Patents by Inventor Eva-Maria Kupsch

Eva-Maria Kupsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220251352
    Abstract: Embodiments of this disclosure include polymer blends comprising at least 90% by weight low density polyethylene (LDPE) polymer; and from 1% to 10% by weight ethylene acrylate copolymer. The ethylene acrylate copolymer is the polymerized reaction product of: at least 50% by wt. ethylene, based on the total weight of the monomers present in the ethylene acrylate copolymer; from 2% to 40% by wt. alkyl acrylate, based on the total weight of the monomers present in the ethylene acrylate copolymer; and from 0 to 20 wt. % of monocarboxylic acid monomer, based on the total weight of the monomers present in the ethylene acrylate copolymer.
    Type: Application
    Filed: July 24, 2020
    Publication date: August 11, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Eva-Maria KUPSCH, Yifan DONG, Sylvie VERVOORT
  • Publication number: 20210276305
    Abstract: Embodiments of the present invention relate to multilayer structures, packages formed therefrom, and methods of preparing multilayer structures. In one aspect, a multilayer structure comprises a polyolefin layer which is Layer A, a tie layer which is Layer B, and a barrier layer which is Layer C, each layer having opposing facial surfaces.
    Type: Application
    Filed: October 11, 2017
    Publication date: September 9, 2021
    Inventors: Yushan Hu, Eva-Maria Kupsch
  • Patent number: 11111322
    Abstract: A polyethylene homopolymer comprising the following properties: a) a melt index (I2) from 1.0 to 3.5 dg/min; b) a Mw(abs) versus I2 relationship: Mw(abs)?A+B(I2), where A=3.20×105 g/mole, and B=?8.00×103 (g/mole)/(dg/min); c) a Mw(abs) versus I2 relationship: Mw(abs)?C+D(I2), where C=3.90×105 g/mole, and D=?8.00×103 (g/mole)/(dg/min).
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: September 7, 2021
    Assignee: Dow Global Technologies LLC
    Inventors: Cornelis F. J. Den Doelder, Nhi T. Y. Dang, Eva-Maria Kupsch, Edward L. Lee
  • Patent number: 10815321
    Abstract: A process for producing an ethylene-based polymer comprises polymerizing, by the presence of at least one free-radical initiator and using a high pressure tubular polymerization process, a reaction mixture containing ethylene and at least one CTA system comprising one or more CTA components to produce the ethylene-based polymer. The free-radical initiator is dissolved in a solvent comprising a saturated hydrocarbon to form an initiator solution which is added to the polymerization using an initiator feed line to an initiator injection pump. At least 50 wt % of the solvent has i) a dry point of less than or equal to 160° C. and ii) an initial boiling point of greater than or equal to 100° C. The polymerization process has a ratio of inlet pressure to first peak temperature of less than or equal to 9 Bar/° C.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: October 27, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Cornelis F J Den Doelder, Stefan Hinrichs, Eva-Maria Kupsch, Otto J. Berbee, Rajesh P. Paradkar, Bernard A. Fehr, Carmelo Declet Perez
  • Publication number: 20200207889
    Abstract: A polyethylene homopolymer comprising the following properties: a) a melt index (I2) from 1.0 to 3.5 dg/min; b) a Mw(abs) versus I2 relationship: Mw(abs)?A+B(I2), where A=3.20×105 g/mole, and B=?8.00×103 (g/mole)/(dg/min); c) a Mw(abs) versus I2 relationship: Mw(abs)?C+D(I2), where C=3.90×105 g/mole, and D=?8.00×103 (g/mole)/(dg/min).
    Type: Application
    Filed: July 13, 2018
    Publication date: July 2, 2020
    Applicant: Dow Global Technologies LLC
    Inventors: Cornelis F.J. Den Doelder, Nhi T.Y. Dang, Eva-Maria Kupsch, Edward L. Lee
  • Patent number: 10472513
    Abstract: The present disclosure provides a composition. In an embodiment, the composition includes A) an ethylene/acrylate interpolymer or an ethylene/acetate interpolymer; B) an ethylene/?-olefin multi-block copolymer; and C) a flame retardant. In an embodiment, the ethylene/acrylate interpolymer is a functionalized ethylene/acrylate interpolymer. The present composition exhibits improved dirt pick-up resistance.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: November 12, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Varun Thakur, Stefan Ultsch, Jouko Vyoerykkae, Jozef J. Van Dun, Eva-Maria Kupsch
  • Patent number: 10471688
    Abstract: The invention provides a film comprising at least two layers, a first layer and a second layer; and wherein the first layer is formed from a first composition comprising a polyester and/or a polylactic acid; and wherein the second layer is formed from a second composition comprising at least the following: A) a functionalized ethylene-based polymer, and B) at least one ethylene/alkylacrylate copolymer.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 12, 2019
    Assignees: Dow Global Technologies LLC, Dow Brasil Indú´stria e Comércio de Produtos Químicios Ltda.
