Patents by Inventor Franklin L. Allen

Franklin L. Allen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of surface protection of a semiconductor wafer during polishing
    Patent number: 5424224
    Abstract: The protection to the backside of the semiconductor wafer is accomplished by applying a layer of silicon oxide or silicon nitride or other deposited material to the back surface of a semiconductor wafer to protect against particles, scratches, and etching by mild caustic solutions. The layer remains in place during all three processes, edge pre-polish, mirror edge polish, and wafer polish.
    Type: Grant
    Filed: January 19, 1993
    Date of Patent: June 13, 1995
    Assignee: Texas Instruments Incorporated
    Inventors: Franklin L. Allen, Eugene C. Davis, Lawrence D. Dyer, Jerry B. Medders, Vikki S. Simpson, Jerry D. Smith, Michael Cunningham, John B. Robbins
  • Semiconductor polishing pad
    Patent number: 5394655
    Abstract: The invention is to a polishing pad 14 that has a polishing surface 19 in which portions 17 and 18 of the polishing surface 19 have been removed. The removed areas 17 and 18 are annular rings adjacent an outer 15 and inner 16 edges of the polishing pad 14. The non-polishing surfaces 18 and 19 taper 17a and 18a downward from the polishing surface 19.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: March 7, 1995
    Assignee: Texas Instruments Incorporated
    Inventors: Franklin L. Allen, William L. Smith, Thomas G. Debner, Dennis L. Olmstead