Patents by Inventor Fukutaro SAEGUSA

Fukutaro SAEGUSA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200203589
    Abstract: A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 25, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Takashi MATSUMOTO, Naoki HARADA, Fukutaro SAEGUSA, Yoshiyuki KAGEYAMA