Patents by Inventor Feroze KHAN

Feroze KHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250053221
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to perform power-saving based on user presence, including a network interface to communicate with a cloud device, user presence detector circuitry to determine if a user is present or not present; workload distributor circuitry to distribute an AI workload to either first AI inference circuitry or second AI inference circuitry; and power circuitry to charge a battery at either a first charge level or a second charge level.
    Type: Application
    Filed: October 31, 2024
    Publication date: February 13, 2025
    Applicant: Intel Corporation
    Inventors: Tarakesava Reddy Koki, Prabhakar Subrahmanyam, Zhongsheng Wang, Feroze Khan, Phani Alaparthi, Shreedhar Shahapur, Venkata Mahesh Gunnam, Krishnendu Saha
  • Publication number: 20230020484
    Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.
    Type: Application
    Filed: September 28, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Feroze Khan, Arnab Sen, Jeff Ku, Samarth Alva
  • Publication number: 20220117122
    Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 14, 2022
    Inventors: Ali KALANTARIAN, Malcolm GUTENBURG, Andrew RANDELL, Mirui WANG, Tejas SHAH, Tamara J. LOW FOON, Jason LEE PACK, Yvan LARGE, Shahin AMIRI, Saanjali MAHARAJ, Srinivasarao KONAKALLA, Feroze KHAN, Nagaraj K, Babu TRIPLICANE GOPIKRISHNAN, Yogesh CHANNAIAH