Patents by Inventor Eric J. Lautenschlager

Eric J. Lautenschlager has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160353212
    Abstract: Microphone devices are disclosed. The microphone device includes a base, a lid, a side wall between the base and the lid, and a MEMS die. The side wall includes a first portion with a first width and a second portion with a second width disposed under the first portion. The first width is less than the second width such that a shoulder is formed on the second portion. The MEMS die is supported on the shoulder. The MEMS die includes a diaphragm and a back plate.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 1, 2016
    Applicant: Knowles Electronics, LLC
    Inventors: Eric J. Lautenschlager, Sandra F. Vos
  • Publication number: 20160283045
    Abstract: Apparatuses and methods directed to adjusting a visual characteristic of a user interface. Ultrasonic detection times are received from a first ultrasonic transceiver, a second ultrasonic transceiver, and a fourth ultrasonic transceiver. A height of a feature above the user interface is determined from the first ultrasonic detection time, the second ultrasonic detection time, and the third ultrasonic detection time. If the height of the feature is less than a predetermined threshold a visual characteristic of the user interface is adjusted.
    Type: Application
    Filed: March 25, 2016
    Publication date: September 29, 2016
    Applicant: Knowles Electronics, LLC
    Inventor: Eric J. Lautenschlager
  • Patent number: 9329199
    Abstract: An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: May 3, 2016
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Sung Bok Lee, Eric J. Lautenschlager
  • Publication number: 20150365770
    Abstract: A micro electro mechanical system (MEMS) microphone includes a lid, at least one wall coupled to the lid, a substrate, and a MEMS die. The substrate is coupled to the at least one wall and a port extending through the substrate. The MEMS die is disposed on the substrate, and the MEMS die including a movable diaphragm and back plate. The optical sub-assembly is coupled to the lid, and the optical sub-assembly is configured and arranged to sense a position of the diaphragm.
    Type: Application
    Filed: June 2, 2015
    Publication date: December 17, 2015
    Inventor: Eric J. Lautenschlager
  • Publication number: 20150296305
    Abstract: An electrode apparatus of a back plate that is used in a microelectromechanical system (MEMS) microphone is disposed in spaced proximity to a diaphragm. The electrode apparatus includes a support layer and a conductive layer that is arranged in proximity to the support layer. At least one of a shape, a dimension, or a sizing of the conductive layer is matched to one or more of a sensitivity of the diaphragm, an operation of the diaphragm, or a movement of the diaphragm.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 15, 2015
    Inventors: Ning Shao, Eric J. Lautenschlager
  • Publication number: 20150296306
    Abstract: A microelectromechanical system (MEMS) die includes a substrate, an insulation layer disposed adjacent to the substrate, a diaphragm connected to the insulation layer, and a back plate connected to the insulation layer. The back plate is disposed in spaced relation to the diaphragm. The insulation layer is positioned between the substrate and the diaphragm and back plate to electrically isolate the substrate from the diaphragm and the back plate.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 15, 2015
    Inventors: Ning Shao, Eric J. Lautenschlager
  • Publication number: 20150296307
    Abstract: A microelectromechanical system (MEMS) die includes a back plate and a diaphragm assembly. The back plate includes a first back plate portion including a first electrode and a second back plate portion including a second electrode, both electrodes being integrated on a mechanical supporting layer. The diaphragm assembly includes a first diaphragm disposed proximate to and in spaced apart relation from the first back plate portion, with the first diaphragm defining an opening therethrough. The diaphragm assembly also includes a second diaphragm disposed proximate to and in spaced apart relation from the second back plate portion, the second diaphragm disposed within the opening and separated from the first diaphragm by a ring-shaped void. The diaphragm assembly also includes a connection portion connecting the first diaphragm and the second diaphragm and extending through the ring-shaped void.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 15, 2015
    Inventors: Ning Shao, Eric J. Lautenschlager
  • Patent number: 8781140
    Abstract: A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: July 15, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Eric J. Lautenschlager, Galen Kirkpatrick
  • Publication number: 20130343580
    Abstract: An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 26, 2013
    Applicant: Knowles Electronics, LLC
    Inventors: Eric J. Lautenschlager, Peter V. Loeppert
  • Publication number: 20130094674
    Abstract: A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.
    Type: Application
    Filed: April 13, 2012
    Publication date: April 18, 2013
    Inventors: Eric J. Lautenschlager, Galen Kirkpatrick