Patents by Inventor Franklin Santos Marcelino

Franklin Santos Marcelino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-die integrated circuit packages and methods of manufacturing the same
    Patent number: 11328984
    Abstract: Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The example integrated circuit package further includes external second leadframe separate from the first leadframe.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: May 10, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: You Chye How, Huay Yann Tay, Franklin Santos Marcelino
  • MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20190206772
    Abstract: Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The example integrated circuit package further includes external second leadframe separate from the first leadframe.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: You Chye How, Huay Yann Tay, Franklin Santos Marcelino