Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.

Abstract: A coil electronic component includes a magnetic body having a core part and a coil wound around the core part. The core part includes mixtures of magnetic metal material and resin. The magnetic body includes a first region adjacent to the coil and a second region adjacent to an outer surface of the magnetic body. Additionally, magnetic metal material of the first region adjacent to the coil has magnetic permeability higher than that of magnetic metal material of the second region adjacent to the outer surface of the magnetic body.

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract: A battery comprises: a battery cell; and tabs configured as one pair of an anode tab and a cathode tab and included in the battery cell. At least one of the anode tab and the cathode tab is configured in such a way that a welding region exposed outside the battery cell and a reaction region positioned in the battery cell are formed of different metals and are joined to each other.

Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.

Abstract: An optical engine for a projector according to an embodiment of the present invention comprises: a first light source unit; a second light source unit which outputs a light with a color which is different from that of the first light source unit; a third light source unit which outputs a light with a color which is different from those of the first and second light source units; a micro display panel which outputs a predetermined image; a fly-eye lens which equalizes lights and includes a plurality of cells, each of which is configured by a convex lens; and a projection lens which projects a generated projection image to the outside on the basis of an output light of the first to third light source units and an output image, wherein two or more cells among a plurality of cells have shapes different from shapes of other cells.

Abstract: An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

Abstract: Provided is a secondary battery capable of preventing metal-plating and curling, the secondary battery including: at least one anode including an anode current collector and an anode active material layer coated on the anode current collector; at least one cathode including a cathode current collector, a cathode active material layer coated on one surface of the cathode current collector, which faces the anode, and an outermost coating layer coated on the other surface of the cathode current collector, which does not face the anode, the outermost coating layer being formed by coating an anode active material, an inorganic particle, or a mixture thereof; and at least one separator positioned between the cathode and the anode.

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract: Provided are a 3-dimensional interface device through motion recognition and a control method thereof, and is a method of controlling an operation range and a movement speed of the interface device. The interface device includes a display unit which is a display unit, a control terminal generating an output signal output to the display unit and controlling drive of the display unit, and an interface unit connected to the control terminal, receiving a user's command from a user, and transmitting the user's command to the control terminal. The interface unit includes a detecting unit detecting a user's motion, and a control unit controlling drive of the interface unit.

Abstract: A door with a display unit mounted therein. This display unit has: a first substrate; a driving circuit on the first substrate; a display device on the driving circuit; a second substrate on the display device; and a door knob on the first substrate and the second substrate. The display unit is configured to display at least one of an individual identification code, a current state of usage, current user information, a duration of use, next user information, and current time information of a predetermined space.

Abstract: Provided are a 3-dimensional interface device through motion recognition and a control method thereof, and is a method of controlling an operation range and a movement speed of the interface device. The interface device includes a display unit which is a display unit, a control terminal generating an output signal output to the display unit and controlling drive of the display unit, and an interface unit connected to the control terminal, receiving a user's command from a user, and transmitting the user's command to the control terminal. The interface unit includes a detecting unit detecting a user's motion, and a control unit controlling drive of the interface unit.

Abstract: Disclosed are a lead frame and a method for manufacturing the same. The lead frame includes a copper substrate and a rough copper layer having surface roughness of 110 nm to 300 nm on a surface of the copper substrate.