Abstract: A method increases endurance of an array of memory cells which have an endurance specified according to the number of change cycles that the memory cell can endure within a performance tolerance. The method is based on arranging the array into a plurality of sectors, and assigning a subset of addresses for storage of data structure expected to change a number of times that is sufficient to exceed the specified endurance of the memory cell in the array. A record is maintained indicating one of the plurality of sectors as a current sector, directing accesses using the subset of addresses to the current sector, counting changes executed to memory cells identified by the subset of addresses for the current sector, and changing the current sector to another one of the plurality of sectors when the count of changes exceeds the threshold.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: The present invention provides a new memory device for storage of boot code for microprocessors which boot to either the top or bottom of a memory map on power-up. The device includes a memory array, a first block, and decoders. The first block is defined as rows of the memory array designated for storage of data. The decoders decode a memory access requested for the data. The memory access request may be in either one of a top-down or bottom-up address protocol. In another embodiment, an integrated circuit memory includes: a memory array, a decoder, a control, and a logic gate. The decoders decode a memory access request to select a row of memory array. The control has an output for outputting either a bottom-up or a top-down address protocol signal. The logic gate outputs a logical "Exclusive Or" of the control signal and a corresponding bit of the memory access request, whereby a memory request in a bottom-up address protocol is converted to a memory address in a top-down address protocol.

Abstract: A read-only memory device is provided which comprises an array of read-only memory cells arranged in rows and columns. An additional row or column of flat, single polysilicon floating gate memory cells is provided. A row or column decoder coupled to the array of read-only memory cells is responsive to addresses corresponding to rows or columns in the array for selecting addressed rows or columns. Control circuitry including a programmable store for identifying a defective row or column in the array to be replaced by the additional row or column, selects the additional row or column and replaces the defective row or column in response to an address corresponding to the defective row or column. In addition, circuitry is provided on the integrated circuit which allows access to the additional row or column of floating gate memory cells for programming the additional row or column.

Abstract: A technique for storing multiple bits per cell in a read only memory device, provides for two kinds of code implants in the memory array. A shallow implant such as used in prior art mask ROMs is used for coding a first bit, and a deeper implant is used for coding a second bit in the memory cells. Furthermore, the cells are implemented in a semiconductor substrate so that the channels of the transistors in the mask ROM can be biased. The memory cells include as isolation layer formed in the semiconductor substrate, and a channel well formed in the isolation layer. The device includes resources to apply a first bias potential such as ground, to channel regions of memory cells in the array. When the first bias potential is applied through the channel regions, the memory cells have particular thresholds determined at least in part by the dope concentrations in the channel regions. The device also includes resources to apply a second bias potential to the channel regions of the memory cells.

Abstract: A new flash memory cell structure and operational bias is based on the use of a triple well flash memory cell which allows pre-programming by Fowler Nordheim (F-N) tunneling over blocks of cells at a time. The floating gate memory cell is made in a semiconductor substrate having a first conductivity type, such as p-type. A first well within the substrate by having a second conductivity type different than the first conductivity type is included. A second well within the first well is also included having the first conductivity type. A drain and a source are formed in the second well having the second conductivity type, and spaced away from one another to define a channel area between the drain and the source. A floating gate and control gate structure is included over the channel area.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: A process is provided for fabricating a nonvolatile memory cell. According to the process, source and drain regions are formed on a first conductivity-type semiconductor substrate; and insulating layer is formed on the source and drain regions; a floating gate is formed on the insulating layer; a dielectric composite is formed on the floating gate; and a control gate is formed on the dielectric composite. The dielectric composite includes a bottom layer of silicon dioxide formed on the floating gate; a layer of silicon nitride formed on the bottom silicon dioxide layer; and a top layer of silicon dioxide formed on the nitride layer such that the silicon nitride layer of the composite is thinner than the top or the bottom silicon dioxide layer.

Abstract: A process is provided for fabricating an integrated circuit in which an oxynitride layer is selectively formed in a first active region without forming an oxynitride layer in a second active region peripheral to the first active region. In one embodiment, the memory cell is fabricated where an oxynitride layer is prevented from forming in a region peripheral to the memory array region. In an alternate embodiment, the memory cell is fabricated where an oxynitride layer formed in a region peripheral to the memory array region is selectively removed.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: A dual mode memory cell and integrated circuit is provided with a native mode and a ROM mode. ROM code implants are incorporated into a standard memory array. The implants are deep implants which do not have a large effect on the threshold of the cell under normal substrate bias conditions. However, as the substrate bias is increased, they have an increasing effect on the cell threshold. Thus, the cells in one embodiment are floating gate cells that can be read in a flash mode, in which the threshold of the cell is determined predominately by charge stored in the floating gate of the cell, and a read only mode during which a substrate bias is applied, the charge stored in the floating gates in the sector to be read are equalized, and the threshold of the cell is determined predominately by the ROM code implants.

Abstract: A floating gate memory with a protocol which terminates a program load cycle upon detecting a predetermined address and/or data pattern, providing positive indication of the end of the load cycle, and eliminating the requirement for a long pulse in a controlled signal. Command logic executes a process to store a block of data in response to a sequence of addresses and data segments received at the input/output circuitry, and detects the last segment in a block of data in response to a pattern including at least one of the addresses and data segments received at the input/output circuitry. One pattern includes consecutive matching addresses. Pattern match logic included in the command logic is coupled to the input/output circuitry and stores addresses in the sequence and compares them with a next address to indicate a matching address. Alternatively, the pattern includes both matching addresses and data segments with corresponding comparator circuitry.

