Patents by Inventor Erfan Sheikhi

Erfan Sheikhi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Implantable sensor electronics packaging
    Patent number: 11786125
    Abstract: An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: October 17, 2023
    Assignees: DEPUY SYNTHES PRODUCTS, INC., STITCHTING IMEC NEDERLAND, IMEC VZW
    Inventors: George Mikhail, Binh Vu, Jochen Walser, Dan Dlugos, Mark Fichman, Seulki Lee, Navid Shahriari, Erfan Sheikhi, Maria Op de Beeck
  • DEVICE, A SYSTEM, AND A METHOD FOR MONITORING BONE DENSITY AND A METHOD FOR IMPLANTING A DEVICE FOR MONITORING BONE DENSITY
    Publication number: 20230157628
    Abstract: A device for monitoring bone density comprises: a first electrode unit comprising a first electrode area to be arranged within a bone; a second electrode unit comprising a second electrode area to be arranged outside the bone, wherein the first and the second electrode units are configured for being arranged such that an electrical signal between the first and the second electrode areas travels through a cortical bone portion of the bone; an injection signal generating unit configured to provide an injection signal for generating the electrical signal; and a measurement unit configured to detect a measurement signal induced by the injection signal for determining an impedance between the first and the second electrode areas as a measure of bone density.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 25, 2023
    Inventors: Mark FICHMAN, Erfan SHEIKHI, Seulki LEE, Navid SHAHRIARI
  • IMPLANTABLE SENSOR ELECTRONICS PACKAGING
    Publication number: 20220183558
    Abstract: An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Applicant: Depuy Synthes Products, Inc.
    Inventors: George Mikhail, Binh Bao Vu, Jochen Walser, Dan Dlugos, Mark Fichman, Seulki Lee, Navid Shahriari, Erfan Sheikhi, Maria Op de Beeck