Patents by Inventor Eric Paul RUBEN

Eric Paul RUBEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11406004
    Abstract: A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: August 2, 2022
    Assignee: LEONARDO ELECTRONICS US INC.
    Inventors: Eric Paul Ruben, Jean Michel Maillard, Prabhu Thiagarajan
  • Publication number: 20200053865
    Abstract: A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 13, 2020
    Inventors: Eric Paul RUBEN, Jean Michel MAILLARD, Prabhu THIAGARAJAN