a substrate, where the process may include: disposing at least one a thermoplastic film on a porous substrate; heat softening the at least one thermoplastic film; conjoining the at least one thermoplastic film and the porous substrate to form a laminated substrate; and cooling the laminated substrate; wherein the conjoining comprises suctioning the thermoplastic film into the porous substrate. An apparatus for laminating a substrate, where the apparatus may include: a system for disposing a thermoplastic film on a tufted substrate; a heater for heat softening the thermoplastic film; and a vacuum for suctioning the thermoplastic film into the tufted substrate.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 27, 2012
    Applicant: DOW GLOBAL TECHNOLOGIES INC.
    Inventors: Loic F. Chereau, Miguel A. Prieto, Emmanuelle C. Yvon, Peter Sandkuehler
  • Publication number: 20080274307
    Abstract: A process for laminating a substrate, where the process may include: disposing at least one a thermoplastic film on a porous substrate; heat softening the at least one thermoplastic film; conjoining the at least one thermoplastic film and the porous substrate to form a laminated substrate; and cooling the laminated substrate; wherein the conjoining comprises suctioning the thermoplastic film into the porous substrate. An apparatus for laminating a substrate, where the apparatus may include: a system for disposing a thermoplastic film on a tufted substrate; a heater for heat softening the thermoplastic film; and a vacuum for suctioning the thermoplastic film into the tufted substrate.
    Type: Application
    Filed: April 2, 2008
    Publication date: November 6, 2008
    Applicant: DOW GLOBAL TECHNOLOGIES INC.
    Inventors: Loic F. Chereau, Miguel A. Prieto, Emmanuelle C. Yvon, Peter Sandkuehler