Patents by Inventor Franciscus Bernardus Maria Van Bilsen
Franciscus Bernardus Maria Van Bilsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210215622Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.Type: ApplicationFiled: March 8, 2021Publication date: July 15, 2021Applicant: ASML Netherlands B.V.Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Chung-Hsun Li
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Patent number: 10996176Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.Type: GrantFiled: June 18, 2020Date of Patent: May 4, 2021Assignee: ASML Netherlands B.V.Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Chung-Hsun Li
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Publication number: 20200319118Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.Type: ApplicationFiled: June 18, 2020Publication date: October 8, 2020Applicant: ASML Netherlands B.V.Inventors: Wouter Lodewijk ELINGS, Franciscus Bernardus Maria VAN BILSEN, Christianus Gerardus Maria DE MOL, Everhardus Cornelis MOS, Hoite Pieter Theodoor TOLSMA, Peter TEN BERGE, Paul Jacques VAN WIJNEN, Leonard us Henricus Marie VERSTAPPEN, Gerald DICKER, Reiner Maria JUNGBLUT, Chung-Hsun LI
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Patent number: 10746668Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.Type: GrantFiled: April 10, 2019Date of Patent: August 18, 2020Assignee: ASML Netherlands B.V.Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Chung-Hsun Li
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Publication number: 20190301850Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.Type: ApplicationFiled: April 10, 2019Publication date: October 3, 2019Applicant: ASML Netherlands B.V.Inventors: Wouter Lodewijk ELINGS, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Chung-Hsun Li
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Patent number: 10317191Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.Type: GrantFiled: February 14, 2017Date of Patent: June 11, 2019Assignee: ASML Netherlands B.V.Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Chung-Hsun Li
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Publication number: 20170160073Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.Type: ApplicationFiled: February 14, 2017Publication date: June 8, 2017Applicant: ASML Netherlands B.V.Inventors: Wouter Lodewijk ELINGS, Franciscus Bernardus Maria VAN BILSEN, Christianus Gerardus Maria DE MOL, Everhardus Cornelis MOS, Hoite Pieter Theodoor TOLSMA, Peter TEN BERGE, Paul Jacques VAN WIJNEN, Leonardus Henricus Marie VERSTAPPEN, Gerald DICKER, Reiner Maria JUNGBLUT, Li CHUNG-HSUN
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Patent number: 9594029Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.Type: GrantFiled: November 22, 2012Date of Patent: March 14, 2017Assignee: ASML Netherlands B.V.Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Li Chung-Hsun
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Publication number: 20140354969Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.Type: ApplicationFiled: November 22, 2012Publication date: December 4, 2014Applicant: ASML Netherlands B.V.Inventors: Wouter Lodewijk Elings, Franciscus Bernardus Maria Van Bilsen, Christianus Gerardus Maria De Mol, Everhardus Cornelis Mos, Hoite Pieter Theodoor Tolsma, Peter Ten Berge, Paul Jacques Van Wijnen, Leonardus Henricus Marie Verstappen, Gerald Dicker, Reiner Maria Jungblut, Li Chung-Hsun
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Patent number: 8345245Abstract: A lithographic apparatus has a plurality of different alignment arrangements that are used to perform an alignment measurement on the same mark(s) by: detecting a first alignment mark located on an object and producing a first alignment signal by a first detector; detecting the first mark and producing a second alignment signal by a second detector using a different alignment measurement than the first detector; receiving the first alignment signal from the first detector; calculating a first position of the at least first mark based on the first alignment signal; receiving the second alignment signal from the second detector; calculating a further first position of the at least first mark based on the second alignment signal.Type: GrantFiled: September 21, 2011Date of Patent: January 1, 2013Assignee: ASML Netherlands B.V.Inventor: Franciscus Bernardus Maria Van Bilsen
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Patent number: 8139217Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.Type: GrantFiled: December 23, 2010Date of Patent: March 20, 2012Assignee: ASML Netherlands B.V.Inventors: Franciscus Bernardus Maria Van Bilsen, Jacobus Burghoorn, Richard Johannes Franciscus Van Haren, Paul Christiaan Hinnen, Hermanus Gerardus Van Horssen, Jeroen Huijbregtse, Andre Bernardus Jeunink, Henry Megens, Ramon Navarro Y Koren, Hoite Pieter Theodoor Tolsma, Hubertus Johannes Gertrudus Simons, Johny Rutger Schuurhuis, Sicco Ian Schets, Brian Young Bok Lee, Allan Reuben Dunbar
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Publication number: 20120008126Abstract: A lithographic apparatus has a plurality of different alignment arrangements that are used to perform an alignment measurement on the same mark(s) by: detecting a first alignment mark located on an object and producing a first alignment signal by a first detector; detecting the first mark and producing a second alignment signal by a second detector using a different alignment measurement than the first detector; receiving the first alignment signal from the first detector; calculating a first position of the at least first mark based on the first alignment signal; receiving the second alignment signal from the second detector; calculating a further first position of the at least first mark based on the second alignment signal.Type: ApplicationFiled: September 21, 2011Publication date: January 12, 2012Applicant: ASML Netherlands B.V.Inventor: Franciscus Bernardus Maria VAN BILSEN
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Patent number: 8018594Abstract: A lithographic apparatus has a plurality of different alignment arrangements that are used to perform an alignment measurement on the same mark(s) by: detecting a first alignment mark located on an object and producing a first alignment signal by a first detector; detecting the first mark and producing a second alignment signal by a second detector using a different alignment measurement than the first detector; receiving the first alignment signal from the first detector; calculating a first position of the at least first mark based on the first alignment signal; receiving the second alignment signal from the second detector; calculating a further first position of the at least first mark based on the second alignment signal.Type: GrantFiled: October 16, 2009Date of Patent: September 13, 2011Assignee: ASML Netherlands B.V.Inventor: Franciscus Bernardus Maria Van Bilsen
