Abstract: Apparatus is disclosed for making electrical contact with test points, such as in a printed circuit, on a test member. A mounting is provided for the test member at a location for test. A plurality of spaced conductive probe heads each have, oppositely facing, a contact side and a bearing side and are arranged in an array corresponding to the test points on the test member. The contact sides are adjacent the test member location. At least one resilient member has one side adjacent the bearing sides of the probe heads. A backup plate has a bearing side adjacent the opposite side of the resilient member from the probe heads. Pressure is applied through the backup plate and the resilient member to the bearing side of the probe heads forcing the contact sides of the probe heads in the direction of the test member location.

Abstract: A miniature low resistance telescoping spring probe includes telescoping tubular housing and inner plunger. Both the housing and plunger are elongated and of an electrically conductive material. The plunger has a probe head external to the housing. The inner wall of the housing and the outer wall of the plunger are engaged and concentric, providing a sliding electrical connection and a bearing therebetween. A coil compression spring urges the housing and plunger in longitudinally opposite directions. A separate low electrical resistance wiper spring member is affixed to the plunger. A substantially constant low resistance electrical connection is provided between the wiper spring member and the plunger. The wiper spring member has at least one longitudinally extending leg spring loaded outwardly into engagement with the inside wall of the housing.