Patents by Inventor Ernest H. Dubble

Ernest H. Dubble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid cooled heat sink with cold plate retention mechanism
    Patent number: 7414844
    Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: August 19, 2008
    Assignee: Thermal Corp.
    Inventors: Michael J. Wilson, Jonathan Wattelet, Donald Lightner, Richard DeKeuster, Ernest H. Dubble, Gregg J. Baldassarre
  • Modular heat sink
    Patent number: 7306028
    Abstract: A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: December 11, 2007
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Ernest H. Dubble, Donald M. Ernst
  • Liquid cooled heat sink with cold plate retention mechanism
    Patent number: 7149087
    Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: December 12, 2006
    Assignee: Thermal Corp.
    Inventors: Michael J. Wilson, Jonathan Wattelet, Donald Lightner, Richard DeKeuster, Ernest H. Dubble, Gregg J. Baldassarre