Patents by Inventor Flynn Carson

Flynn Carson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
    Patent number: 6468830
    Abstract: A microelectronic package includes first and second microelectronic elements in spaced apart relationship which are electrically interconnected by a plurality of flexible leads and a layer of anisotropic conductive material. The flexible leads having one end attached to terminals on one of the microelectronic elements extends away therefrom having its opposite tip end electrically interconnected to contacts on the other microelectronic element by virtue of an interposed layer of the anisotropic conductive material.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: October 22, 2002
    Assignee: Tessera, Inc.
    Inventor: Flynn Carson
  • Semiconductor inner lead bonding tool
    Patent number: 5868301
    Abstract: A lead bonding tool for bonding leads to respective semiconductor chip contacts. The bonding tool having a substantially flat bonding surface region with a depression therein. The depression allows the tool to grasp the lead during the bonding step and further facilitate the transmission of energy from the tool to the lead/contact interface to form the bond. Certain embodiments of the lead also have grooves and/or guides which are adapted to capture and better align the elongated lead sections with their respective chip contacts during the bonding step.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: February 9, 1999
    Assignee: Tessera, Inc.
    Inventors: Thomas H. Distefano, Flynn Carson