Patents by Inventor Frédéric Heckmann
Frédéric Heckmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942088Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.Type: GrantFiled: April 14, 2021Date of Patent: March 26, 2024Assignee: Google LLCInventors: Frédéric Heckmann, Yau-Shing Lee, Robert Rose, Jun Hou, Patanjali Sastry Peri, Phanindraja Ancha
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Patent number: 11812583Abstract: This document describes a passive thermal-control system that is integrated into a mesh network device. The passive thermal-control system, which may include a heat sink and multiple heat spreaders, is such that heat originating with integrated circuit devices of the mesh network device and a speaker module of the mesh network device may be transferred to other components of the mesh network device, such as a housing component of the mesh network device. The heat may then be dissipated to an external environment to maintain a desired thermal profile of the mesh network device.Type: GrantFiled: October 6, 2020Date of Patent: November 7, 2023Assignee: Google LLCInventors: Frédéric Heckmann, Ihab A. Ali
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Publication number: 20230319979Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.Type: ApplicationFiled: June 8, 2023Publication date: October 5, 2023Applicant: Google LLCInventors: Yau-Shing Lee, Rolando Willcox Esparza, George Liu, Wing Tung Wong, Frédéric Heckmann, Vivian W. Tang
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Patent number: 11744007Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.Type: GrantFiled: November 5, 2021Date of Patent: August 29, 2023Assignee: Google LLCInventors: Yau-Shing Lee, Rolando Willcox Esparza, George Liu, Wing Tung Wong, Frédéric Heckmann, Vivian W. Tang
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Publication number: 20230239604Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.Type: ApplicationFiled: March 7, 2023Publication date: July 27, 2023Applicant: Google LLCInventors: Vivian W. Tang, Li Ya Wang, Yu-Ming Chen, Mihika Hemmady, DuanYing Lin, Yau-Shing Lee, Frédéric Heckmann
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Publication number: 20230139054Abstract: This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.Type: ApplicationFiled: October 8, 2020Publication date: May 4, 2023Applicant: Google LLCInventors: Ihab A. Ali, Frédéric Heckmann
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Patent number: 11627396Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.Type: GrantFiled: April 7, 2022Date of Patent: April 11, 2023Assignee: Google LLCInventors: Vivian W. Tang, Li Ya Wang, Yu-Ming Chen, Mihika Hemmady, DuanYing Lin, Yau-Shing Lee, Frédéric Heckmann
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Publication number: 20220404864Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.Type: ApplicationFiled: August 17, 2022Publication date: December 22, 2022Inventors: Xiaoping Qin, Christen Cameron Bilger, Frederic Heckmann, Frances Kwee, Justin Leong, James Castro
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Publication number: 20220400576Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.Type: ApplicationFiled: August 17, 2022Publication date: December 15, 2022Inventors: Frédéric Heckmann, Ihab A. Ali
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Patent number: 11513565Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.Type: GrantFiled: April 24, 2019Date of Patent: November 29, 2022Assignee: Google LLCInventors: Xiaoping Qin, Christen Cameron Bilger, Frederic Heckmann, Frances Kwee, Justin Leong, James Castro
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Patent number: 11457545Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.Type: GrantFiled: September 28, 2020Date of Patent: September 27, 2022Assignee: Google LLCInventors: Frédéric Heckmann, Ihab A. Ali
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Publication number: 20220232305Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.Type: ApplicationFiled: April 7, 2022Publication date: July 21, 2022Applicant: Google LLCInventors: Vivian W. Tang, Li Ya Wang, Yu-Ming Chen, Mihika Hemmady, DuanYing Lin, Yau-Shing Lee, Frédéric Heckmann
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Patent number: 11363359Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.Type: GrantFiled: August 24, 2020Date of Patent: June 14, 2022Assignee: Google LLCInventors: Vivian W. Tang, Li Ya Wang, Yu-Ming Chen, Mihika Hemmady, DuanYing Lin, Yau-Shing Lee, Frédéric Heckmann
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Publication number: 20220109222Abstract: This document describes a passive thermal-control system that is integrated into a mesh network device. The passive thermal-control system, which may include a heat sink and multiple heat spreaders, is such that heat originating with integrated circuit devices of the mesh network device and a speaker module of the mesh network device may be transferred to other components of the mesh network device, such as a housing component of the mesh network device. The heat may then be dissipated to an external environment to maintain a desired thermal profile of the mesh network device.Type: ApplicationFiled: October 6, 2020Publication date: April 7, 2022Applicant: Google LLCInventors: Frédéric Heckmann, Ihab A. Ali
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Publication number: 20220104386Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.Type: ApplicationFiled: September 28, 2020Publication date: March 31, 2022Applicant: Google LLCInventors: Frédéric Heckmann, Ihab A. Ali
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Publication number: 20220061128Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.Type: ApplicationFiled: November 5, 2021Publication date: February 24, 2022Applicant: Google LLCInventors: Yau-Shing Lee, Rolando Willcox Esparza, George Liu, Wing Tung Wong, Frédéric Heckmann, Vivian W. Tang
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Patent number: 11202341Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.Type: GrantFiled: August 24, 2020Date of Patent: December 14, 2021Assignee: Google LLCInventors: Yau-Shing Lee, Rolando Willcox Esparza, George Liu, Wing Tung Wong, Frédéric Heckmann, Vivian W. Tang
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Publication number: 20210233531Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.Type: ApplicationFiled: April 14, 2021Publication date: July 29, 2021Applicant: Google LLCInventors: Frédéric Heckmann, Yau-Shing Lee, Robert Rose, Jun Hou, Patanjali Sastry Peri, Phanindraja Ancha
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Patent number: 11011168Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.Type: GrantFiled: February 25, 2019Date of Patent: May 18, 2021Assignee: Google LLCInventors: Frédéric Heckmann, Yau-Shing Lee, Robert Rose, Jun Hou, Patanjali Peri, Phanindraja Ancha
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Publication number: 20210099779Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.Type: ApplicationFiled: August 24, 2020Publication date: April 1, 2021Applicant: Google LLCInventors: Vivian W. Tang, Li Ya Wang, Yu-Ming Chen, Mihika Hemmady, DuanYing Lin, Yau-Shing Lee, Frédéric Heckmann