Patents by Inventor Fusaji Nagaya
Fusaji Nagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9161445Abstract: A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer.Type: GrantFiled: June 28, 2013Date of Patent: October 13, 2015Assignee: IBIDEN CO., LTD.Inventors: Masaru Takada, Fusaji Nagaya, Takao Okada, Tomohiko Murata
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Patent number: 9049808Abstract: [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (50B) at 0.1 mm. In setting so, using thin core substrate 30 and interlayer insulation layers (50A, 50B) without core material, it is thought that warping does not occur in the printed wiring board.Type: GrantFiled: August 19, 2011Date of Patent: June 2, 2015Assignee: IBIDEN CO., LTD.Inventors: Masaru Takada, Fusaji Nagaya
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Publication number: 20130305531Abstract: A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser.Type: ApplicationFiled: July 19, 2013Publication date: November 21, 2013Applicant: IBIDEN CO., LTD.Inventors: Hiroyuki SATO, Tomohiko MURATA, Fusaji NAGAYA
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Publication number: 20130292166Abstract: A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer.Type: ApplicationFiled: June 28, 2013Publication date: November 7, 2013Inventors: Masaru Takada, Fusaji Nagaya, Takao Okada, Tomohiko Murata
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Patent number: 8528200Abstract: A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.Type: GrantFiled: October 29, 2010Date of Patent: September 10, 2013Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Fusaji Nagaya, Takao Okada, Tomohiko Murata
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Publication number: 20130008702Abstract: A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser.Type: ApplicationFiled: September 14, 2012Publication date: January 10, 2013Applicant: Ibiden Co., Ltd.Inventors: Hiroyuki Sato, Tomohiko Murata, Fusaji Nagaya
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Patent number: 8304657Abstract: A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions.Type: GrantFiled: November 24, 2010Date of Patent: November 6, 2012Assignee: Ibiden Co., Ltd.Inventors: Hiroyuki Sato, Tomohiko Murata, Fusaji Nagaya
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Publication number: 20120043123Abstract: [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (50B) at 0.1 mm. In setting so, using thin core substrate 30 and interlayer insulation layers (50A, 50B) without core material, it is thought that warping does not occur in the printed wiring board.Type: ApplicationFiled: August 19, 2011Publication date: February 23, 2012Applicant: IBIDEN CO., LTD.Inventors: Masaru TAKADA, Fusaji Nagaya
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Patent number: 8110752Abstract: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed.Type: GrantFiled: March 30, 2009Date of Patent: February 7, 2012Assignee: Ibiden Co., Ltd.Inventors: Fusaji Nagaya, Nobuhisa Kuroda, Atsushi Awano
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Publication number: 20110232948Abstract: A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions.Type: ApplicationFiled: November 24, 2010Publication date: September 29, 2011Applicant: IBIDEN CO., LTD.Inventors: Hiroyuki Sato, Tomohiko Murata, Fusaji Nagaya
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Publication number: 20110147057Abstract: A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.Type: ApplicationFiled: October 29, 2010Publication date: June 23, 2011Applicant: IBIDEN CO., LTD.Inventors: Masaru Takada, Fusaji Nagaya, Takao Okada, Tomohiko Murata
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Publication number: 20090260853Abstract: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed.Type: ApplicationFiled: March 30, 2009Publication date: October 22, 2009Applicant: IBIDEN CO., LTD.Inventors: Fusaji Nagaya, Nobuhisa Kuroda, Atsushi Awano