Patents by Inventor Frederick Cruz Santos

Frederick Cruz Santos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor
    Patent number: 8946878
    Abstract: An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: February 3, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Chee Keong Chin, Jae Hak Yee, Yu Feng Feng, Frederick Cruz Santos
  • Integrated circuit package system with stacked devices
    Patent number: 8018039
    Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: September 13, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Jae Hak Yee, Frederick Cruz Santos, Yong Yong Xia, Jun Jie Xu
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES
    Publication number: 20090224389
    Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.
    Type: Application
    Filed: March 6, 2008
    Publication date: September 10, 2009
    Inventors: Jae Hak Yee, Frederick Cruz Santos, Yong Yong Xia, Jun Jie Xu
  • INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
    Publication number: 20090146271
    Abstract: An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 11, 2009
    Inventors: Chee Keong Chin, Jae Hak Yee, Yu Feng Feng, Frederick Cruz Santos