Patents by Inventor Fumiteru Asai

Fumiteru Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110076490
    Abstract: A pressure-sensitive adhesive sheet for retaining elements according to an embodiment of the present invention includes abase material layer and a pressure-sensitive adhesive layer provided on the base material layer and capable of being cured by an external stimulus. A crack-generating elongation represented by the following equation in a case where the pressure-sensitive adhesive sheet is elongated in a state where the pressure-sensitive adhesive layer is cured is larger than 115%. Crack-generating elongation (%)=[(a length of the pressure-sensitive adhesive sheet when a crack is generated in a surface of the pressure-sensitive adhesive layer)?(an original length of the pressure-sensitive adhesive sheet)]/(the original length of the pressure-sensitive adhesive sheet)×100.
    Type: Application
    Filed: September 30, 2010
    Publication date: March 31, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki HIGASHIBEPPU, Tomokazu TAKAHASHI, Fumiteru ASAI
  • Publication number: 20110065217
    Abstract: A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.
    Type: Application
    Filed: October 9, 2008
    Publication date: March 17, 2011
    Inventors: Yoshio Terada, Fumiteru Asai, Hirokuni Hashimoto
  • Publication number: 20110030882
    Abstract: An adhesive sheet for supporting and protecting a semiconductor wafer has an intermediate layer and an adhesive layer formed on a one side of a base film in this order, the adhesive layer being made of a radiation curing type adhesive, and having a thickness of 1 to 50 ?m and a shear stress of 0.5 to 10 MPa, the intermediate layer having a thickness of 10 to 500 ?m and an elastic modulus of 0.01 to 3 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.
    Type: Application
    Filed: August 6, 2010
    Publication date: February 10, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kouji MIZUNO, Fumiteru ASAI, Takatoshi SASAKI
  • Publication number: 20110030881
    Abstract: An adhesive sheet for supporting and protecting a semiconductor wafer has an adhesive layer formed on one side of a base film, the adhesive layer having a thickness of 4 to 42 ?m and an elastic modulus at 25° C. of 0.5 to 9 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.
    Type: Application
    Filed: August 6, 2010
    Publication date: February 10, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi SASAKI, Fumiteru ASAI, Kouji MIZUNO
  • Publication number: 20110008597
    Abstract: A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 ?m height on its surface.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 13, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Fumiteru ASAI, Takatoshi SASAKI, Noriyoshi KAWASHIMA
  • Publication number: 20110008949
    Abstract: An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 13, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Tomokazu Takahashi, Noriyoshi Kawashima, Fumiteru Asai
  • Publication number: 20100313667
    Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.
    Type: Application
    Filed: October 9, 2008
    Publication date: December 16, 2010
    Inventors: Yoshio Terada, Fumiteru Asai, Hirokuni Hashimoto
  • Publication number: 20100255299
    Abstract: The present invention provides a method of applying a pressure-sensitive adhesive sheet for semiconductor wafer protection, the method including applying to a surface of a semiconductor wafer a pressure-sensitive adhesive sheet for semiconductor wafer protection including a substrate, at least one interlayer, and a pressure-sensitive adhesive layer superposed in this order, in which the pressure-sensitive adhesive sheet is applied to the semiconductor wafer at an application temperature in the range of from 50° C. to 100° C. and the interlayer in contact with the pressure-sensitive adhesive layer has a loss tangent (tan ?) of 0.5 or larger at the application temperature.
    Type: Application
    Filed: April 1, 2010
    Publication date: October 7, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Noriyoshi KAWASHIMA, Fumiteru ASAI
  • Publication number: 20100230036
    Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.
    Type: Application
    Filed: March 10, 2010
    Publication date: September 16, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Akinori NISHIO, Toshio SHINTANI
  • Patent number: 7727811
    Abstract: The present invention relates to a pressure-sensitive adhesive sheet for processing a semiconductor wafer or semiconductor substrate, which includes a base material and a pressure-sensitive adhesive layer which is polymerizable and curable by an energy ray, the pressure-sensitive adhesive layer being disposed on a surface of the base material, in which the pressure-sensitive adhesive layer includes a base polymer, a multifunctional acrylate-based oligomer which has an energy-ray polymerizable carbon-carbon double bond and has a molecular weight of 1000 to 2500, and a multifunctional acrylate-based compound which has an energy-ray polymerizable carbon-carbon double bond and has a molecular weight of 200 to 700. The pressure-sensitive adhesive sheet of the invention is excellent in follow-up properties to a minute unevenness with a depth of about 0.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: June 1, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Toshio Shintani, Fumiteru Asai
  • Publication number: 20100080989
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for laser processing, which includes a base and a pressure-sensitive adhesive layer provided on one surface of the base, the pressure-sensitive adhesive layer having an absorption coefficient at a wavelength of 355 nm of from 50 cm?1 to 900 cm?1, the pressure-sensitive adhesive layer containing a light-absorbing agent in which an absorbance of the light-absorbing agent in a 0.01% by weight acetonitrile solution at a wavelength of 355 nm is from 0.01 to 1.20, and in which the pressure-sensitive adhesive sheet is to be used at the time when a workpiece is laser-processed by a laser light having a wavelength of an ultraviolet region or a laser light enabling light absorption via multiphoton absorption process.
