Patents by Inventor Everett Joseph Canning

Everett Joseph Canning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive polymer film bonding technique
    Patent number: 5903056
    Abstract: The specification describes a thermocompression bonding process using anisotropic conductive film (ACF) bonding material in which the bonding pads are shaped to prevent depletion of conductive particles in the bonding region during compression. The process is useful in bump technology for interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The shaped structure can be made using photodefinable polymer strips around the bonding pads where the strips are thicker than the bonding pad. Alternative approaches to shaping one or both of the mating conductive surfaces are disclosed.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: May 11, 1999
    Assignee: Lucent Technologies Inc.
    Inventors: Everett Joseph Canning, Ranjan Dutta
  • Compliant bump technology
    Patent number: 5783465
    Abstract: The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: July 21, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Everett Joseph Canning, Donald W. Finley, Charles K. Hoppes, Michael Sheridan