Patents by Inventor Franz-Peter Kalz

Franz-Peter Kalz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device Including Two Power Semiconductor Chips and Manufacturing Thereof
    Publication number: 20130113114
    Abstract: A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 9, 2013
    Applicant: Infineon Technologies AG
    Inventors: Khalil Hosseini, Manfred Mengel, Joachim Mahler, Franz-Peter Kalz
  • Electronic Component
    Publication number: 20130021766
    Abstract: An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 24, 2013
    Applicant: Infineon Technologies AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz
  • METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE
    Publication number: 20120327614
    Abstract: A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz
  • CHIP, METHOD FOR PRODUCING A CHIP AND DEVICE FOR LASER ABLATION
    Publication number: 20120074598
    Abstract: In various embodiments, a chip may include a substrate; a coating, the coating covering the substrate at least partially and the coating being designed for being stripped at least partially by means of laser ablation; wherein between the substrate and the coating, a laser detector layer is arranged at least partially, the laser detector layer being designed for generating a detector signal for ending the laser ablation.
    Type: Application
    Filed: September 29, 2011
    Publication date: March 29, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Franz-Peter Kalz