Patents by Inventor Everhardus Cornelis Mos

Everhardus Cornelis Mos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180307135
    Abstract: A method including obtaining a measurement and/or simulation result of a pattern after being processed by an etch tool of a patterning system, determining a patterning error due to an etch loading effect based on the measurement and/or simulation result, and creating, by a computer system, modification information for modifying a patterning device and/or for adjusting a modification apparatus upstream in the patterning system from the etch tool based on the patterning error, wherein the patterning error is converted to a correctable error and/or reduced to a certain range, when the patterning device is modified according to the modification information and/or the modification apparatus is adjusted according to the modification information.
    Type: Application
    Filed: September 28, 2016
    Publication date: October 25, 2018
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Peter TEN BERGE, Everhardus Cornelis MOS, Richard Johannes Franciscus VAN HAREN, Peter Hanzen WARDENIER, Erik JENSEN, Bernardo KASTRUP, Michael KUBIS, Johannes Catharinus Hubertus MULKENS, Davis Frans Simon DECKERS, Wolfgang Helmut HENKE, Joungchel LEE
  • Publication number: 20180307145
    Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.
    Type: Application
    Filed: April 12, 2018
    Publication date: October 25, 2018
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan Wildenberg, Marcel Hendrikus Maria Beems, Erik Johannes Maria Wallerbos
  • Patent number: 10061212
    Abstract: Disclosed is a method of measuring a target, associated substrate comprising a target and computer program. The target comprises overlapping first and second periodic structures. The method comprising illuminating the target with measurement radiation and detecting the resultant scattered radiation. The pitch of the second periodic structure is such, relative to a wavelength of the measurement radiation and its angle of incidence on the target, that there is no propagative non-zeroth diffraction at the second periodic structure resultant from said measurement radiation being initially incident on said second periodic structure. There may be propagative non-zeroth diffraction at the second periodic structure which comprises further diffraction of one or more non-zero diffraction orders resultant from diffraction by the first periodic structure.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: August 28, 2018
    Assignee: ASML Netherlands B.V.
    Inventors: Maurits Van Der Schaar, Richard Johannes Franciscus Van Haren, Everhardus Cornelis Mos, Youping Zhang
  • Patent number: 9971478
    Abstract: A method of displaying a plurality of graphical user interface elements, each graphical user interface element representing a step in a measurement design, setup and/or monitoring process and each graphical user interface element enabling access by the user to further steps in the measurement design, setup and/or monitoring process for the associated step of the graphical user interface element, and displaying an indicator associated with one or more of the plurality of graphical user elements, the indicator indicating that a step in the measurement design, setup and/or monitoring process is not completed and/or that a key performance indicator associated with a step in the measurement design, setup and/or monitoring process has passed a threshold.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: May 15, 2018
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis Mos, Erik Mathijs Maria Crombag, Ajith Ganesan
  • Publication number: 20180067900
    Abstract: A method including evaluating, with respect to a parameter representing remaining uncertainty of a mathematical model fitting measured data, one or more mathematical models for fitting measured data and one or more measurement sampling schemes for measuring data, against measurement data across a substrate, and identifying one or more mathematical models and/or one or more measurement sampling schemes, for which the parameter crosses a threshold.
    Type: Application
    Filed: March 25, 2016
    Publication date: March 8, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Everhardus Cornelis MOS, Velislava IGNATOVA, Erik JENSEN, Michael KUBIS, Hubertus Johannes Gertrudus SIMONS, Peter TEN BERGE, Erik Johannes Maria WALLERBOS, Jochem Sebastiaan WILDENBERG
  • Publication number: 20180011398
    Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.
