Abstract: A hierarchical DRAM sensing apparatus and method which employs local bit line pairs and global bit lines. A word line selects the cells in a cluster of sense amplifiers, each of the amplifiers being associated with a pair of bit lines. One of the local bit lines is selected for coupling to global bit lines and a global sense amplifier. Clusters are located in a plurality of subarrays forming a bank with the global bit lines extending from each of the banks to the global sense amplifier.

Abstract: A NOR architecture for selecting a word line driver in a DRAM is disclosed. Complements of separately decoded addresses in the low, mid and high ranges are used to select a final word line driver. The output of the word line driver is at a potential negative with respect to ground for a deselected word line and a positive potential more positive than the power supply potential for a selected word line.

Abstract: A NAND architecture for selecting a word line driver in a DRAM is disclosed. Separately decoded addresses in the low, mid and high ranges are used to select a final word line driver. The output of the word line driver is at a potential negative with respect to ground for a deselected word line and a positive potential more positive than the power supply potential for a selected word line.

Abstract: Adaptive and dynamic stability enhancement for memories is described. In one example, the enhancement includes a plurality of sensors each located near a plurality of memory cells to provide a sensor voltage, a controller to receive the sensor voltage and provide a control signal based thereon, and a read/write assist circuit coupled to the controller to adjust a parameter applied to reading from and writing to a memory cell of the plurality of memory cells in response to the control signal.

Abstract: Techniques are disclosed for reducing area needed for implementing a memory array, such as SRAM arrays. The techniques may be embodied, for example, in a memory array design that includes a sense amplifier configured to operate in a reading mode for readout of memory cells and a writing mode for writing to memory cells. In addition, a common column multiplexer can be used for both read and write functions (as opposed to having separate multiplexers for reading and writing).

Abstract: Techniques are disclosed that allow for power conservation in integrated circuit memories, such as SRAM. The techniques can be embodied in circuitry that allows for floating of bitlines to eliminate or otherwise reduce power leakage associated with precharging bitlines. For instance, the techniques can be embodied in a bitline floating circuit having a single logic gate for qualifying the precharge control signal with a wake signal, so that precharging of the bitline does not occur if the wake signal is not in an active state. The techniques further allow for the elimination or reduction of unnecessary power consumption by the I/O circuitry or the memory array, such as when the memory array is not being accessed or when the array or a portion thereof is permanently disabled for yield recovery.

Abstract: In one embodiment of the present invention, a technique is provided to control leakage of a cache sub-array. Other embodiments are disclosed herein. A sleep and shut-off circuit is connected between a virtual supply terminal and a first physical supply terminal to reduce leakage from the cache sub-array when the cache sub-array is disabled in a shut-off mode. The cache sub-array is connected between the virtual supply terminal and a second physical supply terminal. An active circuit is connected to the sleep and shut-off circuit in parallel to enable the cache sub-array in a normal mode and to disable the cache sub-array in the shut-off mode.

Abstract: In some embodiments, a memory array is provided with cells that when written to or read from, can have modified supplies to enhance their read stability and/or write margin performance. Other embodiments may be disclosed and/or claimed.

Abstract: For one disclosed embodiment, circuitry may bias one or more wells of a substrate from a first state to a second state. Bias by the circuitry of one or more wells of the substrate to the second state may be boosted. Other embodiments are also disclosed.

Abstract: In embodiments of the present invention, a static random access memory (SRAM) device has an array of memory cells in columns and rows. An individual memory cell includes two PMOS pull-up devices coupled to two NMOS pull-down devices. In READ mode and/or STANDBY/NO-OP mode of a column, the two PMOS pull-up devices are effectively strengthened by forward biasing the PMOS n-wells or by utilizing a lower threshold voltage PMOS device by implanting a lower halo dose in the PMOS device. In WRITE mode of a column, the two PMOS pull-up devices are effectively weakened by reverse biasing the PMOS n-wells or by coupling the sources of the NMOS devices to virtual ground (VSSi).

Abstract: In one embodiment of the present invention, a technique is provided to control leakage of a cache sub-array. Other embodiments are disclosed herein. A sleep and shut-off circuit is connected between a virtual supply terminal and a first physical supply terminal to reduce leakage from the cache sub-array when the cache sub-array is disabled in a shut-off mode. The cache sub-array is connected between the virtual supply terminal and a second physical supply terminal. An active circuit is connected to the sleep and shut-off circuit in parallel to enable the cache sub-array in a normal mode and to disable the cache sub-array in the shut-off mode.

