Abstract: A wiring structure having connection wiring for electrically connecting elements to one another or one element to another constituent element. The connection wiring is a sintered product formed by depositing a paste of conductive fine particles comprising conductive fine particles having a particle diameter of 100 nm or below dispersed in a dispersant, on an electrically insulating base, in accordance with a predetermined pattern, and then sintering a wiring precursor so formed. The conductive paste can be preferably deposited through an ink jet printing method. Further, after one or more cells having an arbitrary configuration or a basic configuration on the base, the conductive fine particle paste may be deposited to a surface of the cell, so that a connection wiring is three-dimensionally formed. When the cells are combined with one another, an integrated electronic device and a multi-layered wiring board can be compactly formed.

Abstract: A housing preform consisting of a plate member formed to be bendable in which are formed electronic components and an interconnect electrically connecting the electronic components. The plate member is formed into a shape of the housing unfolded flat. The housing can be formed by folding the plate member. Due to this, it is possible to provide an electronic apparatus comprised of a housing in which electronic components are mounted.

Abstract: A coaxial line assembly in a package which houses a high frequency element. The assembly includes a metal wall having a hole extending through the metal wall. The metal wall has a step at substantially an intermediate portion of the hole to define a smaller diameter, inner hole portion opened to the inside of the package and a larger diameter, outer hole portion opened to the outside of the package. A lead for transmitting a high frequency signal passes through the hole and is hermetically sealed in the outer hole portion by glass filled in the outer hole portion. A sealing plate closes an opening of the inner hole portion at the step, the lead extending through the sealing plate. The sealing plate is made of a dielectric material having a dielectric constant near to that of the glass and a melting point higher than that of the glass.

Abstract: A process for making a metal wall enclosure of a package for housing an electronic element. An elongated strip, to be formed as the metal sidewall of the enclosure, and a bottom plate, for closing an open end of the metal sidewall, are formed from a sheet of metal stock. At least one aperture is selectively provided in at least one of the bottom plate and the planar metal strip. The strip is prepared for folding, such as by transverse grooves formed in the strip along predetermined fold lines corresponding to corners of the metal sidewall, to facilitate folding of the strip into the desired configuration of the metal sidewall and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship.

Abstract: A package for superconducting devices, enabling signal transmission at a small propagation delay between superconducting devices provided within a heat insulating vacuum vessel, and semiconductor devices provided outside the heat insulating vacuum vessel. The package comprises a heat insulating vacuum vessel capable of maintaining the interior thereof at a low temperature, a substrate having mounted thereon superconducting devices and disposed within the heat insulating vacuum vessel, another substrate having mounted thereon semiconductor devices and disposed outside the heat insulating vacuum vessel, and film cables electrically connecting the respective circuit patterns of these substrates. Since the thickness of the film cables are very small, the rate of influx of heat that flows into the heat insulating vacuum vessel can be limited to a low value.

Abstract: A semiconductor chip, which operates in a range of ultra-high frequency, is mounted on a package including an insulation layer on which input and output conductive patterns are formed. A metalized layer and via holes filled with conductive material are provided in the insulation layer to adjust the characteristic impedance of the conductive patterns.