    Type: Application
    Filed: January 20, 2016
    Publication date: January 11, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Wim Tjibbo TEL, Marinus JOCHEMSEN, Frank STAALS, Christopher PRENTICE, Laurent Michel Marcel DEPRE, Johannes Marcus Maria BELTMAN, Roy WERKMAN, Jochem Sebastiaan WILDENBERG, Everhardus Cornelis MOS
  • Patent number: 9811006
    Abstract: A method of determining a measurement subset of metrology point locations which includes a subset of potential metrology point locations on a substrate. The method including identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by the measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: November 7, 2017
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos
  • Publication number: 20170293233
    Abstract: Disclosed is a method of measuring a target, associated substrate comprising a target and computer program. The target comprises overlapping first and second periodic structures. The method comprising illuminating the target with measurement radiation and detecting the resultant scattered radiation. The pitch of the second periodic structure is such, relative to a wavelength of the measurement radiation and its angle of incidence on the target, that there is no propagative non-zeroth diffraction at the second periodic structure resultant from said measurement radiation being initially incident on said second periodic structure. There may be propagative non-zeroth diffraction at the second periodic structure which comprises further diffraction of one or more non-zero diffraction orders resultant from diffraction by the first periodic structure.
    Type: Application
    Filed: April 3, 2017
    Publication date: October 12, 2017
    Applicant: ASML Netherlands B.V.
    Inventors: Maurits VAN DER SCHAAR, Richard Johannes Franciscus VAN HAREN, Everhardus Cornelis MOS, Youping ZHANG
  • Publication number: 20170277045
    Abstract: Metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.
    Type: Application
    Filed: November 12, 2015
    Publication date: September 28, 2017
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jasper MENGER, Paul Cornelis Hubertus ABEN, Everhardus Cornelis MOS
  • Publication number: 20170160073
    Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
    Type: Application
    Filed: February 14, 2017
    Publication date: June 8, 2017
    Applicant: ASML Netherlands B.V.
    Inventors: Wouter Lodewijk ELINGS, Franciscus Bernardus Maria VAN BILSEN, Christianus Gerardus Maria DE MOL, Everhardus Cornelis MOS, Hoite Pieter Theodoor TOLSMA, Peter TEN BERGE, Paul Jacques VAN WIJNEN, Leonardus Henricus Marie VERSTAPPEN, Gerald DICKER, Reiner Maria JUNGBLUT, Li CHUNG-HSUN
  • Patent number: 9632430
    Abstract: A lithographic system includes a lithographic apparatus and a scatterometer. In an embodiment, the lithographic apparatus includes an illumination optical system arranged to illuminate a pattern and a projection optical system arranged to project an image of the pattern on to a substrate. In an embodiment, the scatterometer includes a measurement system arranged to direct a beam of radiation onto a target pattern on said substrate and to obtain an image of a pupil plane representative of radiation scattered from the target pattern. A computational arrangement represents the pupil plane by moment functions calculated from a pair of orthogonal basis function and correlates the moment function to lithographic feature parameters to build a lithographic system identification. A control arrangement uses the system identification to control subsequent lithographic processes performed by the lithographic apparatus.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: April 25, 2017
    Assignee: ASML Netherlands B.V.
    Inventors: Everhardus Cornelis Mos, Maurits Van Der Schaar, Scott Anderson Middlebrooks
  • Patent number: 9594029
    Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.
    Type: Grant
    Filed: November 22, 2012
    Date of Patent: March 14, 2017
    Assignee: ASML Netherlands B.V.
    Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Li Chung-Hsun
  • Publication number: 20160334717
    Abstract: A method of determining a measurement subset of metrology point locations which includes a subset of potential metrology point locations on a substrate. The method including identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by the measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.
    Type: Application
    Filed: November 4, 2014
    Publication date: November 17, 2016
    Applicant: ASML Netherlands B.V.
    Inventors: Jochem Sebastiaan WILDENBERG, Everhardus Cornelis MOS
  • Publication number: 20160299438
    Abstract: A method of displaying a plurality of graphical user interface elements, each graphical user interface element representing a step in a measurement design, setup and/or monitoring process and each graphical user interface element enabling access by the user to further steps in the measurement design, setup and/or monitoring process for the associated step of the graphical user interface element, and displaying an indicator associated with one or more of the plurality of graphical user elements, the indicator indicating that a step in the measurement design, setup and/or monitoring process is not completed and/or that a key performance indicator associated with a step in the measurement design, setup and/or monitoring process has passed a threshold.