Abstract: In some embodiments, a memory array is provided with cells that when written to or read from, can have modified supplies to enhance their read stability and/or write margin performance. Other embodiments may be disclosed and/or claimed.

Abstract: A dynamic multi-voltage memory array features SRAM cells that are subjected to different biasing conditions, depending on the operating mode of the cells. The selected SRAM cell receives a first voltage when a read operation is performed, and receives a second voltage when a write operation is performed. By biasing the cell differently for the two distinct operations, a total decoupling of the read and write operations is achieved. The disclosed memory array, as well as future SRAM designs incorporating the multi-voltage capability thus avoid the conflicting requirements of read and write operations. Random single-bit failures of the memory array are reduced, due to the improvement in read stability and write margin.

Abstract: A dynamic multi-voltage memory array features SRAM cells that are subjected to different biasing conditions, depending on the operating mode of the cells. The selected SRAM cell receives a first voltage when a read operation is performed, and receives a second voltage when a write operation is performed. By biasing the cell differently for the two distinct operations, a total decoupling of the read and write operations is achieved. The disclosed memory array, as well as future SRAM designs incorporating the multi-voltage capability thus avoid the conflicting requirements of read and write operations. Random single-bit failures of the memory array are reduced, due to the improvement in read stability and write margin.

Abstract: In embodiments of the present invention, a static random access memory (SRAM) device has an array of memory cells in columns and rows. An individual memory cell includes two PMOS pull-up devices coupled to two NMOS pull-down devices. In READ mode and/or STANDBY/NO-OP mode of a column, the two PMOS pull-up devices are effectively strengthened by forward biasing the PMOS n-wells or by utilizing a lower threshold voltage PMOS device by implanting a lower halo dose in the PMOS device. In WRITE mode of a column, the two PMOS pull-up devices are effectively weakened by reverse biasing the PMOS n-wells or by coupling the sources of the NMOS devices to virtual ground (VSSi).

Abstract: An offset line to substantially cancel the capacitive coupling effects of a select line to a memory cell. When the select line transitions to cause a stored memory state in the memory cell to be placed onto a sense line, capacitive coupling from the select line to the sense line is substantially cancelled by capacitive coupling, of an opposite polarity, from an offset line to the sense line. Without the opposing effects of the offset line, the capacitive coupling from the select line would raise the pre-charge voltage level on the sense line, which would then require a longer time to discharge down to the input threshold of a sense gate that detects the stored state that was in the memory cell.

Abstract: An apparatus is described having a plurality of storage cells coupled between a first bit line and a second bit line. The apparatus also has a first transistor that pre-charges the first bit line and provides a first supply of current for one or more leakage currents drawn from the first bit line by any of the plurality of storage cells. The apparatus also has a second transistor that pre-charges the second bit line and provides a second supply of current for one or more leakage currents drawn from the second bit line by any of the plurality of storage cells.

Abstract: An offset line to substantially cancel the capacitive coupling effects of a select line to a memory cell. When the select line transitions to cause a stored memory state in the memory cell to be placed onto a sense line, capacitive coupling from the select line to the sense line is substantially cancelled by capacitive coupling, of an opposite polarity, from an offset line to the sense line. Without the opposing effects of the offset line, the capacitive coupling from the select line would raise the pre-charge voltage level on the sense line, which would then require a longer time to discharge down to the input threshold of a sense gate that detects the stored state that was in the memory cell.

Abstract: An apparatus is described having a plurality of storage cells coupled between a first bit line and a second bit line. The apparatus also has a first transistor that pre-charges the first bit line and provides a first supply of current for one or more leakage currents drawn from the first bit line by any of the plurality of storage cells. The apparatus also has a second transistor that pre-charges the second bit line and provides a second supply of current for one or more leakage currents drawn from the second bit line by any of the plurality of storage cells.

Abstract: An apparatus is described having a plurality of storage cells coupled between a first bit line and a second bit line. The apparatus also has a first transistor that pre-charges the first bit line and provides a first supply of current for one or more leakage currents drawn from the first bit line by any of the plurality of storage cells. The apparatus also has a second transistor that pre-charges the second bit line and provides a second supply of current for one or more leakage currents drawn from the second bit line by any of the plurality of storage cells.