Abstract: A floating gate memory device which includes control circuits to generate a repair pulse to repair over-erased cells so they may be repaired block-by-block. This invention includes repairing the cells by applying a repair pulse to the cell's bit line while maintaining the word line voltage above ground. In a different embodiment, the word line voltage is maintained at two different voltage levels above ground. In the first stage, the word line voltage is maintained between approximately 0.1 volts and 0.2 volts for approximately 100 ms while the repair pulse is applied. In the second stage, the word line voltage is maintained between approximately 0.4 volts and 0.5 volts for approximately 100 ms while the repair pulse is applied.

Abstract: Substantial reduction in peak current encountered during an erase process for a flash memory device is achieved by selection of source voltage potential during the erase according to the expected band-to-band tunneling current encountered during the process. During the beginning of the process, a lower source voltage potential is selected, which is high enough to cause significant erasing while suppressing band-to-band tunneling current in a portion of the array, and during a second part of the erasing process, a higher source potential is utilized, which ensures successful erasing of the array, without exceeding the peak current requirements of the power supply used with the device. The first and second parts of the erase sequence will induce band-to-band tunneling current in addition to Fowler-Nordheim tunneling current. The band-to-band tunneling current is characterized by a turn on threshold source potential which is inversely related to the threshold of the cell receiving the voltage sequence.

Abstract: An improved contactless EPROM array, EPROM cell design, and method for fabricating the same is based on a unique drain-source-drain configuration, in which a single source diffusion is shared by two columns of transistors. An elongated first drain diffusion region, an elongated source diffusion region, and an elongated second drain diffusion region, are formed in a semi-conductor substrate along essentially parallel lines. Field oxide regions are grown on opposite sides of the first and second drain diffusion regions. Floating gates and control gate wordlines are formed orthogonal to the drain-source-drain structure to establish two columns of storage cells having a shared source region. The shared source region is coupled through a bottom block select transistor to a virtual ground terminal. Each drain diffusion region is-coupled through a top block select transistor to global bitline.

Abstract: An improved contactless EPROM array, EPROM cell design, and method for fabricating the same is based on a unique drain-source-drain configuration, in which a single source diffusion is shared by two columns of transistors. An elongated first drain diffusion region, an elongated source diffusion region, and an elongated second drain diffusion region, are formed in a semi-conductor substrate along essentially parallel lines. Field oxide regions are grown on opposite sides of the first and second drain diffusion regions. Floating gates and control gate wordlines are formed orthogonal to the drain-source-drain structure to establish two columns of storage cells having a shared source region. The shared source region is coupled through a bottom block select transistor to a virtual ground terminal. Each drain diffusion region is coupled through a top block select transistor to global bitline.

Abstract: Contactless flash EPROM cell and array designs, and methods for fabricating the same result in dense, segmentable flash EPROM chips. Also, an extended floating gate structure, and method for manufacturing the extended floating gate allow for higher capacitive coupling ratios in flash EPROM circuitry with very small design rules. The floating gates are extended in a symmetrical fashion in a drain-source-drain architecture, so that each pair of columns of cells has a floating gate which is extended in opposite directions from one another. This allows one to take advantage of the space on the cell normally consumed by the isolation regions, to extend the floating gates without increasing the layouts of the cells. Also, an easily scalable design is based on establishing conductive spacers on the sides of floating gate deposition layers which are used for self-alignment of the source and drain.

Abstract: A dielectric insulating composite for insulating a floating gate from a control gate in a nonvolatile memory cell such as EPROM, EEPROM and flash EPROM cells is provided which includes a bottom layer of silicon dioxide formed on the floating gate, a layer of silicon nitride formed on the bottom silicon dioxide layer and a top silicon dioxide layer formed on the nitride layer where the silicon nitride layer has a thickness in the resulting composite which is less than the bottom and top silicon dioxide layers. In one embodiment, the nonvolatile memory cell includes a first conductivity-type semiconductor substrate, source and drain regions formed on a surface of the substrate, an insulating layer thermally grown on top of the source and drain regions, a floating gate positioned on the insulating layer for insulating the floating gate from the source and drain regions, the dielectric insulating composite being positioned between the floating gate and a control gate.

Abstract: A circuit for speeding up the pre-programming of floating gate storage transistors such as FLASH EPROMS, and particularly speeding up the pre-programming of a block or array of floating gate storage transistors includes a controllable voltage source that supplies gate programming potential across the control gate and source of the FLASH EPROM transistor cells to be programmed. A control circuit is provided that controls the voltage source to vary the gate programming potential during a programming interval as a function of time in order to decrease the time required for a given amount of charge movement to program the selected floating gate transistors. The wordline voltages are varied, while the source voltage is held constant. By starting at a lower wordline voltage, and increasing during the programming interval to a high wordline voltage, the programming speed is increased, and the high final turn-on threshold voltage for the programmed floating gate storage transistors is achieved.

Abstract: A non-volatile semiconductor memory device is implemented in a manner which allows programming and erasing at low voltage. The non-volatile semiconductor memory device includes a plurality of blocks, each including a plurality of wordlines acting as control gates, buried diffusion layers acting as sources and drains, metal lines arranged one for every two buried diffusion layers, and memory cells formed between the two buried diffusion layers. Block transistors are connected to both ends of the buried diffusion layers for connecting the buried diffusion layers to the corresponding metal lines. The buried diffusion layers of each block are connected through the block transistors in the form of a bellows.