Patents by Inventor Frank Pueschner

Frank Pueschner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200404966
    Abstract: A tank apparatus for an electronic inhaler, including a receptacle configured to hold a liquid to be vaporized, two supply lines configured to apply an electrical supply voltage to an electrical heater, and an authentication circuit configured to authenticate the tank apparatus. The authentication circuit has two supply terminals configured to apply an electrical supply voltage, and at least one of the supply lines is connectable to at least one of the supply terminals in an electrically conductive manner.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 31, 2020
    Inventors: Jens Pohl, Thomas Lehmann, Frank Pueschner
  • Patent number: 10585034
    Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 10, 2020
    Assignee: Infineon Technologies AG
    Inventors: Thomas Spoettl, Mathias Belzner, Ralph Domnick, Jens Pohl, Frank Pueschner, Peter Stampka, Daniel Weiss
  • Publication number: 20200028263
    Abstract: A method for trimming an antenna applied on a carrier, the method including pressing a region of the carrier out from a carrier plane of the carrier, the region having a portion of the antenna and the region being selected according to a target property of the antenna, and removing at least a part of the portion of the antenna from the pressed-out region of the carrier.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 23, 2020
    Inventors: Frank Pueschner, Jens Pohl
  • Patent number: 10440825
    Abstract: In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies Austria AG
    Inventors: Frank Pueschner, Peter Stampka, Jens Pohl, Marcus Janke
  • Patent number: 10423870
    Abstract: Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured to modulate or demodulate signals which are received or transmitted using the loop antenna, and an impedance matching circuit for matching the impedance of the loop antenna to the input impedance of the modulation circuit. The modulation circuit and the impedance matching circuit are arranged inside the loop antenna on or in the carrier.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: September 24, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Martin Buchsbaum, Josef Gruber, Juergen Hoelzl, Frank Pueschner, Peter Stampka
  • Patent number: 10395157
    Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: August 27, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Thomas Spoettl, Jens Pohl, Peter Stampka
  • Patent number: 10380477
    Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: August 13, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Peter Stampka, Siegfried Hoffner, Jens Pohl
  • Patent number: 10282655
    Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: May 7, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Siegfried Hoffner, Jens Pohl
  • Patent number: 10229352
    Abstract: One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: March 12, 2019
    Assignee: Infineon Technologies AG
    Inventors: Martin Klimke, Berndt Gammel, Frank Pueschner, Peter Stampka
  • Patent number: 10223629
    Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: March 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Thomas Spoettl, Frank Pueschner, Peter Stampka, Mathias Belzner, Ralph Domnick, Daniel Weiss
  • Patent number: 10198684
    Abstract: A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Alfred Haimerl, Jens Pohl, Wolfgang Schindler
  • Publication number: 20190033206
    Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 31, 2019
    Inventors: Thomas Spoettl, Mathias Belzner, Ralph Domnick, Jens Pohl, Frank Pueschner, Peter Stampka, Daniel Weiss
  • Patent number: 10163820
    Abstract: A method may include providing a chip carrier having a chip supporting region to support a chip, and a chip contacting region having at least one contact pad, the chip carrier being thinner in the chip contacting region such that a first thickness of the chip carrier at the at least one contact pad is smaller than a second thickness of the chip carrier in the chip supporting region. A disposing of the chip, having at least one contact protrusion, over the chip carrier, such that the at least one contact protrusion is arranged over the at least one contact pad may be included. In addition, a pressing of the chip against the chip carrier such that the at least one contact protrusion extends at least partially into the chip contacting region and is electrically contacted to the at least one contact pad may be included.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: December 25, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl
  • Patent number: 10157848
    Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 18, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl, Thomas Spoettl, Peter Stampka
  • Patent number: 10114992
    Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: October 30, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl, Thomas Spoettl, Peter Stampka
  • Publication number: 20180101758
    Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.
    Type: Application
    Filed: October 6, 2017
    Publication date: April 12, 2018
    Inventors: Thomas Spoettl, Frank Pueschner, Peter Stampka, Mathias Belzner, Ralph Domnick, Daniel Weiss
  • Patent number: 9935042
    Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: April 3, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Thomas Spoettl, Frank Pueschner, Guenther Ruhl, Peter Stampka
  • Patent number: 9912058
    Abstract: According to one embodiment, a hybrid antenna is described comprising a plurality of windings wherein each winding comprises a loop antenna portion arranged in a plane and a ferrite antenna portion arranged at least partially outside of the plane.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: March 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Petteri Palm, Martin Buchsbaum, Josef Gruber, Juergen Hoelzl, Frank Pueschner, Peter Stampka
  • Publication number: 20180040573
    Abstract: A method may include providing a chip carrier having a chip supporting region to support a chip, and a chip contacting region having at least one contact pad, the chip carrier being thinner in the chip contacting region such that a first thickness of the chip carrier at the at least one contact pad is smaller than a second thickness of the chip carrier in the chip supporting region. A disposing of the chip, having at least one contact protrusion, over the chip carrier, such that the at least one contact protrusion is arranged over the at least one contact pad may be included. In addition, a pressing of the chip against the chip carrier such that the at least one contact protrusion extends at least partially into the chip contacting region and is electrically contacted to the at least one contact pad may be included.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 8, 2018
    Inventors: FRANK PUESCHNER, JENS POHL
  • Publication number: 20180032854
    Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.
    Type: Application
    Filed: July 17, 2017
    Publication date: February 1, 2018
    Inventors: Frank Pueschner, Siegfried Hoffner, Jens Pohl