Patents by Inventor Florian Schoen

Florian Schoen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10473683
    Abstract: A sensor element for thermal anemometry includes a semiconductor substrate and a thin-film diaphragm attached to the semiconductor substrate and having a front side and a rear side. A resistive heating element and a temperature-dependent resistor are attached to the front side of the thin-film diaphragm. In the area of the rear side of the thin-film diaphragm, the semiconductor substrate has a first recess. A silicon layer including a recess which merges with the first recess of the semiconductor substrate is located between the thin-film diaphragm and the semiconductor substrate.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: November 12, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Florian Schoen, Christian Lemier, Torsten Kramer
  • Publication number: 20170299622
    Abstract: A sensor element for thermal anemometry includes a semiconductor substrate and a thin-film diaphragm attached to the semiconductor substrate and having a front side and a rear side. A resistive heating element and a temperature-dependent resistor are attached to the front side of the thin-film diaphragm. In the area of the rear side of the thin-film diaphragm, the semiconductor substrate has a first recess. A silicon layer including a recess which merges with the first recess of the semiconductor substrate is located between the thin-film diaphragm and the semiconductor substrate.
    Type: Application
    Filed: April 7, 2017
    Publication date: October 19, 2017
    Inventors: Florian Schoen, Christian Lemier, Torsten Kramer
  • Patent number: 9758369
    Abstract: A manufacturing method for a MEMS element, by which both a microphone including a microphone capacitor and a pressure sensor including a measuring capacitor are implemented in the MEMS structure. The components of the microphone and pressure sensor are formed in parallel but independently in the layers of the MEMS structure. The pressure sensor diaphragm is structured from a first layer, which functions as a base layer for the microphone diaphragm. The fixed counter-electrode of the measuring capacitor is structured from an electrically conductive second layer which functions as a diaphragm layer of the microphone. The fixed pressure sensor counter-element is structured from third and fourth layers. The third layer functions in the area of the microphone structure as a sacrificial layer, the thickness of which in the area of the microphone structure determines the electrode distance of the microphone capacitor. The microphone counter-element is structured from the fourth layer.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: September 12, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Florian Schoen, Bernhard Gehl
  • Publication number: 20160304336
    Abstract: A manufacturing method for a MEMS element, by which both a microphone including a microphone capacitor and a pressure sensor including a measuring capacitor are implemented in the MEMS structure. The components of the microphone and pressure sensor are formed in parallel but independently in the layers of the MEMS structure. The pressure sensor diaphragm is structured from a first layer, which functions as a base layer for the microphone diaphragm. The fixed counter-electrode of the measuring capacitor is structured from an electrically conductive second layer which functions as a diaphragm layer of the microphone. The fixed pressure sensor counter-element is structured from third and fourth layers. The third layer functions in the area of the microphone structure as a sacrificial layer, the thickness of which in the area of the microphone structure determines the electrode distance of the microphone capacitor. The microphone counter-element is structured from the fourth layer.
