Abstract: An electrically powered vehicle includes an inverter mounted in the vehicle, the inverter having a plurality of high power IGBT modules for converting DC power to AC power for application to a plurality of AC electric motors connected in driving relationship to wheels on the vehicle. Each of the IGBT modules is mounted in thermal transfer relationship to an electrically isolated base plate and each base plate has a plurality of closely spaced, parallel slots formed across one surface with a plurality of fins fitted into the slots and extending from the base plate. The system includes apparatus for mounting the IGBT modules to a wall separating an electronics compartment from an air supply and air exhaust compartment. Air from an air supply plenum in the air supply compartment is directed into the fins extending from the IGBT base plate and exhaust through an exhaust conduit. The vehicle includes a blower to force air to flow through the fins extending from the base plate.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.