Abstract: A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.

Abstract: A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes s a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.

Abstract: A probe card is disclosed. The probe card includes a top plate, a disc, a removable plate and multiple micro probes. One of the micro probes includes a curved segment and a linear segment connected to each other at an angle stop. The linear segment is shorter than the curved segment. The top plate includes a set of holes formed therein, and one of the holes is configured to receive the curved segment of the micro probe. The disc includes a set of holes formed therein, and one of the holes is configured to receive the linear segment of the micro probe at the angle stop. The removable plate is removably connected to the disc, and the removable plate includes a set of holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe.

Abstract: A probing assembly is disclosed. The probing assembly includes an interface board, a structural support element, a trace support element and a probe support element. The structural support element provides structural and mechanical support to the trace support element. The trace support element includes a body and multiple trace lines located on the body. The probe support element includes a plate having multiple guide holes in which micro probes are inserted. At least one of the micro pins is in contact with one of the trace lines within the trace support element. A set of rails are utilized to secure the probe support element, the trace support element and the structural support element to the interface board.

Abstract: A probing assembly is disclosed. The probing assembly includes an interface board, a structural support element, a trace support element and a probe support element. The structural support element provides structural and mechanical support to the trace support element. The trace support element includes a body and multiple trace lines located on the body. The probe support element includes a plate having multiple guide holes in which micro probes are inserted. At least one of the micro pins is in contact with one of the trace lines within the trace support element. A set of rails are utilized to secure the probe support element, the trace support element and the structural support element to the interface board.

Abstract: Embodiments of the present invention improve probes and probe assemblies. In one embodiment, the present invention includes a probe test head comprising a plurality of novel probes inserted in an array of holes in upper and lower dies of the assembly. The novel assembly includes a novel alignment layer for easy repair and maintenance of the probes.

Abstract: Embodiments of the present invention improve probes and probe assemblies. In one embodiment, the present invention includes a probe test head comprising a plurality of novel probes inserted in an array of holes in upper and lower dies of the assembly. The novel assembly includes a novel alignment layer for easy repair and maintenance of the probes.

Abstract: Embodiments of the present invention improve probes and probe assemblies. In one embodiment the present invention includes a micro probe comprising a lower contact end including a lower tip, an upper contact end, and a curved intermediate region between the upper contact end and lower contact end.

Abstract: A space transformer for electrically interconnecting a probe head to a printed circuit board, which includes a flexible multilayer circuit with device under test contact pads formed on a first side and printed circuit board contact pads formed on a second side. Electrically conductive circuit traces extend between the device under test contact pads and the printed circuit board contact pads. A shim plate is fastened to a periphery of the first side of the flexible multilayer circuit and a bottom plate is fastened to a periphery of the second side of the flexible multilayer circuit. The bottom plate has a plurality of internal apertures are aligned with the printed circuit board contact pads separated by bottom plate stanchions that are aligned with the device under test contact pads. A plurality of interconnects are bonded and electrically interconnected to the printed circuit contact pads and extend through the internal apertures.

Abstract: A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes as one or more masks; a step for fabricating the plurality of probes using the mask; and disposing the plurality of probes through corresponding holes in a first die and a second die. The step for fabricating the plurality of probes may include one of photo-etching and photo-defined electroforming.

Abstract: A method of fabricating a plurality of micro probes comprising the steps of defining the shapes of a plurality of probes as a mask, applying a photoresist to a surface of a metal foil, overlaying the mask on the metal foil, exposing the photoresist to light passed through the mask, developing the photoresist, removing a portion of the photoresist to expose a portion of the metal foil, applying an etcher to the surface of the metal foil to remove the exposed portion to produce a plurality of probes, and chemically polishing and plating the plurality of probes.

Abstract: A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes as one or more masks; a step for fabricating the plurality of probes using the mask; and disposing the plurality of probes through corresponding holes in a first die and a second die. The step for fabricating the plurality of probes may include one of photo-etching and photo-defined electroforming.

Abstract: A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion metal, such as Invar, a 36% nickel—64% iron alloy. By orienting the metallic grains of the laminated metal layers to be off-set from the orientation of metallic grains of adjacent metallic foil layers, increased strength and flatness is achieved.

Abstract: An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of Invar®, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.

Abstract: A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion metal, such as Invar, a 36% nickel-64% iron alloy. By orienting the metallic grains of the laminated metal layers to be off-set from the orientation of metallic grains of adjacent metallic foil layers, increased strength and flatness is achieved.

Abstract: An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of Invar®, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The Invar spacers may be composed of Invar foils adhered to one another in a laminated structure. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.

Abstract: An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of Invar®, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The Invar spacers may be composed of Invar foils adhered to one another in a laminated structure. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.

Abstract: An improved vertical pin probing device is constructed using Invar, which substantially matches the coefficient of thermal expansion of the silicon wafer being probed. Spaced dies with Invar foils supporting the probe pins are coated with wear-resistant dielectric materials having lubricity to permit the probe pins to slide in the holes during probing.

Abstract: An interconnection device used with test probe equipment for connecting a vertical-pin integrated circuit probing device to external test equipment. The interconnection device comprises a probe card with a pattern of contacts, a mounting plate adjustably mounted to the probe card and a space transformer member attached to both the mounting plate and the probe card. The space transformer carries traces which connect a small pattern of pins on the probing device with a larger pattern of conductors on the probe card. The space transformer is a laminated impedance-matching member comprising two layers of beryllium copper separated by a thin dielectric adhesive.

Abstract: A probe assembly for testing an integrated circuit includes a probe card of insulating material with a central opening, a rectangular frame with a smaller opening attached to the probe card, four separate probe wings each comprising a flexible laminated member having a conductive ground plane sheet, an adhesive dielectric film adhered to the ground plane, and probe wing traces of spring alloy copper on the dielectric film. Each probe wing has a cantilevered leaf spring portion extending into the central opening and terminates in a group of aligned individual probe fingers provided by respective terminating ends of said probe wing traces. The probe fingers have tips disposed substantially along a straight line and are spaced to correspond to the spacing of respective contact pads along the edge of an IC being tested. Four spring clamps each have a cantilevered portion which contact the leaf spring portion of a respective probe wing, so as to provide an adjustable restraint for one of the leaf spring portions.