Abstract: A nonvolatile memory device has a “split-voltage” architecture and includes columns of memory words formed on each row by groups of memory cells. All state transistors for memory cells of a memory word are gate controlled by a control element. All control elements of a same row are controlled by a first control signal generated by a first row control circuit in response to a set-reset (SR) latch output signal output for a selected row. In order to write a piece of data in a memory word, the first row control circuit confers onto the first control signal an erasing voltage corresponding to a first logic state of the first control signal and then a programming voltage corresponding to a second logic state of the first control signal without modifying, between erasing and programming the memory word, the state of the latch output signal for the selected row.

Abstract: The present description concerns attribution, on a communication over an I2C bus, of a first address to a first device by a second device, wherein the second device sends the first address over the I2C bus and, if the second device receives no acknowledgment data, then the first device records the first address.

Abstract: The latch device includes an RS type latch flip-flop capable of being supplied between a first supply voltage and a second supply voltage which is lower than the first supply voltage and having first and second flip-flop inputs and a flip-flop output connected to the output terminal. A control module positions the latch flip-flop in a set state or in a reset state when the first supply voltage has a first value which is lower than the low voltage then, the latch flip-flop being positioned, confers the high voltage on the first supply voltage and the low voltage on the second supply voltage and outputs and maintains the high voltage or the low voltage on the flip-flop output while avoiding outputting a prohibited logic state at the two flip-flop inputs.

Abstract: A test circuit and a method for testing an integrated circuit are provided. The integrated circuit includes a test circuit. The test circuit includes a conductive track extending over at least a portion of the periphery of the integrated circuit, at least one component and an activation circuit adapted to deviating an input data signal into the conductive track during a test mode, and to transmitting the input data signal to the at least one component during a normal operating mode.

Abstract: An integrated circuit comprises a memory device including at least one memory point having a volatile memory cell and a single non-volatile memory cell coupled together to a common node.

Abstract: The present description concerns an electrostatic discharge protection device including a first clipping circuit coupled between a first node and a second node and a second active clipping circuit, series-coupled with a first resistor, the second clipping circuit and the first resistor being coupled between the first and second nodes, the second clipping circuit including a field-effect transistor having a metal-oxide-semiconductor structure.

Abstract: An EEPROM memory integrated circuit includes memory cells arranged in a memory plane. Each memory cell includes an access transistor in series with a state transistor. Each access transistor is coupled, via its source region, to the corresponding source line and each state transistor is coupled, via its drain region, to the corresponding bit line. The floating gate of each state transistor rests on a dielectric layer having a first part with a first thickness, and a second part with a second thickness that is less than the first thickness. The second part is located on the source side of the state transistor.

Abstract: The integrated circuit comprises at least one transistor including a separate gate structure and field plate, disposed on a front face of a semiconductor substrate, and a doped conduction region in the semiconductor substrate located plumb with an edge of the gate structure and plumb with an edge of the field plate.

Abstract: An EEPROM memory integrated circuit includes memory cells arranged in a memory plane. Each memory cell includes an access transistor in series with a state transistor. Each access transistor is coupled, via its source region, to the corresponding source line and each state transistor is coupled, via its drain region, to the corresponding bit line. The floating gate of each state transistor rests on a dielectric layer having a first part with a first thickness, and a second part with a second thickness that is less than the first thickness. The second part is located on the source side of the state transistor.

Abstract: A method for writing to electrically erasable and programmable non-volatile memory and a corresponding integrated circuit are disclosed. In an embodiment a method includes operatively connecting a filter circuit belonging to a communication interface to an oscillator circuit, wherein the communication interface is physically connected to a bus, generating, by the oscillator circuit, an oscillation signal and regulating the oscillation signal by the filter circuit so as to generate a clock signal for timing a write cycle.

Abstract: An embodiment integrated circuit comprises a memory device including at least one memory point having a volatile memory cell and a single non-volatile memory cell coupled together to a common node.

Abstract: An electronic chip includes a seal ring whose shape is contained within a rectangle, of a width equal to a maximum width of the electronic chip and a length equal to a maximum length of the electronic chip. At least one test pad is arranged at least partially within the rectangle. The test pad is shared with at least one other adjacent electronic chip.

Abstract: The integrated circuit of a non-volatile memory of the electrically erasable and programmable type includes memory cells, each memory cell having a state transistor including a gate structure comprising a control gate and a floating gate disposed on a face of a semiconductor well, as well as a source region and a drain region in the semiconductor well. The drain region includes a first capacitive implant region positioned predominantly under the gate structure and a lightly doped region positioned predominantly outside the gate structure. The source region includes a second capacitive implant region positioned predominantly outside the gate structure, the source region not including a lightly doped region.

Abstract: An integrated circuit comprises a memory device including at least one memory point having a volatile memory cell and a single non-volatile memory cell coupled together to a common node, and a single selection transistor coupled between the common node and a single bit line. A first output of the volatile memory cell is coupled to the common node, and a second output of the volatile memory cell, complementary to the first output, is not connected to any node outside the volatile memory cell.

Abstract: The present description concerns attribution, on a communication over an I2C bus, of a first address to a first device by a second device, wherein the second device sends the first address over the I2C bus and, if the second device receives no acknowledgment data, then the first device records the first address.

Abstract: The present description concerns an electrostatic discharge protection device including a first clipping circuit coupled between a first node and a second node and a second active clipping circuit, series-coupled with a first resistor, the second clipping circuit and the first resistor being coupled between the first and second nodes, the second clipping circuit including a field-effect transistor having a metal-oxide-semiconductor structure.

Abstract: A non-volatile memory device includes a substrate, a plurality of memory words, a control block, a first electrically-conducting link, and a plurality of second electrically-conducting links. The substrate includes a substantially planar surface. The memory words include B memory words disposed at the substantially planar surface. The control block includes B control elements disposed at the substantially planar surface. The first electrically-conducting link is disposed in a first plane parallel to the substantially planar surface. The first electrically-conducting link connects one of the B control elements to a memory word of the memory words. The plurality of second electrically-conducting links includes B-1 second electrically-conducting links respectively connecting B-1 remaining control elements to B-1 corresponding memory words of the plurality of memory words.

Abstract: The memory device of the electrically-erasable programmable read-only memory type comprises write circuitry designed to carry out a write operation in response to receiving a command for writing at least one selected byte in at least one selected memory word of the memory plane, the write operation comprising an erase cycle followed by a programming cycle, and configured for generating, during the erase cycle, an erase voltage in the memory cells of all the bytes of the at least one selected memory word, and an erase inhibit potential configured, with respect to the erase voltage, for preventing the erasing of the memory cells of the non-selected bytes of the at least one selected memory word, which are not the at least one selected byte.

Abstract: A contactless transponder includes a non-volatile static random access memory including memory points. Each memory point is formed by a volatile memory cell and a non-volatile memory cell. A protocol processing circuit receives data and stores the received data in the volatile memory cells of the memory. A write processing circuit is configured, at the end of the reception and storage of the data, to record, in a single write cycle, the data from the volatile memory cells to the non-volatile memory cells of the respective memory points.

Abstract: A method for encoding a data value to be transmitted on an SPI serial bus includes an operation to modify a status register of a memory, at least at one chosen time instant, as a function of all or part of the data value to be transmitted.