    Inventors: Eva-Maria Kupsch, Didem Oner-Deliormanli, Marlos Giuntini De Oliveira, Ashish Batra
  • Publication number: 20190135956
    Abstract: A process for producing an ethylene-based polymer comprises polymerizing, by the presence of at least one free-radical initiator and using a high pressure tubular polymerization process, a reaction mixture containing ethylene and at least one CTA system comprising one or more CTA components to produce the ethylene-based polymer. The free-radical initiator is dissolved in a solvent comprising a saturated hydrocarbon to form an initiator solution which is added to the polymerization using an initiator feed line to an initiator injection pump. At least 50 wt % of the solvent has i) a dry point of less than or equal to 160° C. and ii) an initial boiling point of greater than or equal to 100° C. The polymerization process has a ratio of inlet pressure to first peak temperature of less than or equal to 9 Bar/° C.
    Type: Application
    Filed: April 21, 2017
    Publication date: May 9, 2019
    Applicant: Dow Global Technologies LLC
    Inventors: Cornelis FJ DEN DOELDER, Stefan HINRICHS, Eva-Maria KUPSCH, Otto J. BERBEE, Rajesh P. PARADKAR, Bernard A. FEHR, Carmelo Declet PEREZ
  • Publication number: 20190001636
    Abstract: Embodiments of the present invention relate to multilayer films, packages formed therefrom, and methods of preparing multilayer films. In one aspect, a multilayer film comprises a coextruded, multilayer film comprising at least five layers in which Layer A is a skin layer, Layer B is a tie layer, Layer C is a barrier layer, Layer D is a second tie layer, and Layer E is polyolefin, each layer having opposing facial surfaces and arranged in the order A/B/C/D/E. Layer A comprises polyethylene terephthalate, Layer C comprises polyamide or ethylene vinyl alcohol, and Layer E comprises polypropylene or polyethylene.
    Type: Application
    Filed: September 9, 2016
    Publication date: January 3, 2019
    Applicant: Dow Global Technologies LLC
    Inventors: Eva-Maria Kupsch, Yushan Hu
  • Publication number: 20180186996
    Abstract: The present disclosure provides a composition. In an embodiment, the composition includes A) an ethylene/acrylate interpolymer or an ethylene/acetate interpolymer; B) an ethylene/?-olefin multi-block copolymer; and C) a flame retardant. In an embodiment, the ethylene/acrylate interpolymer is a functionalized ethylene/acrylate interpolymer. The present composition exhibits improved dirt pick-up resistance.
    Type: Application
    Filed: June 20, 2016
    Publication date: July 5, 2018
    Inventors: Varun THAKUR, Stefan ULTSCH, Jouko VYOERYKKAE, Jozef J. VAN DUN, Eva-Maria KUPSCH
  • Patent number: 9511567
    Abstract: Disclosed are multilayer structures comprising a polyolefin layer, a tie layer and a barrier layer wherein the tie layer is a formulation comprising a crystalline block copolymer composite (CBC) comprising i) an ethylene polymer (EP) comprising at least 90 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 90 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB).
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: December 6, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Yushan Hu, Burcak Conley, Kim L. Walton, Colin Li Pi Shan, Gary R. Marchand, Rajen M. Patel, Eva-Maria Kupsch, Brian W. Walther
  • Publication number: 20150217543
    Abstract: The invention provides a film comprising at least two layers, a first layer and a second layer; and wherein the first layer is formed from a first composition comprising a polyester and/or a polylactic acid; and wherein the second layer is formed from a second composition comprising at least the following: A) a functionalized ethylene-based polymer, and B) at least one ethylene/alkylacrylate copolymer.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 6, 2015
    Inventors: Eva-Maria Kupsch, didem Oner-Deliormanli, Marlos Giuntini De Oliveira, Ashish Batra
  • Publication number: 20150217544
    Abstract: Disclosed are multilayer structures comprising a polyolefin layer, a tie layer and a barrier layer wherein the tie layer is a formulation comprising a crystalline block copolymer composite (CBC) comprising i) an ethylene polymer (EP) comprising at least 90 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 90 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB).
    Type: Application
    Filed: September 13, 2013
    Publication date: August 6, 2015
    Inventors: Yushan Hu, Burcak Conley, Kim L. Walton, Colin Li Pi Shan, Gary R. Marchand, Rajen M. Patel, Eva-Maria Kupsch, Brian W. Walther