Patents by Inventor Frank Domann

Frank Domann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9560697
    Abstract: A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: January 31, 2017
    Assignee: TESA SE
    Inventors: Monika Junghans, Bernd Dietz, Frank Domann, Udo Dominikat, Klaus Keite-Telgenbüscher, Ute Ellringmann
  • Patent number: 8383997
    Abstract: A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: February 26, 2013
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann
  • Patent number: 8283612
    Abstract: The invention provides a planar element which is intrinsically heatable and which is particularly suitable for attachment to multi-dimensionally curved surfaces. For this purpose the planar element features particularly high deformability, achieved in accordance with the invention through a planar element having a layer sequence comprising a heating layer and a contacting layer, each of these two layers being composed of a polymeric material based on elastomers and/or on plastic polymers which have a particular elongation at break and at the same time a particular tensile elasticity modulus. Furthermore, the invention provides an adhesively bonded assembly comprising a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and the use of such a planar element for heating an adhesively bonded assembly.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: October 9, 2012
    Assignee: Tesa SE
    Inventors: Klaus Keite-Telgenbuescher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann, Veronika Ramm
  • Publication number: 20100213189
    Abstract: The invention provides a planar element which is intrinsically heatable and which is particularly suitable for attachment to multi-dimensionally curved surfaces. For this purpose the planar element features particularly high deformability, achieved in accordance with the invention through a planar element having a layer sequence comprising a heating layer and a contacting layer, each of these two layers being composed of a polymeric material based on elastomers and/or on plastic polymers which have a particular elongation at break and at the same time a particular tensile elasticity modulus. Furthermore, the invention provides an adhesively bonded assembly comprising a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and the use of such a planar element for heating an adhesively bonded assembly.
    Type: Application
    Filed: February 25, 2010
    Publication date: August 26, 2010
    Applicant: TESA SE
    Inventors: Klaus Keite-Telgenbuescher, Monika Junghans, Bernd Deitz, Udo Dominikat, Frank Domann, Ute Ellringmann, Veronika Ramm
  • Publication number: 20100170889
    Abstract: A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
    Type: Application
    Filed: December 17, 2009
    Publication date: July 8, 2010
    Applicant: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Monika Junghans, Bernd Dietz, Udo Dominikat, Frank Domann, Ute Ellringmann
  • Publication number: 20100021683
    Abstract: A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.
    Type: Application
    Filed: July 22, 2009
    Publication date: January 28, 2010
    Applicant: tesa SE
    Inventors: Monika Junghans, Bernd Dietz, Frank Domann, Udo Dominikat, Klaus Keite-Telgenbüscher, Ute Ellringmann