Patents by Inventor Frieder Hainrich Baumann

Frieder Hainrich Baumann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper interconnect with CVD liner and metallic cap
    Patent number: 9059176
    Abstract: A structure having a diffusion barrier positioned adjacent to a sidewall and a bottom of an opening being etched in a layer of dielectric material. The structure also having a metal liner positioned directly on top of the diffusion barrier, a seed layer positioned directly on top of the metal liner, wherein the seed layer is made from a material comprising copper, a copper material positioned directly on top of the seed layer, a metallic cap positioned directly on top of and selective to the copper material, and a capping layer positioned directly on top of and adjacent to the metallic cap.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: June 16, 2015
    Assignees: International Business Machines Corporation, STMICROELECTRONICS, INC., Renesas Electronics Corporation, GLOBALFOUNDRIES, INC.
    Inventors: Frieder Hainrich Baumann, Chao-Kun Hu, Andrew H. Simon, Tibor Bolom, Koichi Motoyama, Chengyu Charles Niu
  • COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP
    Publication number: 20130277842
    Abstract: A structure having a diffusion barrier positioned adjacent to a sidewall and a bottom of an opening being etched in a layer of dielectric material. The structure also having a metal liner positioned directly on top of the diffusion barrier, a seed layer positioned directly on top of the metal liner, wherein the seed layer is made from a material comprising copper, a copper material positioned directly on top of the seed layer, a metallic cap positioned directly on top of and selective to the copper material, and a capping layer positioned directly on top of and adjacent to the metallic cap.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 24, 2013
    Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, GLOBALFOUNDRIES INC., RENESAS ELECTRONICS CORPORATION, STMICROELECTRONICS, INC.
    Inventors: Frieder Hainrich Baumann, Chao-Kun Hu, Andrew H. Simon, Tibor Bolom, Koichi Motoyama, Chengyu Charles Niu