Abstract: An ECL input circuit which receives an ECL input signal and which generates, in response to the input signal, a CMOS-compatible output signal. The input circuit includes a bipolar transistor, having its emitter region adapted to receive the ECL input signal, having its collector region coupled to a first current source, and having its base region connected to a second current source. The circuit further includes an output circuit which is coupled to the collector region of the bipolar transistor for providing the CMOS-compatible signal.

Abstract: A programmable PLA circuit in which an interlaced AND/OR array is provided which has both common input and common output lines. Separate AND and OR functions are generated during two different timing intervals such that both of the logical arrays can physically share input and output circuit elements. A binary adder is described in which pairs of array output lines are applied to the same Exclusive-NOR circuits during the two time intervals to provide the Exclusive-NOR of product terms during the AND array time interval and to provide the Exclusive-NOR of sum of product terms or the sum of the Exclusive-NOR of product terms during the second time interval.

Abstract: This invention provides improved non-volatile semiconductor memories which include a volatile circuit coupled to a non-volatile device having a floating gate and first and second control gates capacitively coupled to the floating gate with a charge injector structure disposed between the floating gate and one of the two control gates. The volatile circuit may be a dynamic one-device cell or a static cell such as a conventional flip-flop or latch cell.

Abstract: An electrically alterable double dense memory is provided which includes a field effect transistor having first and second spaced apart diffusion regions of a first conductivity defining a channel region at the surface of a semiconductor substrate having a second conductivity. First and second floating gates are disposed over the first and second diffusion regions, respectively, and each extends over an end of the channel region. First and second dual charge injector structures or enhanced conduction insulators are disposed between the first and second floating gates and a common control gate of the transistor. A word line is connected to the control gate and first and second bit lines are connected to the first and second diffusion regions. By applying appropriate pulses to the word and bit lines, a selected floating gate can be charged to alter the conductivity of the end of the channel region associated with the selected floating gate and then discharged at will.

Abstract: A memory system is provided for charging and discharging small cells each of which has only three terminals with a charge injector controlled by a low single polarity voltage. Each of the cells includes a transistor having a current carrying electrode and a floating gate, with a control gate arranged so that a first capacitor is serially connected with a second capacitor between the current carrying electrode and the control gate, with one of the capacitors having a substantially larger capacitance than that of the other capacitor and with the other capacitor including a charge injector. The common point between the first and second capacitors is connected to the floating gate. The charge injector may include a single graded or stepped composition region or two such regions disposed near opposite faces or plates of the other capacitor, or more particularly the injector may include silicon rich regions near one or both faces of a layer of silicon dioxide.

Abstract: A suitable substrate is provided to which is applied a metal electrically conductive film electrode. The substrate and electrically conductive electrode film are then exposed to ion beam implantation of O+ or N+ ions to impregnate the surface of the metal electrode with O+ or N+ ions. Thereafter, the substrate and electrically conductive film having implanted O+ or N+ ions is annealed so as to stabilize the oxide structure which has been implanted into the surface of the electrically conductive film to provide an ultra-thin dielectric film.

Abstract: A semiconductor structure, formed within a recessed oxide isolation region, includes a semiconductor substrate of a first conductivity type within which a collector of opposite conductivity type is formed below the surface of the substrate and extending in part to the surface of the substrate for ease of contact. A first layer of doped polycrystalline silicon or polysilicon is formed on a first portion of the surface of the substrate and in electrical contact with the substrate which acts as the base of a transistor. The first polysilicon layer is oxidized to form an outer insulating layer thereover. A second doped polysilicon layer is disposed over the outer insulating layer onto a second portion of the surface of the substrate so as to be spaced from the first portion by only the thickness of the outer insulating layer on the first polysilicon layer. The dopant in the second polysilicon layer is driven into the surface of the semiconductor substrate to form an emitter therein.