Abstract: A source terminal and a gate terminal are connected to a wiring pattern of the first substrate. A diode is provided under a second substrate such that an anode is connected to a wiring pattern of the second substrate. A plate-like portion of the first electrode is provided between the switching element and the diode, and a linking section of the first electrode connects the plate-like portion and the wiring pattern of the first substrate. A second electrode being substantially columnar and connecting the wiring pattern of the first substrate and the wiring pattern of the second substrate is provided in an opposite side to the linking section with the switching element interposed. A thickness of the plate-like portion of the first electrode is less than or equal to a thickness of each of the wiring pattern of the first substrate and the wiring pattern of the second substrate.

Abstract: Penetration of unnecessary light in an optical path through which light from an object passes can be prevented. Optical components on which the light from the object is incident, a selective transmission member that transmits a light at a predetermined wavelength among lights that have transmitted through the optical component, and a light receiving unit that receives the light that has transmitted through the selective transmission member are held inside an opaque three-dimensional wiring substrate that energizes the light receiving unit.

Abstract: A source terminal and a gate terminal are connected to a wiring pattern of the first substrate. A diode is provided under a second substrate such that an anode is connected to a wiring pattern of the second substrate. A plate-like portion of the first electrode is provided between the switching element and the diode, and a linking section of the first electrode connects the plate-like portion and the wiring pattern of the first substrate. A second electrode being substantially columnar and connecting the wiring pattern of the first substrate and the wiring pattern of the second substrate is provided in an opposite side to the linking section with the switching element interposed. A thickness of the plate-like portion of the first electrode is less than or equal to a thickness of each of the wiring pattern of the first substrate and the wiring pattern of the second substrate.

Abstract: First, a three-dimensional substrate is placed such that the rear surface is oriented upward. Next, a translucent member is placed inside a recessed portion so as to cover a through-hole by bringing a first surface of the translucent member into contact with a protruding portion. Next, an element is placed on the rear surface of the three-dimensional substrate so as to cover the recessed portion. Next, a sealing resin is filled between three-dimensional substrate and the element, between the element and a second surface of the translucent member that opposes the first surface, between a side surface of the translucent member and the three-dimensional substrate, and between the first surface of the translucent member and the three-dimensional substrate. In this way, the element and the translucent member are integrated with the three-dimensional substrate.

Abstract: First, a three-dimensional substrate is placed such that the rear surface is oriented upward. Next, a translucent member is placed inside a recessed portion so as to cover a through-hole by bringing a first surface of the translucent member into contact with a protruding portion. Next, an element is placed on the rear surface of the three-dimensional substrate so as to cover the recessed portion. Next, a sealing resin is filled between three-dimensional substrate and the element, between the element and a second surface of the translucent member that opposes the first surface, between a side surface of the translucent member and the three-dimensional substrate, and between the first surface of the translucent member and the three-dimensional substrate. In this way, the element and the translucent member are integrated with the three-dimensional substrate.

Abstract: To realize further miniaturization of a semiconductor device. The semiconductor device 10 is provided with a switching element (FET 14) provided on a substrate 18, a first electrode (electrode 13) provided on an opposite side of the substrate 18 interposing the switching element, a diode 12 provided on an opposite side of the switching element interposing the first electrode, and a second electrode (electrode 11) provided on an opposite side of the first electrode interposing the diode 12.

Abstract: To realize further miniaturization of a semiconductor device. The semiconductor device 10 is provided with a switching element (FET 14) provided on a substrate 18, a first electrode (electrode 13) provided on an opposite side of the substrate 18 interposing the switching element, a diode 12 provided on an opposite side of the switching element interposing the first electrode, and a second electrode (electrode 11) provided on an opposite side of the first electrode interposing the diode 12.

