Patents by Inventor Eu Soon Lee

Eu Soon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedding thin film resistors in substrates in power delivery networks
    Patent number: 8228680
    Abstract: Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: July 24, 2012
    Assignee: Intel Corporation
    Inventors: Myitzu Soe Myat, Mooi Ling Chang, Eu Soon Lee, Yongki Min, King Keong Wong
  • Semiconductor packages with stiffening support for power delivery
    Patent number: 7884470
    Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: February 8, 2011
    Assignee: Intel Corporation
    Inventors: Kee Leong Cheah, Eu Soon Lee
  • Semiconductor packages with stiffening support for power delivery
    Publication number: 20100155927
    Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Inventors: Kee Leong Cheah, Eu Soon Lee
  • Embedding Thin Film Resistors in Substrates in Power Delivery Networks
    Publication number: 20100134992
    Abstract: Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
    Type: Application
    Filed: February 4, 2010
    Publication date: June 3, 2010
    Inventors: Myitzu Soe Myat, Mooi Ling Chang, Eu Soon Lee, Yongki Min, King Keong Wong