Patents by Inventor Florian Moliere

Florian Moliere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9618567
    Abstract: Disclosed is in particular a device (2) for stressing an integrated circuit (1) including an electronic chip (10) mounted in a housing (12), the device including a source (20) of thermal stress. The device (2) also includes a thermally conductive coupling member (22), designed to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) includes an end (220) whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: April 11, 2017
    Assignee: EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE
    Inventors: Florian Moliere, Sebastien Morand, Alexandre Douin, Gerard Salvaterra, Christian Binois, Daniel Peyre
  • Patent number: 9058574
    Abstract: A method for estimating the lifetime of a deep-submicron-generation integrated electronic component, linked to a wear mechanism occurring in previously defined special conditions of use, said component being of a deep submicron type, with very large-scale integration, commercially available off the shelf, wherein one assumes that the same sample population always experiences a failure due to: the most predominant failure mechanism, during the period of useful life, described by an exponential law, and the most critical wear mechanism, represented by a Weibull distribution at the end of the previous period.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 16, 2015
    Assignee: EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE
    Inventors: Florian Moliere, Bruno Foucher
  • Publication number: 20130193995
    Abstract: Disclosed is in particular a device (2) for stressing an integrated circuit (1) including an electronic chip (10) mounted in a housing (12), the device including a source (20) of thermal stress. The device (2) also includes a thermally conductive coupling member (22), designed to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) includes an end (220) whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).
    Type: Application
    Filed: April 19, 2011
    Publication date: August 1, 2013
    Inventors: Florian Moliere, Sebastien Morand, Alexandre Douin, Gerard Salvaterra, Christian Binois, Daniel Peyre
  • Publication number: 20120143557
    Abstract: A large range of commercial VLSI Deep Submicron circuits are used in aeronautics for designs of electronic cards. Due to miniaturization, a continually increasing level of integration and the use of new materials in the foundries, the main failure mechanisms change whilst other ones appear. The lifetimes linked to these failure mechanisms are suspected of being shorter and shorter, so that predicting the lifetime becomes a significant challenge for the reliability of Deep Submicron (DSM) semiconductors. A new approach is proposed here, based on analyzing the technology so as to determine the potential risks to reliability with respect to the specific use of DSM components for avionics applications.
    Type: Application
    Filed: June 30, 2010
    Publication date: June 7, 2012
    Inventors: Florian Moliere, Bruno Foucher