Patents by Inventor Franz Xaver Muehlbauer
Franz Xaver Muehlbauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220148951Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.Type: ApplicationFiled: December 7, 2021Publication date: May 12, 2022Applicant: Infineon Technologies AGInventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Theyerl, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
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Patent number: 11195787Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.Type: GrantFiled: February 17, 2016Date of Patent: December 7, 2021Assignee: Infineon Technologies AGInventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
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Patent number: 10626012Abstract: A semiconductor device having a lid, and method of making a semiconductor device having a lid is disclosed. The semiconductor device includes a substrate. A device is positioned at the substrate. A lid made of a semiconductor material is positioned over the device to form a protective cavity about the device. The lid is formed using a semiconductor process. In other examples, the lid may be made of a nonconductive material, such as a polymer material. The lids may be formed as part of a batch process.Type: GrantFiled: April 13, 2015Date of Patent: April 21, 2020Assignee: Infineon Technologies AGInventors: Franz-Xaver Muehlbauer, Dominic Maier, Thomas Kilger
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Patent number: 10549985Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.Type: GrantFiled: August 31, 2017Date of Patent: February 4, 2020Assignee: Infineon Technologies AGInventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
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Publication number: 20190198455Abstract: A semiconductor apparatus comprises: a circuit board; a semiconductor package having a main surface, wherein the semiconductor package is arranged on the circuit board and the main surface faces the circuit board; a radio-frequency line element of the semiconductor package, which radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is designed to transmit a signal at a frequency of greater than 10 GHz; and an underfiller material arranged between the circuit board and the semiconductor package, wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.Type: ApplicationFiled: December 20, 2018Publication date: June 27, 2019Inventors: Walter HARTNER, Christian GEISSLER, Thomas KILGER, Johannes LODERMEYER, Franz-Xaver MUEHLBAUER, Martin Richard NIESSNER, Claus WAECHTER
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Patent number: 10332814Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.Type: GrantFiled: February 18, 2016Date of Patent: June 25, 2019Assignee: Infineon Technologies AGInventors: Claus Von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz Xaver Muehlbauer, Daniel Porwol, Tobias Schmidt, Christian Schweiger, Carsten Von Koblinski
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Publication number: 20180148322Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.Type: ApplicationFiled: August 31, 2017Publication date: May 31, 2018Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
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Patent number: 9981843Abstract: A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.Type: GrantFiled: April 26, 2016Date of Patent: May 29, 2018Assignee: Infineon Technologies AGInventors: Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz Xaver Muehlbauer, Daniel Porwol, Juergen Wagner
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Publication number: 20170236776Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.Type: ApplicationFiled: February 17, 2016Publication date: August 17, 2017Applicant: Infineon Technologies AGInventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
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Patent number: 9725303Abstract: A semiconductor device includes a microelectromechanical system (MEMS) die, an encapsulation material, a via element, a non-conductive lid, and a conductive layer. The encapsulation material laterally surrounds the MEMS die. The via element extends through the encapsulation material. The non-conductive lid is over the MEMS die and defines a cavity. The conductive layer is over the MEMS die and the encapsulation material and is electrically coupled to the via element.Type: GrantFiled: March 16, 2016Date of Patent: August 8, 2017Assignee: Infineon Technologies AGInventors: Dominic Maier, Franz-Xaver Muehlbauer, Thomas Kilger
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Publication number: 20160311679Abstract: A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.Type: ApplicationFiled: April 26, 2016Publication date: October 27, 2016Inventors: Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz Xaver Muehlbauer, Daniel Porwol, Juergen Wagner
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Publication number: 20160297672Abstract: A semiconductor device having a lid, and method of making a semiconductor device having a lid is disclosed. The semiconductor device includes a substrate. A device is positioned at the substrate. A lid made of a semiconductor material is positioned over the device to form a protective cavity about the device. The lid is formed using a semiconductor process. In other examples, the lid may be made of a nonconductive material, such as a polymer material. The lids may be formed as part of a batch process.Type: ApplicationFiled: April 13, 2015Publication date: October 13, 2016Applicant: INFINEON TECHNOLOGIES AGInventors: Franz-Xaver Muehlbauer, Dominic Maier, Thomas Kilger
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Publication number: 20160247739Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.Type: ApplicationFiled: February 18, 2016Publication date: August 25, 2016Applicant: Infineon Technologies AGInventors: Claus Von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz Xaver Muehlbauer, Daniel Porwol, Tobias Schmidt, Christian Schweiger, Carsten Von Koblinski