    Type: Application
    Filed: October 1, 2009
    Publication date: April 1, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Fumiteru ASAI, Tomokazu TAKAHASHI, Keiko MAEKAWA, Kazuhiro AOYAGI
  • Publication number: 20100032087
    Abstract: In performing the laser processing of a workpiece with laser light, there are provided a pressure-sensitive adhesive sheet for laser processing and a laser processing method that can perform the laser processing of a workpiece easily with good production efficiency by preventing the fusion of a substrate and an adsorption stage. According to the invention, an pressure-sensitive adhesive sheet for laser processing that is used for laser processing of a workpiece with laser light having a wavelength in an ultraviolet region or with laser light that enables light absorption in an ultraviolet region that has passed a multiphoton absorption process, comprising a substrate and an pressure-sensitive adhesive layer disposed on one surface of the substrate, wherein a melting point of the substrate at another surface is 80° C. or higher, and an etching rate (etching speed/energy fluence) in a case of radiating the laser light onto the other surface is 0.1 [(?m/pulse)/(J/cm2)] or lower.
    Type: Application
    Filed: June 10, 2009
    Publication date: February 11, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomokazu TAKAHASHI, Fumiteru ASAI, Yuki HIGASHIBEPPU
  • Publication number: 20100028669
    Abstract: A re-releasable adhesive agent comprises a radiation-reactive polymer and a radiation polymerization initiator, the radiation-reactive polymer has a side chain derived from at least one monomer expressed by the formula (1): CH2?CR1COOR2 (1), where R1 is a hydrogen atom or a methyl group, and R2 is a C6 or higher alkyl group, and a side chain having one carbon-carbon double bond, and the monomer of formula (1) is contained in a ratio of less than 50 mol % with respect to the total monomer constituting the main chain of the radiation-reactive polymer.
    Type: Application
    Filed: July 27, 2009
    Publication date: February 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Tomokazu Takahashi, Fumiteru Asai, Takamasa Hirayama
  • Publication number: 20100028662
    Abstract: An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 ?m.
    Type: Application
    Filed: December 20, 2007
    Publication date: February 4, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Toshio Shintani, Akiyoshi Yamamoto, Fumiteru Asai, Kouichi Hashimoto
  • Publication number: 20090314417
    Abstract: The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and/or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and/or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500.
    Type: Application
    Filed: June 19, 2009
    Publication date: December 24, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi SASAKI, Toshio SHINTANI, Fumiteru ASAI, Akiyoshi YAMAMOTO
  • Publication number: 20090311474
    Abstract: An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.
    Type: Application
    Filed: April 15, 2008
    Publication date: December 17, 2009
    Inventors: Tomokazu Takahashi, Fumiteru Asai, Toshio Shintani, Takatoshi Sasaki, Akiyoshi Yamamoto, Tsubasa Miki
  • Publication number: 20090221215
    Abstract: The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 ?m. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 3, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Noriyoshi Kawashima, Fumiteru Asai
  • Publication number: 20080261038
    Abstract: An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.
    Type: Application
    Filed: January 3, 2008
    Publication date: October 23, 2008
    Applicant: Nitto Denko Corporation
    Inventors: Akiyoshi Yamamoto, Toshio Shintani, Fumiteru Asai, Kouichi Hashimoto
  • Publication number: 20080248296
    Abstract: The present invention relates to a pressure-sensitive adhesive sheet for processing, which includes a substrate; a pressure-sensitive adhesive layer containing a radiation-polymerizable compound; and an interlayer containing an acrylic polymer having a glass transition temperature of 20° C. or higher as a main component, the interlayer being disposed between the substrate and the pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet of the invention is excellent in pressure-sensitive adhesive properties, releasability, and expansibility.
    Type: Application
    Filed: August 22, 2007
    Publication date: October 9, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshio SHINTANI, Fumiteru ASAI, Kazuhiko YAMAMOTO
  • Publication number: 20080182095
    Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 31, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Fumiteru Asai, Takatoshi Sasaki, Tsubasa Miki, Tomokazu Takahashi, Toshio Shintani, Akiyoshi Yamamoto