Abstract: Provided are a method and apparatus for high-speed, multi-mode PAM symbol transmission. A multi-mode PAM output driver drives one or more symbols, the number of levels used in the PAM modulation of the one or more symbols depending on the state of a PAM mode signal. Additionally, the one or more symbols are driven at a symbol rate, the symbol rate selected in accordance with the PAM mode signal so that a data rate of the driven symbols in constant with respect to changes in the state of the PAM mode signal. Further provided are methods for determining the optimal number of PAM levels for symbol transmission and reception in a given physical environment.

Abstract: A mask having a pattern to modify a circuitry feature that has been exposed in a radiation sensitive layer by transmitting modifying radiation to a region of the radiation sensitive layer containing the exposed circuitry feature is described. The mask may reduce subwavelength distortions and proximity effect distortions of the exposed circuitry feature. The mask may be used to manufacture a semiconductor device having circuitry that is based on the modified circuitry feature.

Abstract: A simulated Christmas tree is comprised of an array, or net, of interconnected light strings, tie wires and semi-rigid hoops. Spaced apart segments of light strings run downwardly from a hub which is at the top of a center pole that extends from a base. The light string segments are fastened to the horizontal hoops; and tie wires run horizontally between the segments, at elevations intermediate the hoops and intermediate the uppermost hoop and the hub which is at the top of the tree. The hoops create the conical shape. They are adapted to nest within one another, with clearance for the wires, and enable a knock down design. A detachable illuminated decoration is mounted on the hub at the pinnacle of the tree. The string light segments and bulbs in the star are electrically connected to blink, and to thus produce a twinkling tree effect.

Abstract: A mask having a pattern to modify a circuitry feature that has been exposed in a radiation sensitive layer by transmitting modifying radiation to a region of the radiation sensitive layer containing the exposed circuitry feature is described. The mask may reduce subwavelength distortions and proximity effect distortions of the exposed circuitry feature. The mask may be used to manufacture a semiconductor device having circuitry that is based on the modified circuitry feature.

Abstract: A method of making a metal interconnect stack for an integrated circuit structure is described comprising a main metal interconnect layer, an underlying TiN barrier layer and a titanium metal seed layer below the TiN barrier layer, and a barrier layer below the titanium metal seed layer to provide protection against chemical interaction between the titanium metal seed layer and an underlying plug in a via. The structure is formed by providing an integrated circuit structure having an insulation layer formed thereon with one or more metal-filled vias or contact openings generally vertically formed therethrough to have an upper surface thereon; forming a lower barrier layer such as a TiN barrier layer over the insulation layer and the upper surface of the metal in the one or more metal-filled vias; and subsequently forming the titanium seed layer over the lower TiN barrier layer.

Abstract: A composite metal line structure for an integrated circuit structure on a semiconductor substrate is disclosed which comprises: a low resistance metal core layer; a first thin protective layer of electrically conductive material on the upper surface of the metal core layer capable of protecting the metal core layer from reaction with tungsten; a layer of tungsten formed over the first protective layer to function as an etch stop layer for vias subsequently formed in an overlying dielectric layer; and a second thin protective layer of electrically conductive material over the tungsten layer and capable of functioning as an antireflective coating (ARC).

Abstract: A metal interconnect stack for an integrated circuit structure is described comprising a main metal interconnect layer, an underlying TiN barrier layer and a titanium metal seed layer below the TiN barrier layer, and a barrier layer below the titanium metal seed layer to provide protection against chemical interaction between the titanium metal seed layer and an underlying plug in a via. The structure is formed by providing an integrated circuit structure having an insulation layer formed thereon with one or more metal-filled vias or contact openings generally vertically formed therethrough to have an upper surface thereon; forming a lower barrier layer such as a TiN barrier layer over the insulation layer and the upper surface of the metal in the one or more metal-filled vias; and subsequently forming the titanium seed layer over the lower TiN barrier layer.

Abstract: A game software is devised for a user to play the Kung-Ming Chess on a microprocessor-based system having at least a CPU, a memory unit, a screen, and a cursor position control device. In playing the Kung-Ming Chess, the user plays on screen against a deployment selected from a predefined set of deployments stored in the database of the game software. Each deployment is entitled with the name of a particular stratagem originated from Chinese heritage. While playing the Kung-Ming Chess, the game software allows the user to learn these stratagems and related information.

Abstract: A process is provided for making a flame composition. The process involves (a) mechanically dry blending (i) a tetrafluoroethylene polymer, preferably in powder form, and (ii) a first thermoplastic resin, preferably a vinyl aromatic resin to form a preblend composition and (b) admixing the preblend composition with a thermoplastic resin and a flame retardant to form the thermoplastic resin. The process provides enhanced levels of falling dart impact strength in articles molded from the thermoplastic composition.

Abstract: A thermoplastic composition is provided which exhibits desired levels of viscosity, dart impact strength, and flame retardancy. The composition includes respective amounts of a bulk vinyl aromatic-vinyl cyanide-rubber graft copolymer, an emulsion vinyl aromatic-vinyl cyanide-rubber graft copolymer and a flame retardant which contains an amount of a halogenated epoxy compound. The compositions are useful for making molded articles which exhibit desired levels of flame retardancy and impact strength. The thermoplastic compositions may also further contain respective amounts of non-epoxy halogenated compounds, flame retardant synergist such as antimony compounds, and drip suppressants such as fluoro polymers.