Abstract: An optical communication fiber includes: a fiber body having a tip surface; and a light absorption layer provided to the tip surface of the fiber body, and configured to reduce light transmittance of communication light.

Abstract: An optical fiber cable processing device includes a transport mechanism which transports a case that accommodates an optical fiber cable and in which plural work stations are set along a transport path, and a processing mechanism that performs each of desired operations on the optical fiber cable, in which any one of the plural work stations is a mounting station in which a work mounting mechanism mounts a work on a tip of the optical fiber cable, a drawing mechanism that draws out the optical fiber cable and a correction mechanism that corrects a bending tendency of the optical fiber cable are disposed in the work stations on an upstream side of the mounting station, and the transport mechanism transports the case to the mounting station and mounts the work on the tip of the optical fiber cable in a state where the optical fiber cable is drawn out.

Abstract: An optical communication fiber includes: a fiber body having a tip surface; and a light absorption layer provided to the tip surface of the fiber body, and configured to reduce light transmittance of communication light.

Abstract: A cleaning apparatus includes one set of a supply roll supplying a strip-shaped cleaning sheet and a collection roll collecting the cleaning sheet supplied from the supply roll and a cleaned material is cleaned using a first cleaning surface formed on one surface of one cleaning sheet and a second cleaning surface formed on the other surface. First to eighth guide rolls are provided to guide the cleaning sheet to make the cleaning sheet pass through one side and the other side of an optical fiber. The first to eighth guide rolls guide the cleaning sheet such that the first cleaning surface of the cleaning sheet positioned at one side and the second cleaning surface of the cleaning sheet positioned at the other side face each other with the optical fiber therebetween. As a result, the cleaned material can be cleaned using both sides of the cleaning sheet.

Abstract: An optical fiber cable processing apparatus includes a rotation table (conveyance section) which conveys a case that houses an optical fiber cable obtained by coating an optical fiber, and to which a plurality of work stations is set. The rotation table includes a case holding part, and the case holding part includes a cable holding section that holds the optical fiber cable. Further, a pulling station at an upstream side includes a pulling section that pulls out the optical fiber cable from the case by a predetermined length and causes the cable holding section to hold the optical fiber cable, and the work stations at a downstream side perform necessary work with respect to the optical fiber cable held by the cable holding section. Processing of the optical fiber cable in each work station can be easily performed.

Abstract: An optical fiber cable processing device includes a transport mechanism which transports a case that accommodates an optical fiber cable and in which plural work stations are set along a transport path, and a processing mechanism that performs each of desired operations on the optical fiber cable, in which any one of the plural work stations is a mounting station in which a work mounting mechanism mounts a work on a tip of the optical fiber cable, a drawing mechanism that draws out the optical fiber cable and a correction mechanism that corrects a bending tendency of the optical fiber cable are disposed in the work stations on an upstream side of the mounting station, and the transport mechanism transports the case to the mounting station and mounts the work on the tip of the optical fiber cable in a state where the optical fiber cable is drawn out.

Abstract: A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

Abstract: A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

Abstract: A semiconductor device is provided in which the effect of the heat generated by a flip-chip mounted semiconductor on resin is suppressed. The semiconductor device includes: a substrate; a semiconductor chip which is mounted on the substrate with a front surface of the semiconductor chip facing downward; and a molding resin layer provided on a semiconductor chip-mounted surface of the substrate so as to be spaced apart from the semiconductor chip and to surround the semiconductor chip. In addition, the upper surface of the molding resin layer is positioned higher than the rear surface of the semiconductor chip.