Abstract: A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

Abstract: A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

Abstract: A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.

Abstract: A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

Abstract: A component carrier includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, a through-hole extending through the at least one electrically insulating layer structure, and highly thermally conductive material filling only part of the through-hole so that a recess is formed which is not filled with the highly thermally conductive material and which extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole. Where a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the conditions B>A and A>B/20.

Abstract: A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.

Abstract: A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.

Abstract: Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps: Provision of a printed circuit board, Application of a temporary protective layer onto at least a section of the surface of the circuit board, Creation of the cavity by way of penetration of the protective layer in the region of the cavity, Application of the reflector layer, Removal of the temporary protective layer.

Abstract: Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps: Provision of a printed circuit board, Application of a temporary protective layer onto at least a section of the surface of the circuit board, Creation of the cavity by way of penetration of the protective layer in the region of the cavity, Application of the reflector layer, Removal of the temporary protective layer.

Abstract: The invention relates to a multifunctional printed circuit board which is embodied so as to be a p.c.b. coated on at least one layer or one side with an electroconductive film, which printed circuit board is provided with one or more opto-electronically active components of the same or different wavelengths. In accordance with the invention, the optically active component is embodied so as to be a luminous field integrated in the printed circuit board, which field, during the manufacturing process of the printed circuit board, is screen-printed directly onto or above a suitably structured, electroconductive layer of the printed circuit board. By virtue thereof, in the course of the manufacture of the printed circuit board, it can be directly provided with suitable optical components, which will cooperate with the discrete components to be provided afterwards.

Abstract: The invention relates to the manufacture of electroluminescent elements on the basis of a so-called planar electrode arrangement (8a, 8b), whereby the modifications in accordance with the invention enable a substantial increase of the luminous power to be attained. To strengthen the electric field and hence increase the brightness, a special multilayer technology is employed. The electric field may be further strengthened by a film having a high dielectric constant. Preferably, a customary printed circuit board is used as the supporting board, so that the process in which the electroluminescent element is manufactured can be directly integrated in the printed-circuit-board manufacturing process. A further advantage of the invention is that the printed circuit boards provided with the optical components in accordance with the invention can be soldered by means of customary solder processes.