Abstract: The present invention provides markers for judging the efficacy of therapy with a PD-1 signal inhibitor before or at an early stage of the therapy. As biomarkers for predicting or judging the efficacy of therapy with a PD-1 signal inhibitor, surrogate indicators of metabolic changes relating to mitochondrial activity in T cells and/or T cell activation in a subject are used. As such indicators, intestinal flora-related metabolites in the serum or plasma, energy metabolism-related metabolites in the serum or plasma, amino acid metabolism-related metabolites and/or derivatives thereof in the serum of plasma, oxygen consumption rate and/or ATP turnover in peripheral blood CD8+ cells, amino acids in T cells, and T-bet in peripheral blood CD8+ cells may be used.

Abstract: A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.

Abstract: The disclosure pertains to a compound of formula (I), one of its pharmaceutically acceptable salts, or a composition comprising thereof, for use in the prevention or treatment of glucose intolerance related conditions, insulin deficit related conditions, nonalcoholic fatty liver disease and/or obesity.

Abstract: A marker for judging the efficacy of therapy with a PD-1 signal inhibitor-containing drug before or at an early stage of the therapy is provided.

Abstract: A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.

Abstract: Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Abstract: Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Abstract: Provided is a method for identifying proteins capable of increasing the number of identified proteins contained in a target sample derived from blood. A protein contained in the target sample derived from blood is fragmented, and a protein contained in an having less bias in a quantity ratio of proteins than the target sample is fragmented, and the fragmented proteins are mixed (Steps S101 to S103). In this manner, the mixed sample in which the bias in a quantity ratio of proteins is less than that of the target sample is generated. By performing MS/MS measurement using the generated mixed sample (Step S107), an MS/MS spectrum of a peak derived from a protein contained in a small amount in the target sample can be prevented from being missed. Accordingly, the number of identified proteins contained in the target sample derived from blood can be increased.

Abstract: The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

Abstract: A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.

Abstract: The invention pertains to a compound of formula (I), one of its pharmaceutically acceptable salts, or a composition comprising thereof, for use in the prevention or treatment of glucose intolerance related conditions, insulin deficit related conditions, nonalcoholic fatty liver disease and/or obesity.

Abstract: A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.

Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Abstract: Provided is a method for manufacturing a multilayer printed circuit board includes: S1) preparing a first wiring substrate having a first insulating resin film having a first main surface and a second main surface opposite to the first main surface, a first circuit pattern formed on the first main surface, and a first protective film releasably bonded to the second main surface; S2) partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; S3) filling the bottomed via hole with a conductive paste; S4) disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; S5) removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; S6) peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion

Abstract: A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.

Abstract: The present invention provides an HLA gene amplification primer set containing a primer consisting of each base sequence shown in SEQ ID NO: 1-16. It also provides a highly efficient and highly uniform sequencing method using the primer set.

Abstract: The present invention provides a test method and an evaluation kit for determining the risk of antithyroid drug-induced agranulocytosis. More particularly, it provides a test method for determining the risk of antithyroid drug-induced agranulocytosis, including testing susceptibility polymorphism to antithyroid drug-induced agranulocytosis, and determining the risk of antithyroid drug-induced agranulocytosis, and an evaluation kit for the risk of antithyroid drug-induced agranulocytosis, containing a polynucleotide capable of detecting susceptibility polymorphism to antithyroid drug-induced agranulocytosis.

Abstract: [Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield.

Abstract: A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.