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Publication number: 20110128520Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.Type: ApplicationFiled: December 23, 2010Publication date: June 2, 2011Applicant: ASML NETHERLANDS B.V.Inventors: Franciscus Bernardus Maria Van Bilsen, Jacobus Burghoorn, Richard Johannes Franciscus Van Haren, Paul Christiaan Hinnen, Hermanus Gerardus Van Horssen, Jeroen Huijbregtse, Andre Bernardus Jeunink, Henry Megens, Ramon Navarro Y Koren, Hoite Pieter Theodoor Tolsma, Hubertus Johannes Gertrudus Simons, Johny Rutger Schuurhuis, Sicco Ian Schets, Brian Young Bok Lee, Allan Reuben Dunbar
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Patent number: 7894063Abstract: A method includes determining relative positional relationships between applied fields on a substrate, one of the applied fields including a first field; in a lithographic apparatus, using an alignment apparatus to obtain at least one absolute positional relationship between the position of at least the first field of the substrate and a part of the lithographic apparatus; and determining an absolute positional relationship between at least one field, other than the first field, and a part of the lithographic apparatus using the relative positional relationships and the at least one obtained absolute relationship.Type: GrantFiled: October 27, 2008Date of Patent: February 22, 2011Assignee: ASML Netherland B.V.Inventors: Franciscus Bernardus Maria Van Bilsen, Everhardus Cornelis Mos
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Patent number: 7880880Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.Type: GrantFiled: December 6, 2005Date of Patent: February 1, 2011Assignee: ASML Netherlands B.V.Inventors: Franciscus Bernardus Maria Van Bilsen, Jacobus Burghoorn, Richard Johannes Franciscus Van Haren, Paul Christiaan Hinnen, Hermanus Gerardus Van Horssen, Jeroen Huijbregtse, Andre Bernardus Jeunink, Henry Megens, Ramon Navarro Y Koren, Hoite Pieter Theodoor Tolsma, Hubertus Johannes Gertrudus Simons, Johny Rutger Schuurhuis, Sicco Ian Schets, Brian Young Bok Lee, Allan Reuben Dunbar
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Patent number: 7763403Abstract: A system and method are provided for determining an overlay of a first layer N?1 and a second layer N that are positioned one over the other on a substrate. The first layer includes a first overlay portion. The second layer includes a first complementary overlay portion. The first overlay portion and first complementary overlay portion are arranged to form an overlay mark for determining the overlay of the first and second layers. In the second layer a stitching portion and a complementary stitching portion are formed. The stitching portion and complementary stitching portion are arranged to form a stitching mark for determining a stitching overlay between the second layer and an adjacent second layer, with the adjacent second layer being positioned adjacent to the second layer.Type: GrantFiled: December 10, 2009Date of Patent: July 27, 2010Assignee: ASML Netherlands B.V.Inventor: Franciscus Bernardus Maria Van Bilsen
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Publication number: 20100091297Abstract: A lithographic apparatus has a plurality of different alignment arrangements that are used to perform an alignment measurement on the same mark(s) by: detecting a first alignment mark located on an object and producing a first alignment signal by a first detector; detecting the first mark and producing a second alignment signal by a second detector using a different alignment measurement than the first detector; receiving the first alignment signal from the first detector; calculating a first position of the at least first mark based on the first alignment signal; receiving the second alignment signal from the second detector; calculating a further first position of the at least first mark based on the second alignment signal.Type: ApplicationFiled: October 16, 2009Publication date: April 15, 2010Applicant: ASML Netherlands B.V.Inventor: Franciscus Bernardus Maria VAN BILSEN
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Publication number: 20100085548Abstract: A system and method are provided for determining an overlay of a first layer N?1 and a second layer N that are positioned one over the other on a substrate. The first layer includes a first overlay portion. The second layer includes a first complementary overlay portion. The first overlay portion and first complementary overlay portion are arranged to form an overlay mark for determining the overlay of the first and second layers. In the second layer a stitching portion and a complementary stitching portion are formed. The stitching portion and complementary stitching portion are arranged to form a stitching mark for determining a stitching overlay between the second layer and an adjacent second layer, with the adjacent second layer being positioned adjacent to the second layer.Type: ApplicationFiled: December 10, 2009Publication date: April 8, 2010Applicant: ASML NETHERLANDS B.V.Inventor: Franciscus Bernardus Maria VAN BILSEN
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Patent number: 7651825Abstract: A system and method are provided for determining an overlay of a first layer N-1 and a second layer N that are positioned one over the other on a substrate. The first layer includes a first overlay portion. The second layer includes a first complementary overlay portion. The first overlay portion and first complementary overlay portion are arranged to form an overlay mark for determining the overlay of the first and second layers. In the second layer a stitching portion and a complementary stitching portion are formed. The stitching portion and complementary stitching portion are arranged to form a stitching mark for determining a stitching overlay between the second layer and an adjacent second layer, with the adjacent second layer being positioned adjacent to the second layer.Type: GrantFiled: March 1, 2006Date of Patent: January 26, 2010Assignee: ASML Netherlands B.V.Inventor: Franciscus Bernardus Maria Van Bilsen