Patents by Inventor FA-CHIH CHEN

FA-CHIH CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964409
    Abstract: A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 23, 2024
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Wen-Ching Lin, Ting-Yu Wang, Fa-Chih Ke, Yu-Ling Lin, Wen-Hsiang Chen
  • Patent number: 11709415
    Abstract: A wavelength conversion module including a substrate, a wavelength conversion layer and at least one wing is provided. The substrate has a wavelength conversion area, a non-wavelength conversion area and at least one through hole. The through hole penetrates through the substrate and is located in the non-wavelength conversion area. The wavelength conversion layer is disposed in the wavelength conversion area of the substrate. The wing is disposed in the non-wavelength conversion area of the substrate. When the substrate reaches a first temperature range, the wing closes the through hole. When the substrate reaches a second temperature range, at least one airflow channel is formed between the wing and the through hole. The wavelength conversion module of the invention and the projection device using the same effectively reduce a temperature of the wavelength conversion module, and thus have better reliability.
    Type: Grant
    Filed: December 11, 2022
    Date of Patent: July 25, 2023
    Assignee: CORETRONIC CORPORATION
    Inventor: Fa-Chih Chen
  • Publication number: 20230194969
    Abstract: A wavelength conversion module including a substrate, a wavelength conversion layer and at least one wing is provided. The substrate has a wavelength conversion area, a non-wavelength conversion area and at least one through hole. The through hole penetrates through the substrate and is located in the non-wavelength conversion area. The wavelength conversion layer is disposed in the wavelength conversion area of the substrate. The wing is disposed in the non-wavelength conversion area of the substrate. When the substrate reaches a first temperature range, the wing closes the through hole. When the substrate reaches a second temperature range, at least one airflow channel is formed between the wing and the through hole. The wavelength conversion module of the invention and the projection device using the same effectively reduce a temperature of the wavelength conversion module, and thus have better reliability.
    Type: Application
    Filed: December 11, 2022
    Publication date: June 22, 2023
    Applicant: Coretronic Corporation
    Inventor: FA-CHIH CHEN
  • Patent number: 11662080
    Abstract: A wavelength conversion element includes a wavelength conversion plate, a fixing ring and an adhesive layer. The wavelength conversion plate has a supporting surface. The fixing ring is disposed on the supporting surface. The adhesive layer is configured to adhere the fixing ring to the wavelength conversion plate. The adhesive layer includes a first adhesive portion and a second adhesive portion, and a density of the first adhesive portion is greater than a density of the second adhesive portion. A projection device including the aforementioned wavelength conversion element is also provided. The wavelength conversion element and the projection device provided by the invention have the advantages of short manufacturing process time and low cost.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: May 30, 2023
    Assignee: Coretronic Corporation
    Inventors: Wei-Hua Kao, Fa-Chih Chen
  • Publication number: 20230015601
    Abstract: A wavelength conversion element includes a turntable, a first spoiler structure and a second spoiler structure. The turntable has a supporting surface and a back surface opposite to the supporting surface. The first spoiler structure is disposed on the supporting surface and arranged along a first track surrounding a center of the turntable. The second spoiler structure is disposed on the back surface and arranged along a second track surrounding the center. A centroid of at least one of the first spoiler structure and the second spoiler structure is deviated from the center. A projection device adopting the aforementioned wavelength conversion element is also provided. The wavelength conversion element of the invention can reduce the initial unbalance and the projection device of the invention can improve the durability.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 19, 2023
    Inventor: Fa-Chih Chen
  • Publication number: 20220412536
    Abstract: A wavelength conversion element includes a wavelength conversion plate, a fixing ring and an adhesive layer. The wavelength conversion plate has a supporting surface. The fixing ring is disposed on the supporting surface. The adhesive layer is configured to adhere the fixing ring to the wavelength conversion plate. The adhesive layer includes a first adhesive portion and a second adhesive portion, and a density of the first adhesive portion is greater than a density of the second adhesive portion. A projection device including the aforementioned wavelength conversion element is also provided. The wavelength conversion element and the projection device provided by the invention have the advantages of short manufacturing process time and low cost.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 29, 2022
    Inventors: Wei-Hua Kao, Fa-Chih Chen
  • Publication number: 20220373721
    Abstract: A prism module manufacturing method includes the following steps of: adjusting a first prism and a second prism to have a predetermined temperature difference; using an adhesive layer to be partially connected between the first prism and the second prism so that there is a gap between the first prism and the second prism, wherein the adhesive layer includes a glue material and a plurality of spacers arranged in the glue material. The invention further provides a prism module and a projection device having the prism module. The prism module and the manufacturing method thereof of the invention avoid the interference problem in the prism module so that the image quality and reliability of the projection device can be improved.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 24, 2022
    Inventor: FA-CHIH CHEN
  • Publication number: 20220019137
    Abstract: A wavelength conversion module includes a driving assembly, a wavelength conversion substrate, and a clamping element. The driving assembly is connected to the wavelength conversion substrate to drive the wavelength conversion substrate to rotate around a central axis of the driving assembly. The clamping element is attached to the wavelength conversion substrate along the central axis. At least one of the wavelength conversion substrate and the clamping element includes at least one recess and at least one through hole. A direction of the through hole is parallel to the central axis, and the clamping element, the recess, and the wavelength conversion substrate define at least one heat dissipation channel. The through hole is relatively adjacent to the central axis and is in communication with the heat dissipation channel.
    Type: Application
    Filed: May 17, 2021
    Publication date: January 20, 2022
    Applicant: Coretronic Corporation
    Inventor: FA-CHIH CHEN