    Type: Application
    Filed: April 14, 2016
    Publication date: October 20, 2016
    Inventors: Florian Schoen, Bernhard Gehl
  • Patent number: 9266719
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: February 23, 2016
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Patent number: 9083308
    Abstract: System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure fixed to the first anchor region, a first electrode adjacent the vibrating MEMS structure, a second electrode adjacent the vibrating MEMS structure wherein the vibrating MEMS structure is arranged between the first and the second electrode.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: July 14, 2015
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Mohsin Nawaz, Mihail Sararoiu
  • Patent number: 9035307
    Abstract: A 2-chip MEMS microphone component includes: at least one first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural component; an ASIC structural component having evaluation electronics for the microphone signal of the MEMS microphone structural component; and a housing having a sound opening. The MEMS microphone structural component is mounted within the housing and above the sound opening in such a way that the rear side of the microphone structure is acted on by the sound pressure. The ASIC structural component also includes a second MEMS microphone structure whose microphone signal is fed to the evaluation electronics.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 19, 2015
    Assignee: ROBERT BOSCH GMBH
    Inventors: Bernhard Gehl, Thomas Buck, Florian Schoen
  • Publication number: 20140191233
    Abstract: A 2-chip MEMS microphone component includes: at least one first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural component; an ASIC structural component having evaluation electronics for the microphone signal of the MEMS microphone structural component; and a housing having a sound opening. The MEMS microphone structural component is mounted within the housing and above the sound opening in such a way that the rear side of the microphone structure is acted on by the sound pressure. The ASIC structural component also includes a second MEMS microphone structure whose microphone signal is fed to the evaluation electronics.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 10, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Bernhard GEHL, Thomas Buck, Florian Schoen
  • Patent number: 8742873
    Abstract: Embodiments are related to micro-electromechanical system (MEMS) devices, systems and methods. In one embodiment, a MEMS resonating device comprises a resonator element configured to provide timing; and at least one passive temperature compensation structure arranged on the resonator element.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: June 3, 2014
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Winkler, Florian Schoen, Mohsin Nawaz
  • Patent number: 8703516
    Abstract: Micro-electromechanical system (MEMS) substrates, devices, and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a workpiece having an isolation ring in a top portion thereof, and a moveable element disposed within the isolation ring.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: April 22, 2014
    Assignee: Infineon Technologies AG
    Inventor: Florian Schoen
  • Publication number: 20130293319
    Abstract: Embodiments are related to micro-electromechanical system (MEMS) devices, systems and methods. In one embodiment, a MEMS resonating device comprises a resonator element configured to provide timing; and at least one passive temperature compensation structure arranged on the resonator element.
    Type: Application
    Filed: June 27, 2013
    Publication date: November 7, 2013
    Inventors: Bernhard WINKLER, Florian SCHOEN, Mohsin NAWAZ
  • Patent number: 8476990
    Abstract: Embodiments are related to micro-electromechanical system (MEMS) devices, systems and methods. In one embodiment, a MEMS resonating device comprises a resonator element configured to provide timing; and at least one passive temperature compensation structure arranged on the resonator element.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: July 2, 2013
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Winkler, Mohsin Nawaz, Florian Schoen
  • Publication number: 20120164774
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Application
    Filed: February 27, 2012
    Publication date: June 28, 2012
    Applicant: Infineon Technologies, AG
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Patent number: 8198690
    Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: June 12, 2012
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Wolfgang Raberg, Bernhard Winkler, Werner Weber
  • Publication number: 20120105173
    Abstract: System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure fixed to the first anchor region, a first electrode adjacent the vibrating MEMS structure, a second electrode adjacent the vibrating MEMS structure wherein the vibrating MEMS structure is arranged between the first and the second electrode.
    Type: Application
    Filed: January 12, 2012
    Publication date: May 3, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Florian Schoen, Mohsin Nawaz, Mihail Sararoiu
  • Patent number: 8115573
    Abstract: System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure fixed to the first anchor region, a first electrode adjacent the vibrating MEMS structure, a second electrode adjacent the vibrating MEMS structure wherein the vibrating MEMS structure is arranged between the first and the second electrode.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: February 14, 2012
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Mohsin Nawaz, Mihail Sararoiu
  • Publication number: 20120013412
    Abstract: Embodiments are related to micro-electromechanical system (MEMS) devices, systems and methods. In one embodiment, a MEMS resonating device comprises a resonator element configured to provide timing; and at least one passive temperature compensation structure arranged on the resonator element.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Inventors: Bernhard Winkler, Mohsin Nawaz, Florian Schoen
  • Patent number: 8049515
    Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Markus Loehndorf
  • Patent number: 8049490
    Abstract: Embodiments of the invention are related to MEMS devices and methods. In one embodiment, a MEMS device includes a resonator element comprising a magnetic portion having a fixed magnetization, and at least one sensor element comprising a magnetoresistive portion, wherein a magnetization and a resistivity of the magnetoresistive portion vary according to a proximity of the magnetic portion.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Loehndorf, Wolfgang Raberg, Florian Schoen
  • Patent number: 8040207
    Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference, an anchor region, and a plurality of beam elements coupling the anchor region and the resonator element. Further embodiments comprise additional devices, systems and methods.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: October 18, 2011
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Winkler, Mohsin Nawaz, Florian Schoen