Abstract: A solid-state imaging apparatus of the invention intends to provide a thin solid-state imaging apparatus having high rigidity, high reliability and an improvement in accuracy using a flexible wiring board, and is a solid-state imaging apparatus comprising a flexible wiring board, a reinforcing plate, a solid-state imaging element substrate, a translucent member, an optical lens and a lens cabinet, and the flexible substrate and the reinforcing plate have the same outer shape and are laminated and integrated, and a positioning hole for being commonly used from the front and the back as a reference in the case of placing the lens cabinet and the case of placing the solid-state imaging element substrate is formed in the reinforcing plate, and the translucent member is placed so as to close an opening part, and the solid-state imaging element substrate and the lens cabinet are oppositely placed in a state of sandwiching an opening part using the positioning hole as a common reference.

Abstract: A solid-state image pickup apparatus and a manufacturing method thereof are provided to prevent a burr from dropping off onto a light reception face that causes a black point deterioration of a video image and to improve in productivity. The solid-state image pickup apparatus according to the invention is a solid-state image pickup apparatus including a flat board for placing a solid-state image pickup device and a lens, wherein the flat board has a through opening and has a wiring section for placing the solid-state image pickup device on the opening face that a light reception face of the solid-state image pickup device faces and a step part for placing the lens in the opening end part on the opening face side of the through opening, and the solid-state image pickup device placed on the wiring section and the lens placed in the step part are integrally sealed with a resin.

Abstract: The invention integrally arranges a lens, an optical filter, a semiconductor imaging device, on-chip components, and a printed circuit board on a three-dimensional circuit board and contrives the lens attachment structure, bonding method, color of an adhesive, masking of the lens, etc. in order to implement a structure that allows high performance, compact, lightweight and rigid design, and mass production, as well as a high-quality picture.

Abstract: A light-transmitting member is previously formed, and then integrally molded during a process of molding a structure member. A solid-state imaging apparatus has: the structure member configured by an insulating resin and having a through-opening portion; a wiring portion which is formed on the surface of the structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member which is placed to cover the through-opening portion with being separated from the solid-state imaging element by a predetermined distance The light-transmitting member is configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin, and integrally molded with the structure member to be embedded at a peripheral portion into the structure member.

Abstract: A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

Abstract: A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

Abstract: The invention integrally arranges a lens, an optical filter, a semiconductor imaging device, on-chip components, and a printed circuit board on a three-dimensional circuit board and contrives the lens attachment structure, bonding method, color of an adhesive, masking of the lens, etc. in order to implement a structure that allows high performance, compact, lightweight and rigid design, and mass production, as well as a high-quality picture.

Abstract: A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

Abstract: A solid-state imaging apparatus includes: a resin structure member configured by an insulating resin and having a through-opening portion a wiring portion is formed on the surface of the resin structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member disposed to cover the through-opening portion with being separated from the solid-state image pickup element by a predetermined distance. A fixing member which is smaller in coefficient of thermal expansion than the insulating resin is placed in close proximity to a solid-state image pickup element attaching face.

Abstract: A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

Abstract: A solid-state imaging apparatus of the present invention includes a structure formed of an insulating resin and having a through-aperture, a wiring pattern formed on the surface of the structure, a solid-state image pickup element connected to the wiring pattern and fitted to the structure to cover the through-aperture, and a light transmitting member fitted to the structure to be opposite to the solid-state image pickup element and to cover the through-aperture, and which further comprises, in the light transmitting member fitting area where the light transmitting member is fitted to the structure, a through-groove that communicates with the through-aperture.

Abstract: A solid-state imaging apparatus includes: a resin structure member configured by an insulating resin and having a through-opening portion a wiring portion is formed on the surface of the resin structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member disposed to cover the through-opening portion with being separated from the solid-state image pickup element by a predetermined distance. A fixing member which is smaller in coefficient of thermal expansion than the insulating resin is placed in close proximity to a solid-state image pickup element attaching face.

Abstract: A light-transmitting member is previously formed, and then integrally molded during a process of molding a structure member. A solid-state imaging apparatus has: the structure member configured by an insulating resin and having a through-opening portion; a wiring portion which is formed on the surface of the structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member which is placed to cover the through-opening portion with being separated from the solid-state imaging element by a predetermined distance The light-transmitting member is configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin, and integrally molded with the structure member to be embedded at a peripheral portion into the structure member.