    Type: Application
    Filed: April 7, 2016
    Publication date: October 13, 2016
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Erik Mathijs Maria Crombag, Ajith Ganesan
  • Patent number: 9235141
    Abstract: An inspection apparatus measures a property of a substrate including a periodic structure. An illumination system provides a beam of radiation with an illumination profile including a plurality of illuminated portions. A radiation projector projects the beam of radiation onto the substrate. A detector detects radiation scattered from the periodic structure and separately detects first order diffracted radiation and at least one higher order of diffracted radiation of each of the illuminated portions. A processor determines the property of the substrate from the detected radiation. The plurality of illuminated portions are arranged such that first order diffracted radiation arising from one or more of the illuminated portions are not overlapped by zeroth order or first order diffracted radiation arising from any other of the illuminated portions.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: January 12, 2016
    Assignee: ASML Netherlands B.V.
    Inventors: Maurits Van Der Schaar, Arie Jeffrey Den Boef, Everhardus Cornelis Mos, Andreas Fuchs, Martyn John Coogans, Hendrik Jan Hidde Smilde
  • Patent number: 8982347
    Abstract: A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: March 17, 2015
    Assignee: ASML Netherlands B.V.
    Inventors: Xiuhong Wei, Franciscus Godefridus Casper Bijnen, Richard Johannes Franciscus Van Haren, Marcus Adrianus Van De Kerkhof, Everhardus Cornelis Mos, Hubertus Johannes Gertrudus Simons, Remi Daniel Marie Edart, David Deckers, Nicole Schoumans, Irina Lyulina
  • Patent number: 8972031
    Abstract: A higher-level controller can correct measured metrology data with residual error values as reported by a lower-level controller. This results in a more accurate process disturbance estimate. A method of control obtains, based on measurement sample definition, a first process variable of a system under control, determines a residual error using the first process variable and a first set point, controls the system using the residual error, obtains, based on the same sample definition, a second process variable, and adjusts the second process variable using the residual error. The method may also include determining, using the adjusted second process variable, one or more first set points for controlling the system by the low-level controller that may vary in correspondence with the sample definition.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 3, 2015
    Assignee: ASML Netherlands B.V.
    Inventors: Everhardus Cornelis Mos, Birgitt Noëlle Cornelia Liduine Hepp, Jasper Thijs Menger
  • Publication number: 20140354969
    Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.
    Type: Application
    Filed: November 22, 2012
    Publication date: December 4, 2014
    Applicant: ASML Netherlands B.V.
    Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Li Chung-Hsun
  • Patent number: 8887107
    Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: November 11, 2014
    Assignee: ASML Netherlands B.V.
    Inventors: Everhardus Cornelis Mos, Hubertus Johannes Gertrudus Simons, Peter Ten Berge, Nicole Schoumans, Michael Kubis, Paul Cornelis Hubertus Aben
  • Patent number: 8796684
    Abstract: A method is described for obtaining information for use in modeling of a lithographic process. A pattern feature is formed on a target portion of a substrate by projecting a beam of radiation onto the target portion of the substrate. For that target portion the lithographic process is characterized by one or both of a first property that varies in a first direction along a surface of the substrate, and a second property that varies in a second direction along a surface of the substrate. A property of the pattern feature is measured. Using the measured property of the pattern feature and at least one of the first and second properties, information is obtained for use in modeling the process. The lithographic process may be or include the projection of the beam of radiation onto the surface of the substrate.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: August 5, 2014
    Assignee: ASML Netherlands B.V.
    Inventors: Nicole Schoumans, Everhardus Cornelis Mos, Birgitt Noëlle Cornelia Liduine Hepp, Remco Jochem Sebastiaan Groenendijk